Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints - PowerPoint PPT Presentation

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Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints

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Title: Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints


1
Fusion of Ultrasound and X-ray Data for Automatic
Inspection of Flip Chip and BGA Solder Joints
Ryan Yang 27/02/2009
2
Presentation Outline
  • Introduction
  • Acoustic Micro Imaging
  • X-ray Imaging
  • Image Registration
  • Image Fusion
  • Conclusion

3
Introduction
  • Solder joint reliability is a primary concern in
    the assembly of all Electronic components and
    products.
  • The importance of solder joint reliability became
    more emphasized in recent years as a result of
    three factors

1) The shift from leaded to lead-free solders in
semiconductor industry.
2) Shrinking in die size as well as solder balls
dimension.
3) The emergence of fine-pitched area array
packages that employ hundreds of solder joints
for electrical connection.
4
Introduction
5
Introduction
Hidden Solder Joints !?
6
Introduction
  • Acoustic Micro Imaging and X-ray imaging are
    principle Non-Destructive Testing techniques.
  • Both techniques can penetrate through the
    component to image the hidden solder joints.
  • X-ray inspection and AMI are complementary, each
    technology has distinct discriminating features
    and is good at inspecting certain defects.

7
Introduction
X-ray Inspection AMI Inspection
Voids Bridging / short Broken wire Missing Ball / Open Insufficient reflow Voids Delaminations Popcorn Crack Disbonds
  • AMI is an effective approach for detecting
    gap-type defects due to strong reflections of
    ultrasound at a solid-air interface.
  • X-ray inspection is able to identify volumetric
    defects which are hard to detect by AMI.

8
Introduction
  • Penetration of AMI through several layers of
    dissimilar materials is a big challenge for AMI,
    whereas X-ray penetration is good but without the
    discrimination accuracy.
  • Inspection of flip chip and BGA solder joints
    still remains a significant challenge to current
    testing techniques
  • FUSION of ultrasound and X-ray data for flip chip
    and BGA solder joints provides a novel way to
    interpret and analyse the image of the solder
    joints and potentially increases the resolution
    of very small dimensions

9
Introduction
  • When two complementary techniques are combined,
    they could be helpful in reinforcing certain
    evaluations, improving feature measurement
    resolution, technique can also applied to other
    fields.
  • Combining multiple image modalities to provide a
    single, enhanced picture is offering an added
    value and more informative data to the processor
    in order to developing an automated inspection
    system. (Smith, 2005)
  • In future, other techniques such as MRI. Infrared
    and AFM could be added.

10
Acoustic Micro Imaging
  • Acoustic Micro Imaging (AMI) is makes use of the
    properties of ultrasonic waves which range from
    5MHz to 400MHz.
  • Ultrasonic waves are generated by a piezoelectric
    transducer and propagate through an object.
  • When the wave travels through the object, it may
    be scattered, reflected and absorbed with respect
    to the differences between acoustic properties of
    materials.

11
Acoustic Micro Imaging
(Images adapted from Sonoscan Inc)
Different imaging modes are used for locating
certain defects.
12
Acoustic Micro Imaging
13
X-Ray Imaging
  • X-ray microscope imaging uses electromagnetic
    radiation in the soft X-ray band to produce
    images of very small objects.
  • When X-rays pass through a materials, it
    experience a variety of scattering interaction.
    These interactions lead to energy attenuation and
    the energy is detected by a Charge Coupled
    Devices (CCD).
  • X-rays imaging is a contrast imaging technique
    where high density materials lead to higher
    attenuation and hence produce darker image than
    those with less density or thickness.

14
X-Ray Imaging
15
Image Registration
  • The essential step in the fusion process is to
    bring the X-ray and C-scan images into spatial
    alignment, known as registration.
  • Image Registration is the process of overlaying
    two or more images of the same scene taken at
    different times, different viewpoints or
    different sensors.
  • The registration geometrically align two images
    or transform different set of data into one
    coordinate system.

16
Image Registration
  • Registration is have been widely used in

17
Image Registration
  • Open Source Registration tools
  • ITK-Insight software consortium
  • AIR- Roger P. Woods, M.D., UCLA School of
    Medicine
  • FLIRT FMRIB centre, University of Oxford
  • DROP - Technische Universität München (TUM) ,
    Germany
  • BunwarpJ - Arganda-Carreras , Universidad
    Autonoma de Madrid
  • No pre-processing and mainly developed for
    biomedical images

18
Image Registration
Figure 7 Feature Detection
Figure 8 Feature Matching (Images adapted from
Zitova,2003 )
19
Image Registration
Figure 9 Transformation Model Estimation
Figure 10 Image Resampling and
Transformation (Images adapted from Zitova,2003 )
20
Image Registration
Figure 11 Original Images
Figure 12 Processed Images
21
Image Registration
  • Point based methods and Least Square
    Approximation
  • The transformation that aligns the corresponding
    fiducial points will interpolate the mapping from
    these points to other points in the view.

22
Image Registration
  • Compute the weighted centroid of the fiducial
    configuration in each space
  • Compute the weighted fiducial covariance matrix

23
Image Registration
  • Perform singular value decomposition (SVD) of H
  • Finally,

24
Image Registration
Figure 14 LabVIEW Program for Computing Point
Based Method
25
Image Fusion
  • The term Image Fusion generally implies the
    intelligent combination of multi-modality sensor
    imagery for the purpose of providing an enhanced
    single view of a scene with extended information
    content. (Smith, 2005)
  • Fundamental Standard of fusion
  • The fused image should preserve all salient
    information of source images.
  • The fusion process should not introduce any
    artefacts or inconsistencies into the fused
    image.
  • Undesirable features (noise) should be suppressed
    in the fused image.

26
Image Fusion
Fusion method Description
Maximum amplitude Compare pixel value and extract maximum amplitude
Integration Use AND operator to fuse images
Weighted averaging Evaluate weight (probability) of defect detection based on knowledge of the images
Kalman filter Combine signals to enhance information by recursive filter
Bayesian analysis Decision making between hypothesis
Dempster-Shafer Decision making with belief intervals
Fuzzy Logic Fuse image follow fuzzy rules. Used when no mathematical relationship of images is available
Multi Resolution Method Extract the salient features at several levels of image decomposition from coarse to fine
Table 1 Table of Fusion Method
27
Image Fusion
Maximum Amplitude and Weighted Pixel Averaging
  • Common Fusion Algorithm approaches
  • Disadvantages
  • Also suppresses salient features
  • Low contrast
  • washed-out appearance
  • Advantages
  • Easy implemented
  • Fast to execute
  • Suppressing noise

28
Image Fusion
  • Multi-Resolution Methods
  • Extract the salient features at several levels of
    image decomposition from coarse to fine
  • Pyramidal Schemes
  • Gaussian Pyramid
  • Laplacian Pyramid
  • Wavelet Schemes
  • Colour Fusion
  • Advantages
  • Produce sharp, high-contrast images
  • Disadvantages
  • Reserve unwanted features
  • Further Assessment is required

29
Image Fusion
Pyramidal Schemes
30
Image Fusion
  • Reduce operation
  • Expand operation

31
Image Fusion
  • Wavelet Schemes
  • Discrete Wavelet Transform

32
Image Fusion
  • Rescaling is usually done in power of two

33
Conclusion
  • Increasing the Solder Joints reliability can
    increase the product life time and increases
    customer quality.
  • Reduces potential warranty costs.
  • Image fusion provide a new method to keep
    inspection of hidden solder joints in line with
    the rapid reduction in component size
  • Improves the ability to inspect smaller
    dimensions seen in newer packaging. May also
    improve the inspection of area array parts such
    as BGA which contain interposer
  • Image fusion remains a challenging technology and
    its application in electronic inspection is less
    mature and required additional research and
    assessment

34
References
ZHANG, G.M., HARVEY, D.M. and BRADEN, D.R. (2006)
X-ray Inspection and Acoustic Micro Imaging
Applied to Quality Testing of BGA Solder Joints
A Comparative Study, 2nd GERI Annual Research
Symposium GARS 2006, Liverpool, UK, 15th June
2006 KAPUR, A. and et al (2002) Fusion of
Digital Mammography with Ultrasound A phantom
Study, Proc of SPIE The international Society
of Optical Engineering, 4682, p.526-537 SEMMENS,
J.E. (2000) Flip Chis and Acoustic Micro
Imaging An overview of Past Application, Present
Status, and Roadmap for the Future. Proceedings
of ESREF conference, Dresden, Germany, October
2000 ZITOVA, B. and FLUSSER, J. (2003) Image
Registration Methods A Survey, Image and Vision
Computing vol. 21, p977-1000 SMITH, M.I. and
HEATHER, J.P. (2005) A review of image fusion
technology in 2005 Thermosense XXVII.
Proceedings of the SPIE, Vol. 5782, pp. 29-45
35
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