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Flip Chip Technology Market 2019 by Growth Analysis and Forecast to 2023


Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023. Get complete Report @ – PowerPoint PPT presentation

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Title: Flip Chip Technology Market 2019 by Growth Analysis and Forecast to 2023

Market Research Future
Flip Chip Technology Market Report- Forecast till
A flip chip is a typical semiconductor device
that has been designed to incorporate solder
bumps over the connection pads of the IC or
micro-electromechanical system (MEMS). This
methodology creates a very thorough and reliable
connection between the component and the
board. In the development of packaging of
electronics, the main aim is to lower cost,
increase the packaging density, and improve the
performance by maintaining or improving the
reliability of the circuits. The concept of the
flip-chip process where the semiconductor chip is
assembled face down onto the circuit board is
ideal for size considerations because there is no
extra area needed for contacting on the sides of
the component. The performance in high-frequency
applications is superior to other interconnection
methods because the length of the connection path
is minimized. Flip chip bumping is a vital step
in the process. The bump provides the necessary
electrical connection between the die and the
substrate, provides thermal conduction through
the two materials, acts as a spacer to prevent
electrical shorts and provides mechanical
support. https//www.marketresearchfuture.com/re
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Market Research Future
Regional Analysis In terms of geography, Asia
Pacific is anticipated to dominate the global
market over the forecast period. Countries like
China and India are the major manufacturing hubs
and are likely to provide abundant opportunities
for the growth of the flip chip technologies. As
a result, the presence of major companies in this
sector such as Samsung and Sony are driving the
flip chip technology market in the APAC region.
North America holds the second largest market
share of the global flip chip technology market.
Due to the presence of major players in the
regions and high investments in the research and
development activities are expected to drive the
market. Access Full Report _at_
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Market Research Future
Market Segments The global flip chip technology
market is segmented on the basis of wafer bumping
process, packaging technology, packaging type,
product, application, and region. On the basis of
the wafer bumping process, the segment is further
classified into copper (CU) pillar, lead-free,
Tin-lead eutectic solder and gold stud plated
solder. On the basis of the packaging technology,
the market is further classified into 2D, 2.5D,
and 3D packaging technology. On the basis of the
packaging type, the market is further classified
into FC BGA (Flip Chip Ball Grid Array), FC PGA
(Flip Chip Pin Grid Array), FC LGA (Flip Chip
Land Grid Array), FC QFN (Flip Chip Quad Flat
No-Lead), FC SIP (Flip Chip System-In-Package),
and FC CSP (Flip Chip-Chip-Scale Package). On the
basis of the product the segment is further
classified into LED, CMOS image sensor, CPU, RF,
Analog, Mixed Signal, and Power IC, SoC and
others. Flip chip technology is widely used in
many areas such as consumer electronics,
automotive, telecommunications, industrial,
medical devices, military and aerospace and
others. Request a Sample Report _at_
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44 208 133 9349 (UK)
Market Research Future
Major Players in this Research Some of the
major players in Flip Chip Technology market are
Samsung Group (South Korea), Intel Corporation
(U.S.), Global Foundries (U.S.), UMC (Taiwan),
ASE, Inc. (Taiwan), Amkor Technology (U.S.),
STATS ChipPAC (Singapore), Powertech Technology
(Taiwan), and STMicroelectronics (Switzerland),
Texas Instruments (U.S.) among others. Get
More Information _at_ https//www.marketresearchfutur
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Market Research Future
About Market Research Future At Market Research
Future (MRFR), we enable our customers to unravel
the complexity of various industries through our
Cooked Research Report (CRR), Half-Cooked
Research Reports (HCRR), Raw Research Reports
(3R), Continuous-Feed Research (CFR), and Market
Research Consulting Services. In order to stay
updated with technology and work process of the
industry, MRFR often plans conducts meet with
the industry experts and industrial visits for
its research analyst members. Know more
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