Flip Chip Technologies Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024 - PowerPoint PPT Presentation

Loading...

PPT – Flip Chip Technologies Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024 PowerPoint presentation | free to download - id: 870e8c-YzBhN



Loading


The Adobe Flash plugin is needed to view this content

Get the plugin now

View by Category
About This Presentation
Title:

Flip Chip Technologies Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024

Description:

Flip chip is the technique for interconnecting semiconductor devices, such as IC chips, to external circuitry with solder bumps that have been dumped onto the chip pads. Flip chip is a semiconductor interconnecting device widely used in various electronic products such as PCs, medical devices and smartphones among others. Some of the major benefits of flip chip are increased packaging density, reduced size & thickness, lower cost, and improved performance of the chip, improved thermal capabilities, and improved reliability. – PowerPoint PPT presentation

Number of Views:3

less

Write a Comment
User Comments (0)
Transcript and Presenter's Notes

Title: Flip Chip Technologies Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024


1
Flip Chip Technologies Market Global Scenario,
Market Size, Outlook, Trend and Forecast, 2015
2024
Yogesh Godse Director help_at_variantmarketresearch.
com
2
Description- Flip Chip Technologies Market
  • Flip chip is the technique for interconnecting
    semiconductor devices, such as IC chips, to
    external circuitry with solder bumps that have
    been dumped onto the chip pads. Flip chip is a
    semiconductor interconnecting device widely used
    in various electronic products such as PCs,
    medical devices and smartphones among others.
    Some of the major benefits of flip chip are
    increased packaging density, reduced size
    thickness, lower cost, and improved performance
    of the chip, improved thermal capabilities, and
    improved reliability.  
  • Major driving factors for flip chip technologies
    market is an emerging internet of things and flip
    chip is technologically superior to the
    traditional wire bond electrical connection which
    is another driver for this market. However, large
    initial investment required for setting up new
    manufacturing plant and less availability of
    customization options are major restraining
    factors for this market. Increasing growth of
    demand of sensors in various electronics devices
    such as smart phones and personal computers is an
    opportunity factor for this market.

Variant Market Research help_at_variantmarketresear
ch
3
Flip Chip Technologies Market
Variant Market Research help_at_variantmarketresear
ch
4
Flip Chip Technologies Market
  • The flip chip technologies market is segmented
    into packaging technology, bumping technology,
    industry and geography. On the basis of packaging
    technology, the flip chip technologies market is
    segmented into 2D IC, 2.5D IC and 3D IC. On the
    basis of bumping technology, the market is
    segmented into copper pillar solder bumping, gold
    bumping and others. Moreover, On the basis of
    industry type, this market is segmented into
    automotive transport, industrial, electronics,
    IT telecommunications, healthcare and others.
  • The geographic segment includes North America,
    Europe, Asia-Pacific and RoW. The U.S., Mexico
    and Canada are covered under North America
    wherein Europe covers France, Germany, UK, Spain
    and rest of Europe. Asia-Pacific covers China,
    India, Japan, South Korea and Rest of Asia
    Pacific. Rest of the World (RoW) covers South
    America, Middle East and Africa.
  • To Know More About This Report, Visit Here
    http//bit.ly/2qSCpDO

Variant Market Research help_at_variantmarketresear
ch
5
Top Manufacturers
  • Samsung Electronics Co.,
  • ASE group,
  • GlobalFoundries,
  • Powertech Technology,
  • UMC,
  • Intel Corp,
  • STATS ChipPAC,
  • Amkor Technology,
  • TSMC among others

6
Scope of Flip Chip Technologies Market
  • Packaging Technology Segments
  • 2D IC
  • 2.5D IC
  • 3D IC
  • Bumping Technology Segments
  • Copper pillar solder bumping,
  • Gold bumping
  • Others

7
Scope of Flip Chip Technologies Market
  • Bumping Technology Segments
  • Automotive transport
  • Industrial
  • Electronics
  • IT telecommunications
  • Healthcare
  • Others

8
Scope of Flip Chip Technologies Market
  • Geographical Segments
  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others

9
Scope of Flip Chip Technologies Market
  • Geographical Segments
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Others
  • RoW
  • South America
  • Middle East
  • Africa

10
Contact Us
  • VARIANT MARKET RESEARCH LLP?Web https//www.vari
    antmarketresearch.com
  • USA Office649 Mission St., 5th Floor, San
    Francisco, CA 94105, United States.Tel
    1-415-680-2785Fax 1-415-680-2786Email help_at_v
    ariantmarketresearch.com Orsales_at_
    variantmarketresearch.com
  • India Office (Corporate Headquarter)Office No.
    FL No.7, Prakash Developers, Survey no 34/A5,
    Wadgaon Sheri, Nagar Road, Pune 411014Tel 91
    20 65337795

Source Variant Market Research
11
Thank You
  • Follow us

Source Variant Market Research
_at_vmrreports
variantmarketresearch
variant-market-research
Variant Market Research
About PowerShow.com