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APV settings at cold temperatures

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APV settings at cold temperatures Objective: provide recommendations for APV I2C settings for cold operation, for test beam and eventually CMS Outline: – PowerPoint PPT presentation

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Title: APV settings at cold temperatures


1
APV settings at cold temperatures
Objective provide recommendations for APV
I2C settings for cold operation, for
test beam and eventually CMS Outline what
are the temperature effects and where do they
come from? experimental method used to
measure and compensate for T effects
recommendations from results of measurements on 4
APV TIB module Mark Raymond, Imperial
College
2
APV bias settings
APV analogue chain
VPSP
VFP
VFS
IPRE IPCASC
IPSF
ISSF
IPSP
ISHA
IMUXIN
Reference current circuit
all analogue bias currents on chip derived from
one master reference current (provides reference
current to bias gen.) Iref depends on Vt and R
(not V250) but Vt and R have T dependence as
T? , Vt ? 1mV / OC R ? 0.15 / OC so Iref ?
(simulation -gt 0.233 / OC)
3
Temperature effects on APV
gain
  • T reduces -gt master Iref increases -gt all
    I2C bias currents increase -gt chip power
    increases
  • reduce bias currents (I2C parameters
    beginning with I) to compensate
  • simple method adjust each parameter by same
    factor and round to nearest integer
  • Other T effects
  • T reduces -gt m increases gt gm
    increases
  • gt circuit speed increases, pulse shape changes
    and needs re-tuning
  • APV gain also depends on R at MUX I/P
    stage, so gain goes up as T reduces

4
Experimental setup
environmental chamber flushed with nitrogen
VUTRI card
TIB module
5
Experimental setup
Al plate
sensor
peltier
6
5
hybrid
2
Pt100 temperature sensors
1
peltier
hybrid in contact with Al plate (thermal
grease) 2 peltier elements cool plate Pt100
sensor measures hybrid temperature (where APVs 3
and 4 would be if 6 chip module) another Pt100
measures Al plate underside temperature
hybrid temp. 3O gt Al plate temp. temperature
stability 2O
6
Experimental setup
peltier
90Sr source
Pt100
hybrid in thermal contact with Al plate
peltier
fan-cooled heatsink
scintillator beneath sensor
7
Method
  • 1) wait for environment to stabilise at target
    hybrid temperature
  • 2) adjust peltier current to fine tune hybrid
    temperature to target value
  • 3) tune I2C Ibias parameters to get same V250
    and V125 currents as for standard values _at_ 30O
  • 4) tune ISHA to achieve close approx. to 50 ns
    peak mode pulse shape
  • average of 16 pulse shapes corresponding to one
    test pulse line
  • pulse shape tuned by eye
  • not found necessary to alter VFS setting
    (or VPSP)

30
-20
peak ideal CR-RC decon
8
Pulse shapes
Pulse shapes for all temperatures after tuning
for correct power and pulse shape VFS 70 for
all temperatures ICAL80 in all cases, but
output signal amplitude increases as T?
30 1.00
20 1.04
10 1.08
0 1.12
-10 1.17
-20 1.21
relative test pulse height dependence on T
ICAL derived from master ref. but gain also
increases as T? so two contributing effects here
9
Peak deconvolution pulse shapes
ICAL 0 -gt 240 in steps of 40 (1 mip 60 ADC
units)
10
Chip-to-chip variation on this hybrid
room temperature measurement hybrid at 30O same
I2C parameters for all 4 chips (including VFS and
ISHA) small ICAL response differences here (but
absolute value of test charge subject to chip to
chip variation) and small pulse shape
differences but these chips will have
been picked from same wafer (probably same
location on wafer) how will pulse shape
vary across full production? -gt look at wafer
probe data
11
Wafer to wafer pulse shape variation
Peak
Deconvolution
peak and deconvolution mode pulse shapes are
acquired for every chip at wafer test time (for
same I2C parameters) example data here (presented
at LECC02) for lots 1 to 5 (see
http//www.hep.ph.ic.ac.uk/dmray/pdffiles/APV_LEC
C02_HEP.pdf) plots show pulse shapes for all KGD
normalised to max. pulse height
Lot 1
Lot 1
conclusion one set of start-up I2C parameters
will suit all chips, at least for a particular
module type fine tuning can then follow later
Lot 4
Lot 2
Lot 2
Lot 4
Lot 5
Lot 3
Lot 3
Lot 5
12
Beta pulse height spectra
Peak Mode
Deconvolution
90Sr source, sensor HT 250V strip signal included
if neighbour signal lt 3 x noise S/N values
quoted for most probable signal
best way to measure gain changes with T
gain increase, 30 -gt -20 7 (7.5
expected from gain resistor) S/N increase
13 peak mode, 8 deconvolution not quite the
same but significant errors here (statistics and
details of pulse shape)
13
Beta pulse height spectra
Peak Mode
Deconvolution
14
Recommended I2C parameters vs. T
30O 20O 10O 0O - 10O - 20O

IPRE 98 96 93 92 85 85
IPCASC 52 51 49 49 45 45
IPSF 34 34 33 32 30 30
ISSF 34 34 33 32 30 30
IPSP 55 54 53 52 48 48
IMUXIN 34 34 33 32 30 30
VFP 30 30 30 30 30 30

VPSP 43 43 43 43 43 43
ISHA 46 45 38 32 30 30
VFS 70 70 70 70 70 70

total power mW/module 1465 1480 1473 1479 1455 1475
power/APV 366 370 368 374 364 368
all bias current params (those starting with
I) adjusted by same factor to achieve same
total module power at each temperature over
10O range power variation small ( few ) so not
necessary to re-tune parameters for variations at
this level slight over-adjustment between 0 -gt
-10 so no further adjustment needed for
-20 power/APV total power / 4 but this
also includes APVMUX, DCU and PLL power (not
possible to separate out) recommend values in
10O column for CMS operation Note this
doesnt apply to VPSP, ISHA and VFS. ISHA and VFS
will depend on sensor type and some chip to chip
variation can also be expected
15
Digital header amplitude
digital header (and tick mark) amplitude varies
with T because levels are set by current ref.
circuit similar to that for bias generator
dig. head amp.
30O 20O 10O 0O - 10O - 20O
relative dig. head amplitude 1.00 1.02 1.05 1.07 1.09 1.11
16
VPSP setting
100
VPSP setting adjusts analogue baseline
position works by introducing DC voltage offset
at APSP O/P which in turn produces DC offset
current flowing in the MUX stages
50
analogue baseline
0
choice of VPSP for this study no major
movement in analogue baseline observed with
temperature same value (43) used
throughout sets baseline at 25 relative to
dig. head amp. allows plenty of room for
signals and negative CM excursions note
power penalty if set higher than necessary
e.g. 7 power increase if move from 25 to
50 level
module power baseline posn
17
What happens if no I2C change with T?
standard I2C settings used for all
temperatures module power increases by 10
(30 -gt - 20) test pulse amplitude increases gm
increase in shaper and preamp -gt rise-time faster
as T decreases deconvolution pulse shape
sensitive to rise-time
18
T measurement using DCU
DCU ADC value shows linear dependence on hybrid
temperature measured with Pt100 9.65 slope value
similar to 9.22 quoted in DCU manual clearly no
problem to use DCU to measure hybrid temp. if
calibration factor known
19
Summary
recommendations provided for APV I2C settings for
low temperature operation based on studies
of 4 chip TIB module hybrid temperature used
as reference provides starting point for module
operation but free parameters still exist
VPSP sets analogue baseline. remember power
penalty if set high ISHA/VFS tune pulse
shape some chip to chip variation will be
different for different sensor types results
here consistent with previous studies on single
chips presented CMS week in Catania (June
2001, E. Noah) note available with more
details http//www.hep.ph.ic.ac.uk/dmray/pd
ffiles/cold_APV_params.pdf
(preliminary version already circulated) ongoing
work verify parameter choice for 6 chip TIB
module expect to be same as 4 chip version
look at other module types old TOB module
available
- 10O
IPRE 85
IPCASC 45
IPSF 30
ISSF 30
IPSP 48
IMUXIN 30
VFP 30
VPSP 43
ISHA 30
VFS 70
20
Supply currents vs. T if no I2C change
standard I2C settings used for all
temperatures I125 shows 16 increase, 40 -gt
-20 (close to 14 simulated) I250 total
includes digital and analogue I250 digital only
measured by switching bias off in mode registers
small 3.5 increase, 40 -gt -20 I250
analogue only I250 total I250 digital only
21 increase (gt I125 but probably includes
some contribution from analogue baseline
shift) module power 40 -gt -20
1.43 W -gt 1.56 W 10 increase but
extra power also dissipated in cables
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