The three new automotive DirectFET2 devices complete the 40V heavy load/motor control family delivering exceptional power density, dual-sided cooling and minimal parasitic inductance and resistance for heavy load applications, including Electric Power - PowerPoint PPT Presentation

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The three new automotive DirectFET2 devices complete the 40V heavy load/motor control family delivering exceptional power density, dual-sided cooling and minimal parasitic inductance and resistance for heavy load applications, including Electric Power

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Power MOSFETs PRESS RELEASE DATA ... including Electric Power Steering (EPS), power supplies, battery switches on hybrid electric vehicles and Integrated Starter ... – PowerPoint PPT presentation

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Title: The three new automotive DirectFET2 devices complete the 40V heavy load/motor control family delivering exceptional power density, dual-sided cooling and minimal parasitic inductance and resistance for heavy load applications, including Electric Power


1
Expansion of Automotive DirectFET 2 Power
MOSFETs
PRESS RELEASE
DATA SHEET
The three new automotive DirectFET2 devices
complete the 40V heavy load/motor control family
delivering exceptional power density, dual-sided
cooling and minimal parasitic inductance and
resistance for heavy load applications, including
Electric Power Steering (EPS), power supplies,
battery switches on hybrid electric vehicles and
Integrated Starter Alternators (ISA) on micro
hybrid vehicles.
HI-RES GRAPHIC
Automotive HOME PAGE
  • Features
  • AUIRF7738L2 and AUIRF7737L2
  • Exceptionally low RDS(on) and targeted for heavy
    load applications where power density and
    efficiency are desirable
  • Dual sided cooling
  • PCB footprint is 60 smaller than a D2Pak
  • AUIRF7736M2
  • Low RDS(on) and targeted for heavy load
    applications where power density and efficiency
    are desirable
  • Dual sided cooling
  • PCB footprint is the same size as a 5x6 PQFN or
    SO-8
  • Complements the AUIRF7737, 38M2 and 39L2 devices
    with a slightly higher RDS(on) for more cost
    sensitive lower power applications
  • Advantages
  • The AUIRF7737L2, AUIRF7738L2 and AUIRF7736M2
    devices offer overall system level size and cost
    reductions along with superior performance and
    efficiency when compared to traditional standard
    plastic packaged components.
  • Featuring a PCB footprint 60 percent smaller than
    a D2Pak, the AUIRF7738L2 and AUIRF7737L2 devices
    deliver exceptionally low on-state resistance
    while the AUIRF7736M2 features a PCB footprint
    the same size as a 5x6mm PQFN or SO-8 package
    with low RDS(on) of 2.5mOhm, making it suitable
    for more cost sensitive lower power applications.
  • The AUIRF7737L2 and AUIRF7738L2 share a common
    Large Can PCB footprint with the previously
    released AUIRF7739L2 making the devices highly
    desirable components where a scalable system
    design is required.

October 2010
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