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GLAST LAT Project PDU/GASU MRR, February 4, 2005. 4.1.7 DAQ & FSW V3 1 ... also suggested that gold foil or indium foil be used to assure reproducible heat ... – PowerPoint PPT presentation

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Title: PDU%20


1
PDU GASU Manufacturing Readiness Review (MRR)
GLAST Large Area Telescope B. Estey, G.
Haller, D. Marsh SLAC haller_at_slac.stanford.edu (
650) 926-4257 esteyb_at_slac.stanford.edu (650)
926-8531 marsh_at_slac.stanford.edu
2
Contents
  • Overview (G. Haller)
  • DPU GASU Module Description
  • Changes since CDR
  • Design and Test Documentation
  • Engineering Module Validation
  • Production (B. Estey)
  • Parts, Materials Processes
  • Procurement Status
  • Manufacturing Facilities
  • Manufacturing Flow Plan
  • Quality Assurance Plan
  • Configuration Management
  • Manufacturing Issues/Concerns
  • Quality Assurance (Marsh)
  • Quality Assurance Plan

3
PDU GASU MRR Overview
GLAST Large Area Telescope G.
Haller SLAC haller_at_slac.stanford.edu (650)
926-4257
4
LAT Electronics
TKR Front-End Electronics (MCM)
ACD Front-End Electronics (FREE)
TKR
CAL Front-End Electronics (AFEE)
16 Tower Electronics Modules Tower Power
Supplies
CAL
Global-Trigger/ACD-EM/Signal-Distribution Unit
  • 3 Event-Processor Units (EPU) (2 1 spare)
  • Event processing CPU
  • LAT Communication Board
  • SIB
  • Spacecraft Interface Units (SIU)
  • Storage Interface Board (SIB) Spacecraft
    interface, control telemetry
  • LAT control CPU
  • LAT Communication Board (LCB) LAT command and
    data interface
  • Power-Distribution Unit (PDU)
  • Spacecraft interface, power
  • LAT power distribution
  • LAT health monitoring

Primary Secondary Units shown in one chassis
5
PDU GASU Mounted on LAT
GASU
PDU
6
Power Distribution Module (PDU)
EM PDU enclosure with primary/redundant PDU
circuit cards, no coating/staking
  • Primary and Redundant Circuits in one Enclosure
  • Receives Primary and Redundant 28-V from
    spacecraft
  • Each, primary and redundant PDU can select
    between primary and redundant spacecraft power
  • Filters 28V
  • Turns on/off 28V to 16 towers and 3 EPUs under
    program control
  • Protects PDU and down-stream circuits from
    over-current and under-voltage
  • Over-current via poly-switches
  • Under-voltage via custom circuit in each power-on
    branch
  • Receives command/clock from GASU
  • Digitizes voltages/temperatures from gt 150
    sources
  • Includes temperatures from radiators, GRID used
    for thermal control
  • Reads back data to SIU via GASU
  • Provides PDU DAQ voltage and temperature analog
    data to spacecraft for monitoring

7
GASU
EM PDU enclosure with primary/redundant PDU
circuit cards, no coating/staking
  • Primary and Redundant Circuits in one Enclosure
  • Contains two types of circuit card assemblies
  • GASU Power Supply CCA
  • GASU DAQ Board CCA
  • GASU Power Supply
  • Receives 28-V supply voltages for
  • Primary and redundant DAQ board, generates 3.3V
    and 2.5v
  • ACD FREE cards
  • Filtering for 28-V
  • 3.3V regulation
  • GASU DAQ Board
  • Contains 9 FPGAs
  • Includes Command Response Unit, Fan-out and
    fan-in of commanding to 16 TEMs, PDU, EPUs, ACD
  • Includes Global Trigger Logic
  • Includes LAT Event-Builder Logic
  • Includes command/control/read-back for ACD
    sub-system
  • Includes power-control for ACD FREE Boards

8
Changes since CDR
  • PDU
  • Creation/modification of PDU FPGA code
  • Power-on circuit was modified to include
    under-voltage shut-off to protect MOS power-on
    switches
  • In-rush current limits to loads modified
  • GASU
  • Code in 9 FPGAs were modified/finalized and bugs
    fixed
  • ACD power-on low-frequency system clock selection
    added
  • ACD power circuits replaced with circuit to
    protect for over-current and updated ICD
    interface voltage/current requirements

9
Power Peer Review RFA Status
  • RFA 1
  • Request
  • Complete part stress and derating analysis
  • Response
  • The Parts Stress and Derating Analysis has been
    completed (see document list on a later slide)
  • RFA 2
  • Request
  • Need to get SEU report on Maxim parts out as soon
    as possible.  Issue is not only LET but SET
    effects since transients can affect the power
    supply outputs
  • Response (NASA)
  • The SEU testing on the Maxim parts was done in
    February 2004. The devices exhibited no evidence
    of SET or SEL to the highest fluence tested. SEUs
    were observed but at a level orders of magnitudes
    lower than required.

10
Power Peer Review RFA Status (Continued)
  • RFA 3
  • Request
  • Need to get AR-461 filter schematic plus
    schematic of 28-28 supply on spacecraft.  Need to
    develop model of power and ground distribution to
    verifiy filter performance relative to 100 kHz
    noise.  Damping of the entire filter network
    should also be verified to assure that an
    interactive among the many identical filters
    cannot occur.
  • Response (SLAC)
  • The PRU Road Show exercised the Spacecraft PRU
    and the LAT interface and tested the
    performance. The results are
  • (1) The interface between the Spacecraft and
    LAT is understood (pinouts and signal
    definitions) .
  • (2) The SIU, VCHP and DAQ feeds are stable under
    full load.
  • (3) The conducted EMI is within the requirement.
  • (4) The Calorimeter - Tracker mini-tower performs
    properly with the spacecraft PRU.
  • (5) There were no significant transients when the
    LAT feed is turned off when fully powered .
  • The test results are documented in LAT-AM-04670.

11
Power Peer Review RFA Status (Continued)
  • RFA 4
  • Request
  • T0-220 Maxim regulators have their mounting tabs
    connected to ground.  This has the potential of
    creating an undesirable ground path with
    associated noise problems.  The optimum grounding
    solution for this particular configuration is to
    connect all elements to chassis and use the
    structure as the primary ground return (as
    diagrammed on the conference room whiteboard). 
    It is strongly recommended that this approach be
    taken to assure proper instrument performance
    despite the fact that the approach is slightly
    unorthodox.  As a second issue, it is also
    suggested that gold foil or indium foil be used
    to assure reproducible heat sink contact for the
    regulators.  The grease or no intermediate
    material approaches are strongly recommended
    against.
  • Response (SLAC)
  • 1) The grounding approach defined in the RFA is
    the current implementation. The grounding tabs on
    the Maxim regulators are mounted directly to
    the enclosure, and the enclosure used as the
    primary ground return
  • (2) The regulators are mounted using a thermally
    conductive adhesive (CV-2946 Nusil). Tests on the
    EM hardware showed minimal temperature rise (a
    few degrees) across the interface.

12
Power Peer Review RFA Status (Continued)
  • RFA 5
  • Request
  • Maxim part screening must be carefully done to
    assure that the testing provides valid
    verification reliability.  Documented methods by
    Maxim are for static burn-in only (diffusion
    based issues) and do not represent the actual
    operational case planned for GLAST.  In that the
    GLAST application is actually fairly stressful
    AND uses the part outside of its normal
    operational range (for the 1.5 volt output case),
    it is suggested that the screening and qual test
    be configured to verify the 1.5 volt
    configuration since it is most stressful.  Note
    that great care must be taken with the layout and
    instrumentation to assure that the setup does not
    accidentally result in part damage.
  • Response (NASA/SLAC)
  • Parts were screened and qualification testing
    performed at GSFC.

13
Power Peer Review RFA Status (Continued)
  • RFA 6
  • Request
  • The 28 volt converter planned for use by Spectrum
    Astro, uses a step-up transformer.  A quick
    calculation indicates that the step-up ratio is
    probably 1.5 or more.  therefore, a failure where
    the control loop goes open while the bus is at 33
    volts, could put as much as 50 volts on the input
    to the power supply regulators.  Such a condition
    could have catastrophic consequences to the
    instrument such that system level redundancy
    could be compromised due to progagation of the
    failure across interfaces.  Therefore, it is
    strongly recommended that overvoltage protection
    be implemented to assure protection of the
    hardware plus protection against failure
    propagation.
  • Response (NASA)
  • Lambda identified a credible single point failure
    that could cause an overvoltage condition. 
    Spectrum added a transorb across the output of
    each 28 volt feed to prevent the voltage from
    exceeding 38 V.  A test was run at Lambda at the
    end of August to verify the design.  The
    preliminary results show that the voltage never
    exceeded 38 V.  Spectrum Astro is reviewing the
    test results and performing additional studies to
    ensure the test results are analytically
    consistent with the circuitry.

14
Power Peer Review RFA Status (Continued)
  • LAT CDR RFA 6 Response
  • Action Requested
  • What electrical derating criteria was used on the
    ASICs? Define and describe.
  • Supporting Rationale
  • ASICs are required to be derated by 20 per NASA
    SOP for ASICs. The parts would represent a
    higher risk to the mission if they were not
    derated for their application.
  • Response
  • The electrical derating criteria for the ASICs
    was based on EEE-INST-002 Instructions for EEE
    Parts Selection, Screening, Qualification, and
    Derating (NASA/TP-2003-212242) Section M4
    Microcircuits, Plastic Encapsulated Table 4
    Microcircuit Derating Requirements for PEMs.
  • Maximum Supply Voltage for Digital PEMs use the
    following formula for derating Vn.r. 0.5
    (Vmax.r. Vn.r.)
  • Where Vn.r. is the nominal rated power supply
    voltage
  • Vmax.r. is the maximum rated power supply
    voltage
  • For the GAFE, GARC, GCFE, GCRC, GCCC, GTCC, and
    GLTC --
  • Vn.r. is 3.3v
  • Vmax.r. is 4.5v
  • Maximum Supply Voltage is 3.9 v
  • The maximum power supply for the system is 3.6v
    therefore, the derating requirement is met.
  • For the GTFE and GTRC --
  • Vn.r. is 2.6v
  • Vmax.r. is 4.5v
  • Maximum Supply Voltage is 3.55 v

15
ELX Peer Review RFA Status
  • RFA 23
  • Request
  • In order to understand EMI, perform SPICE
    analysis of the LAT internal power distribution
    bus. Include models for S/C DC/DC converters, all
    filters, and LAT DC/DC converters. Use model to
    establish EMI self-compatibility, i.e. will the
    internal EMI sources cause problems. Look at
    inrush issues as well
  • Response
  • We are not able to perform SPICE level
    simulations due to the lack of SPICE models for
    the converter hybrids. However no issues were
    found in tests performed (PRU road-show and
    test-bed). EMI will be tested on the
    qualification models.

16
ELX Peer Review RFA Status (Continued)
  • RFA 24
  • Request
  • For the CDR, revise the grounding scheme chart to
    make it more clear and accurate.
  • Response
  • Was done for CDR

17
GASU Documents
  GASU
LAT-DS-01611-09 GASU Assembly Signed Off
LAT-PS-03081-01 Statement of Work, GASU Assy Signed Off
LAT-DS-02504-02 GASU Box, Machining Signed Off
LAT-DS-01488-06 GASU Box Signed Off
LAT-DS-02950-02 GASU Box, Test Signed Off
LAT-DS-01489-02 GASU Lid Signed Off
LAT-DS-02951-02 GASU Lid, Test Signed Off
LAT-DS-01490-06 GASU Connector Plate 1 Signed Off
LAT-DS-01491-06 GASU Connector Plate 2 Signed Off
LAT-DS-01492-06 GASU Connector Plate 3 Signed Off
LAT-DS-01493-06 GASU Connector Plate 4 Signed Off
LAT-DS-01494-01 Spider, GASU Signed Off
LAT-TD-03724-01 FPGA Theory of Operation, AEM Signed Off
LAT-DS-02543-01 Schematic Diagram, GASU Box Assembly Signed Off
LAT-TD-04381-01 GASU Safe to Mate Test Procedure Draft-In Work
LAT-DS-01718-04 Circuit Card Assembly, GASU DAQ Signed Off
LAT-DS-01719-04 Printed Wire Board, GASU DAQ CCA Signed Off
LAT-DS-02874-04 PWB Fab, Loading and Assembly Signed Off
LAT-DS-01720-01 Schematic Diagram, GASU DAQ CCA Signed Off
LAT-TD-02644-01 Bill of Materials, GASU CCA Signed Off
LAT-TD-04260-02 Electrical Interface Continuity and Isolation Test, GASU Signed Off
LAT-TD-04382-01 Interface Verification Test Procedure, GASU Draft-In Work
LAT-TD-01823-01 Parts Stress Worst Case Analysis, GASU CCA Signed Off
18
GASU (Cont)
LAT-DS-03898-01 FPGA, GASU CRU Signed Off
LAT-DS-04407-01 Program, GASU CRU FPGA Signed Off
LAT-TD-03697-01 VHDL, GASU-CRU FPGA Signed Off
LAT-DS-05161-01 Design Database for GASU CRU FPGA Signed Off
LAT-DS-03899-01 FPGA, GASU AEM Signed Off
LAT-DS-04406-01 Program, GASU AEM FPGA Signed Off
LAT-TD-03698-01 VHDL, GASU-AEM FPGA Signed Off
LAT-DS-05162-01 Design Database for GASU AEM FPGA Signed Off
LAT-DS-03900-01 FPGA, GASU TAM Draft-In Work
LAT-DS-04408-01 Program, GASU TAM FPGA Draft-In Work
LAT-TD-03699-01 VHDL, GASU-TAM FPGA Signed Off
LAT-DS-05163-01 Design Database for GASU TAM FPGA Draft-In Work
LAT-DS-03901-01 FPGA, GASU Scheduler Draft-In Work
LAT-DS-04409-01 Program, GASU Scheduler FPGA Draft-In Work
LAT-TD-03700-01 VHDL, GASU-Scheduler FPGA Signed Off
LAT-DS-05164-01 Design Database for GASU Scheduler FPGA Draft-In Work
GASU Trigger-related FPGAs (Scheduler, TAM,
ROIA, ROIB) in test, then release (estimate 7
days to go)
19
GASU (Cont)
LAT-DS-03902-01 FPGA, GASU ROIa Draft-In Work
LAT-DS-04410-01 Program, GASU ROIa FPGA Draft-In Work
LAT-TD-03701-01 VHDL, GASU-ROIa FPGA Signed Off
LAT-DS-05165-01 Design Database for GASU ROIa FPGA Draft-In Work
LAT-TD-03923-01 FPGA, GASU ROIb Draft-In Work
LAT-DS-04412-01 Program, GASU ROIb FPGA Draft-In Work
LAT-TD-03924-01 VHDL, GASU-ROIb FPGA Draft-In Work
LAT-DS-05166-01 Design Database for GASU ROIb FPGA Draft-In Work
LAT-DS-03903-01 FPGA, GASU EBMOUT Signed Off
LAT-DS-04411-01 Program, GASU EBMOUT FPGA Signed Off
LAT-TD-03702-01 VHDL, GASU-EBMOUT FPGA Signed Off
LAT-DS-05167-01 Design Database for GASU EBMOUT FPGA Signed Off
LAT-DS-03904-01 FPGA, GASU EBMin_A Signed Off
LAT-DS-04413-01 Program, GASU EBMin_A FPGA Signed Off
LAT-TD-03703-01 VHDL, GASU-EBMin_A FPGA Signed Off
LAT-DS-05168-01 Design Database for GASU EBMin_A FPGA Signed Off
LAT-DS-03905-01 FPGA, GASU EBMin_B Signed Off
LAT-DS-04414-01 Program, GASU EBMin_B FPGA Signed Off
LAT-TD-03704-01 VHDL, GASU-EBMin_B FPGA Signed Off
LAT-DS-05169-01 Design Database for GASU EBMin_B FPGA Signed Off
20
GASU (Cont)
  GASU Internal Harness Assemblies
LAT-DS-03552-05 Harness Assembly, GASU-ACD-2092 Signed Off
LAT-DS-03553-05 Harness Assembly, GASU-SC-2093 Signed Off
LAT-DS-03554-06 Harness Assembly, GASU-PDU-2103 Signed Off
LAT-DS-03556-06 Harness Assembly, GASU-SIU/EPU-2104 Signed Off
LAT-DS-03558-05 Harness Assembly, GASU-TEM_EVEN/ODD Signed Off
LAT-DS-03739-02 Support, Cable Harness, GASU Signed Off
LAT-DS-03849-01 Support No.2, Cable Harness, GASU Signed Off
LAT-PS-04872-01 SOW, Internal Harness, GASU, with Glenair Connector Signed Off
LAT-PS-04873-01 SOW, Internal Harness, GASU, without Glenair Connector Signed Off
21
PDU Documents
  Power Distribution Unit
LAT-DS-01696-02 Assembly, Power Distribution Unit Signed Off
LAT-PS-04171-01 Statement Of Work, PDU Signed Off
LAT-DS-02911-01 PDU Box Machining Signed Off
LAT-DS-01846-05 PDU Box Signed Off
LAT-DS-02948-03 PDU Box, Test Signed Off
LAT-DS-01847-04 PDU Lid Signed Off
LAT-DS-02949-03 PDU Lid, Test Signed Off
LAT-DS-01848-08 Connector Plate Left Signed Off
LAT-DS-01849-08 Connector Plate Right Signed Off
LAT-DS-02313-01 Screw Assembly, Tube Signed Off
LAT-DS-02228-02 Schematic Diagram, PDU Assembly Signed Off
LAT-DS-02125-01 Circuit Card Assembly, PDU Signed Off
LAT-DS-03621-01 Toroid Clamp - Base, PDU Signed Off
LAT-DS-03622-01 Toroid Clamp - Top, PDU Signed Off
LAT-DS-03789-01 Cable Management Bracket, Long Signed Off
22
PDU (Cont)
LAT-TD-01809-03 Parts Stress/ Worst Case Analysis Signed Off
LAT-TD-01543-02 Specification, PDU Programming ICD Being revised
LAT-TD-01884-01 VHDL, FPGA, PDU Signed Off
LAT-DS-03920-01 FPGA, Programmed, PDU Signed Off
LAT-DS-04415-01 Program, PDU FPGA Signed Off
LAT-DS-05019-01 Design Database for PDU FPGA Signed Off
LAT-TD-05020-01 Theory of Operation, PDU VHDL Draft-In Work
LAT-DS-04757-51 Standoff Signed Off
23
PDU (Cont)
  PDU Internal Cable Assemblies
LAT-DS-04357-01 Cable Assembly, PDU, PRI/RDNT J1 Signed Off
LAT-DS-04358-01 Cable Assembly, PDU, PRI/RDNT J2 Signed Off
LAT-DS-04359-01 Cable Assembly, PDU, PRI/RDNT J3 Signed Off
LAT-DS-04360-03 Cable Assembly, PDU, PRI/RDNT J5 Signed Off
LAT-DS-04361-03 Cable Assembly, PDU PRI/RDNT J6 Signed Off
LAT-DS-04362-03 Cable Assembly, PDU, PRI/RDNT J7 Signed Off
LAT-DS-04363-01 Cable Assembly, PDU, PRI/RDNT J8 Signed Off
LAT-DS-04364-01 Cable Assembly, PDU, PRI/RDNT J9 Signed Off
LAT-DS-04365-01 Cable Assembly, PDU, PRI/RDNT J10 Signed Off
LAT-DS-04710-01 Internal Harness Subassembly, PDU CAL Baseplate Temps Signed Off
LAT-DS-04711-01 Internal Harness Subassembly, PDU-RAD/VCHP Temps Signed Off
LAT-DS-04712-01 Internal Harness Subassembly, PDU-ACD/GRID/RAD Temps Signed Off
LAT-PS-04870-01 SOW, Internal Harness, PDU, with Glenair Connector Signed Off
LAT-PS-04871-01 SOW, Internal Harness, PDU, without Glenair Connector Signed Off
24
GLTC3
  GLTC ASIC P/O GASU CCA  
LAT-DS-03744-01 Layout, GLTC3 ASIC Released
LAT-DS-03743-01 Schematic, GLTC3 ASIC Released
LAT-TD-03745-01 VHDL, GLTC3 ASIC Released
LAT-TD-03742-01 Specification, GLTC3 ASIC Released
LAT-TD-01820-04 Test Procedure, GLTC3 ASIC Signed-off
LAT-TD-02549-01 GLTC3 ASIC T36T Wire-bonding and Packaging Require Released
  • GLTC radiation and qualification
  • SEL and SEU ok
  • TID is scheduled for next week in Italy
  • Qualification at GSFC will start after the
    radiated ASICs are tested on the test-setup, so
    it can be shipped to GSFC.
  • ASICs for flight boards are being burned in and
    tested, full quantity required ready within 1-2
    weeks.

25
Engineering Model Design Validation
  • PDU GASU
  • Tested on bench and on test-bed
  • Functionality and performance validated on
    test-bed
  • 16 TEM/TPS connected to EM PDU and GASU and to
    SIU, EPUs and ACD FREEs
  • Validated over frequency and voltage margins
  • GASU used in ACD G3 test-stands at GSFC
  • Limitations
  • No temperature tests performed on PDU or GASU
  • Flight boards checked for flight component
    foot-prints
  • PDU flight board loaded with some flight
    components and tested
  • GASU no board from flight lot loaded/tested yet

26
Issue
  • GLTC ASIC (GASU)
  • ESD sensitivity about 200V
  • Aeroflex assembly controls to lt 50V
  • Trigger FPGA code (GASU)
  • Only recently finalized and tested on test-bed
  • Flight FPGAs slower
  • Could not burn 9 flight FPGAs for use on
    non-flight board
  • Finite risk
  • Omnirel fixed-voltage regulator (PDU)
  • Was recalled and we are waiting for replacements,
    promised end of February
  • PCBs did not pass coupon testing (PDU)
  • Fabricated new batch, is at GSFC for coupon
    testing
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