Idea-to-Silicon-2.5D Packaging Technology-SoCs for High Performance Computing-SoC designs to 7nm process technology

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Idea-to-Silicon

• OpenFives Idea-to-Silicon capabilities combined
  with our advanced design methodologies on
  leading-edge 5nm, 7nm and 12nm foundry processes.
• Your fastest path to custom silicon is here When
  standard products dont meet your business or
  technical requirements, its time to go custom.
• Specialized custom SoC solutions can be optimized
  for power, performance, and area, giving you
  greater design flexibility and a competitive
  edge.
• OpenFives Idea-to-Silicon capabilities combined
  with our advanced design methodologies on
  leading-edge 5nm, 7nm and 12nm foundry processes,
  and 2.5D packaging technology enable exciting new
  designs applications such as Artificial
  Intelligence (AI), Edge computing, Networking,
  and High-Performance Computing (HPC).

https//openfive.com/custom-silicon/
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Front-end Design,Integration, and Verification

• Design expertise for building scalable,
  customized SoCs with in-house design,
  integration, and advanced verification using
  automated tools and methodology.
• Our Capabilities SOC Micro-architecture,RTL
  Design and Synthesis, SOC IP Integration,Design
  Verification,FPGA Prototyping

https//openfive.com/custom-silicon/
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2.5D Technology

• 2.5D IC is a packaging technology where multiple
  die are placed face down and side by side on a
  silicon or organic interposer. 
• The active surface of the die has micro-bumps
  that connect to pads on the surface of the
  silicon interposer.
• Connections from these pads directly connect to
  TSVs (Through Silicon Vias), which pass through
  the interposer substrate and connect to the
  package substrate. 

https//openfive.com/custom-silicon/
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Benefits of using anIdea-to-Silicon Methodology

• Cost Savings Ongoing product development costs
  on derivatives of existing chip designs are high
  and make it hard to integrate new IP. The
  OpenFive Idea-to-Silicon methodology reduces cost
  and time to market to enable your silicon with
  your preferred software stack.
• Design Flexibility OpenFives Idea-to-Silicon
  methodology provides an ideal starting point to
  explore and enter into key markets with the
  advantage of a faster design cycle by integrating
  required IPs from our wide IP portfolio, thereby
  providing a competitive advantage.
• Rapid Time-to-Market The OpenFive
  Idea-to-Silicon methodology enables optimized
  layout for power, performance, and size
  requirements, and reduces time to market for
  ongoing product roadmap development.
• More Choice Combine RISC-V and Arm standard
  cores with OpenFive SoC IP, IP from OpenFive
  partners and your own IP to get your ideal custom
  silicon.

https//openfive.com/custom-silicon/
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• Please do visit my website for
• in-depth information.
• Website
• https//openfive.com/custom-silicon/