Semiconductor Packaging Market to reach $60.44 billion by 2030 - PowerPoint PPT Presentation

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Semiconductor Packaging Market to reach $60.44 billion by 2030


The semiconductor packaging market is expected to leverage high potential for consumer electronics and automotive verticals. The current business scenario is witnessing an increasing demand for consumer electronics devices, particularly in developing countries such as China, Japan, South Korea, India, and others. Companies in this industry are adopting various innovative techniques, such as merger & acquisition activities, to strengthen their business position in the competitive matrix. – PowerPoint PPT presentation

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Title: Semiconductor Packaging Market to reach $60.44 billion by 2030

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Semiconductor Packaging Market
The semiconductor packaging market size in
Asia-Pacific is expected to grow at the highest
rate during the forecast period, owing to
increase in adoption of electric vehicles and
high demand for automated switching devices and
power modules. Moreover, availability of high-end
enhanced technologies, increase in demand for
smart electronics, and growth in manufacturing
industries are projected to contribute to the
growth of packaging technology in Asia-Pacific.
Avinash SavekarLead Analyst, Semiconductor and
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Semiconductor Packaging Market
According to a new report published by Allied
Market Research, titled, Semiconductor Packaging
Market by Type (Flip-Chip, Embedded Die, Fan-In
WLP, and Fan-Out WLP), Packaging Material
(Organic Substrate, Bonding Wire, Leadframe,
Ceramic Package, Die Attach Material, and
Others), Wafer Material (Simple Semiconductor
(Silicon (Si) and Germanium (Ge)) and Compound
Semiconductor (III-V (Gallium Arsenide (GaAs),
Indium Phosphide (InP), Gallium Nitride (GaN),
Gallium Phosphide (GaP), and Others), II-VI (Zinc
Sulfide (ZnS) and Zinc Selenide (ZnSe)), and
IV-IV (Silicon Carbide (SiC) and
Silicon-Germanium (SiGe)), and Technology (Grid
Array, Small Outline Package, Flat No-Leads
Packages (Dual-flat no-leads (DFN) and Quad-flat
no-leads (QFN)), Dual In-Line Package (Plastic
Dual Inline Package (PDIP) and Ceramic Dual
Inline Package (CDIP)), and Others), and Industry
Vertical (Consumer Electronics, Automotive,
Healthcare, IT Telecommunication, Aerospace
Defense, and Others) Global Opportunity Analysis
and Industry Forecast, 20212030 the global
semiconductor packaging market size was valued at
27.10 billion in 2020 and is projected to reach
60.44 billion by 2030, registering a CAGR of
9.10 during the forecast period. Asia-Pacific is
expected to be the leading contributor to the
global market, followed by North America and
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Semiconductor Packaging Market
Emerging technologies, such as artificial
intelligence (AI) and quantum computing, require
compound semiconductors to achieve full
commercialization. The UK has a rich heritage of
microprocessor design, with companies, such as
ARM and Imagination Technologies, and new
start-up companies designing AI processors, such
as Bristol-based GraphCore, which are expected to
create lucrative opportunities for the global
semiconductor packaging market growth. Key
Benefits for Stakeholders from this Research
Report This study comprises analytical
depiction of the global Semiconductor Packaging
Market outlook along with the current trends and
future estimations to depict the imminent
investment pockets. The overall Semiconductor
Packaging Market analysis is determined to
understand the profitable trends to gain a
stronger foothold.  The report presents
information related to key drivers, restraints,
and Semiconductor Packaging Market opportunities
with a detailed impact analysis.
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Semiconductor Packaging Market
Semiconductor Packaging Market Segment
Analysis The global Semiconductor Packaging
Market share is segmented on the basis of type,
packaging material, wafer material, technology,
industry vertical, and region. Semiconductor
Packaging Market Regional Scope and Demand
Analysis for 2021-2030 Region wise, the
Semiconductor Packaging Market trends are
analyzed across North America (the U.S., Canada,
and Mexico), Europe (the UK, Germany, France,
Russia, and rest of Europe), Asia-Pacific (China,
Japan, India, Australia, and rest of
Asia-Pacific), and LAMEA (Latin America, the
Middle East, and Africa). North America is
dominating the Semiconductor Packaging Market
share, owing to growth of the high investment
opportunities. However, Asia-Pacific is projected
to register the significant growth rate during
the forecast period. Furthermore, LAMEA holds the
subsequent position, and is likely to increase
its growth rate by the end of the forecast
period, followed by Europe.
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Semiconductor Packaging Market
  • Major Companies
  • Amkor Technology (U.S.)
  • ASE Group (Taiwan)
  • ChipMOS Technologies, Inc. (Taiwan)
  • Powertech Technology, Inc. (Taiwan)
  • Intel Corporation (U.S.)
  • Jiangsu Changjiang Electronics Technology Co.,
    LTD (China)
  • Samsung Electronics Co., Ltd. (South Korea) T
  • aiwan Semiconductor Manufacturing Company
  • Texas Instruments (U.S.)
  • Fujitsu Limited (Japan)

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Semiconductor Packaging Market
Contact David Correa 5933 NE Win Sivers Drive
205, Portland, OR 97220 United States Toll Free
(USA/Canada) 1-800-792-5285, 1-503-894-6022,
1-503-446-1141 UK 44-845-528-1300 Hong Kong
852-301-84916 India (Pune) 91-20-66346060
Fax 1?855?550-5975
Web https//
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