Advanced Packaging Market Growth, Overview with Detailed Analysis 2021-2030

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Advanced Packaging Market
With rapid growth in advanced packaging market,
specifically fan out wafer level packaging, along
with increase in demand for smartphone and
devices and Internet of Things (IoT), advanced
packaging suppliers are developing process and
ways to reduce the overall cost of advanced
packaging and provide maximum operational
efficiency. During the recent times, advanced
packaging is mainly used for high-end products
and for applications related to niche-market such
as wafer and die production due to its high cost
in its operation..
Divyanshi TewariLead Analyst, Semiconductor and
Electronics at Allied Market Research
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Advanced Packaging Market
The advanced packaging market is steadily gaining
traction, owing to rise in demand for enhanced
technologies in various industry verticals such
as integration of IoT, AI, and surge in demand
for smart consumer electronics. According to a
recent report published by Allied Market
Research, titled, Advanced Packaging Market by
Type (Flip Chip CSP, Flip-Chip Ball Grid Array,
Wafer Level CSP, 2.5D/3D, Fan-Out WLP, and
Others), and End Use (Consumer Electronics,
Automotive, Industrial, Healthcare, Aerospace
Defense, and Others) Global Opportunity Analysis
and Industry Forecast, 20202027, the global
advanced packaging market size was valued at
29.42 billion in 2019 and is projected to reach
64.19 billion by 2027, growing at a CAGR of
10.2 from 2020 to 2027.
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Advanced Packaging Market
Advanced packaging market is expected to leverage
high potential for the consumer electronics and
automotive vertical in 2026. The current business
scenario is witnessing an increase in the demand
for smart consumer electronics, particularly in
the developing regions such as China, India, and
others, due to an increase in demand for
technological advancements in this sector such as
adoption of AI and IoT. Companies in this
industry are adopting various innovative
techniques such as mergers and acquisition
activities, to strengthen their business position
in the competitive matrix. The advanced
packaging market is analyzed by type, end use,
and region. By type, the market is classified
into flip chip CSP, flip-chip ball grid array,
wafer level CSP, 2.5D/3D, fan-out WLP, and
others. On the basis of end use, the market is
divided into consumer electronics, automotive,
industrial, healthcare, aerospace defense, and
others. By region, it is analyzed across North
America, Europe, Asia-Pacific, and LAMEA along
with their prominent countries.
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Advanced Packaging Market

• Key Findings Of The Study
• By type, the flip-chip ball grid array segment
  held the highest revenue of 9.63 billion in 2019
  and contributed a major part in advanced
  packaging market share.
• By end use, the consumer electronics segment held
  the highest revenue share of the market in 2019,
  generating 18.51 billion as per the advanced
  packaging market analysis.
• By region, Asia-Pacific is expected to dominate
  the market, garnering a major market share during
  the forecast period.

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Advanced Packaging Market
Major Companies Key players operating in the
advanced packaging market trends include Amkor
Technology, Intel Corporation, Qualcomm
Technologies Inc., Taiwan Semiconductor
Manufacturing Company, IBM, Microchip Technology,
Renesas Electronics Corporation, Texas
Instruments, and Analog Devices, which are
profiled in this report. The Advanced packaging
industry key market players adopt various
strategies such as product launch, product
development, collaboration, partnership,
agreements, among others to influence the market
growth.
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Advanced Packaging Market
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