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SEMI S2 Section 26 Laser Safety

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SEMI S2 Section 26 Laser Safety SEMI S2 Section 26 Changes Laser Data Sheet John O Donnell Texas Instruments Objective Communicate the rationale for and changes to ... – PowerPoint PPT presentation

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Title: SEMI S2 Section 26 Laser Safety


1
SEMI S2 Section 26 Laser Safety
  • SEMI S2
  • Section 26 Changes
  • Laser Data Sheet
  • John ODonnell
  • Texas Instruments

2
Objective
  • Communicate the rationale for and changes to the
    laser safety section of SEMI S2 0706

3
Laser Safety Task Force
  • The Laser Task Force scope was limited to
  • Relocating needed information from Related
    Information 9 (Laser Data Sheet) to an Appendix
    (7)
  • Making suitable changes to Section 26 and RI-9 to
    reflect the relocation of the Laser Data Sheet
  • Addressing any international or regulatory
    changes.
  • This move would provide the equipment users
    needed information about lasers in equipment

4
Rationale for Change
  • The original purpose of the S2 Laser Data Sheet
    was to provide a standard format to communicate
    laser equipment hazards and control measures
    information to the user.
  • Located in Related Information 9, the Laser Data
    Sheet was not being used.
  • The change to S2 was made to get appropriate
    laser information to the people that need to use
    it to establish control measures during the use,
    maintenance, and service of semiconductor
    manufacturing equipment
  • Equipment users needed access to laser hazard and
    control data in order to implement effective
    laser safety programs.

5
Rationale for Change
  • The User Perspective
  • A standard format would communicate critical
    information on laser hazards and controls needed
    for installation and maintenance personnel to
    control laser hazards.
  • Efficient Use of Resources
  • Suppliers perform a laser hazard analysis once
    per model
  • Every user would have to perform an analysis for
    each tool that they have from every equipment
    manufacturer
  • ESH has few enough resources and needs to
    maximize the ability to provide a safe healthy
    workplace

6
Who is affected?
  • Equipment manufacturers
  • Laser equipment requirements in SEMI S2, Section
    26.
  • Third Parties
  • Evaluate control measures and laser hazards
    documented on Laser Data Sheet
  • Device manufacturers
  • Source of laser safety information to use in
    workplace laser safety programs

7
From Information To Requirement
  • The original Laser Data Sheet was published in
    Related Information 9 but remained there unused
    by equipment manufacturers
  • The laser line item required essential laser data
    to be documented on the Laser Data Sheet.
  • This change was approved in March 2004, but the
    effective date was delayed until July 2006
  • Effective July 1, 2006, the Laser Data Sheet is
    Appendix 7, documentation for requirements of
    Section 26

8
Laser Data Sheet
9
Section 26 Changes
  • 26.1 Requirement for laser product class and
    applicable standard documented on Laser Data
    Sheet
  • 26.1.1 Alternate formatting option for Laser Data
    Sheet
  • 26.1.3 Laser and equipment labeling requirement

10
Section 26 Changes (continued)
  • 26.1.4 Maintenance and service task information
    with access above MPE
  • 26.1.4.1 Information on laser hazards, control
    measures and PPE documented on Laser Data Sheet.
    (Exceptions Proprietary Information, Stand Alone
    system components)
  • 2.1.5 Identification of laser source locations in
    user documentation

11
Summary
  • Laser equipment classification and hazard
    information is now a requirement
  • Maintenance and Service task hazards and control
    measures are required to be documented
  • Laser Data Sheet provides format to document
    required information
  • This change was approved over 2 years ago
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