Dia 1

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RoHS from the Perspective of a Connector
Manufacturer
Jan Broeksteeg Engineering Manager CCCE
EMEA Tyco Electronics Nederland BV
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Tyco Electronics

• Worlds leading manufacturer of
  electro-mechanical and passive components
• 25 Strong technology product segments.
• Located in 53 countries.
• gt 250 Production Locations
• gt 80.000 Employees
• gt 5000 Sales people
• gt 7000 people active in de fields of Engineering
  and Development.

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Overview Tyco Electronics Brands
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Table of Contents

• Legislation and Industry Drivers
• Tyco Electronics Lead Free/RoHS Roadmap
• Customer Schedule
• TE timing
• Product Implications
• Hazardous materials
• LF processing issues
• Logistics Part Numbering/coding

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Legislation / Industry Drivers

• Restriction on Hazardous Substances (RoHS)
• EU Directive 2002/95/EC
• By July 1, 2006, electronic products to be free
  of Lead, Cadmium, Hexavalent Chrome, Mercury,
  PBBs and PBDEs
• Recycling and disposal mandates in Europe (WEEE),
  Japan, and China.
• EU Directive 2002/96/EC
• China proposing RoHS for 2006
• Increasing activity in US - e.g. Prop 65 and SB20
  in CA
• EU End-of-Life Vehicle (ELV)
• EU Directive 2000/53/EC
• Automotive products required Lead Free by July 1,
  2003
• Exception was granted for lead in solder and
  plating on solderable interfaces

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Key Driver - RoHS

• Producer of covered product when offered on
  market (EU) has to be in compliance
• In Tyco Electronics' case as we are generally a
  component supplier, it is our customer (OEM) that
  is Producer
• OEM demanded and pushed compliance through-out
  supply chain
• TE pushed through our supply chain as well

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RoHS Definitions

• Concentration limits defined for RoHS substances
• Allowable trace amounts
• lead
• mercury 0.1 by weight (1000 ppm)
• hexavalent chrome
• PBB, PBDE
• cadmium 0.01 cadmium(100 ppm)

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Exemptions

• EU directive 2000/95/EC RoHS
• Lead in glass of cathode ray tubes, electronic
  components and fluorescent tubes.
• Lead in steel lt 0,35 wt, in aluminium lt 0,4 wt,
  in copper alloy lt 4 wt. high melting temp
  solders (i.e. tin-lead solder alloys gt 85 lead)
• Lead in solders for servers, storage and storage
  array systems (until 2010) network
  infrastructure equipment for switching,
  signalling, transmission network management for
  telecommunication
• Lead used in compliant pin connector systems.
• Cadmium and its compounds in electrical contacts
  and cadmium plating except for applications
  banned under Directive 91/338/EEC (1) amending
  Directive 76/769/EEC (2) relating to restrictions
  on the marketing and use of certain dangerous
  substances and preparations
• Lead in electronic ceramic parts (e.g.
  piezoelectronic devices)
• Military and Aerospace applications excluded

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Exemptions

• EU directive 2000/95/EC RoHS

- Lead and cadmium in printing inks for the
application of enamels on borosilicate glass -
 Lead as impurity in RIG (rare earth iron garnet)
Faraday rotators used for fibre optic
communications systems -  Lead in finishes of
fine pitch components other than connectors with
a pitch of 0.65 mm or less with NiFe lead
frames and lead in finishes of fine pitch
components other than connectors with a pitch
of 0.65 mm or less with copper lead frames -
 Lead in solders for the soldering to machined
through hole discoidal and planar array ceramic
multilayer capacitors -  Lead oxide in plasma
display panels (PDP) and surface conduction
electron emitter displays (SED) used in
structural elements notably in the front and
rear glass dielectric layer, the bus electrode,
the black stripe, the address electrode, the
barrier ribs, the seal frit and frit ring as
well as in print pastes
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Exemptions

• -  Lead oxide in the glass envelope of Black
  Light Blue (BLB) lamps
• -  Lead alloys as solder for transducers used in
  high-powered (designated to operate for several
  hours at acoustic power levels of 125 dB SPL and
  above) loudspeakers
• -  Hexavalent chromium in corrosion preventative
  coatings of unpainted metal sheetings and
  fasteners used for corrosion protection and
  electromagnetic Interference Shielding in
  equipment falling under category three of
  Directive 2002/96/EC (IT and telecommunications
  equipment). Exemption granted until 1 July 2007.
  
• -  Lead bound in crystal glass as defined in
  Annex 1 (Categories 1, 2, 3 and 4) of Council
  directive 69/493/EEC () OJ L 326, 29.12.1969,
  p. 36. Directive as last amended by 2003 Act of
  Accession

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Customer / Industry Timeline

Jul 03 ELV
Automotive Products ELV Compliant
Jan 05
Jan 04
Japanese Leading Consumer Conversion
Jan 06
Computer/Telecom rolling out On new Programs
Jul 06 RoHS
Industrials - latest conversion
1. Mid-2004 major conversion started 2. Extended
transition (mixed use of leaded and lead-free
components, solders etc.)
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TE Timeline (components)
Conversion period dual manufacturing
requirements
Engineering product assessment. New PNs, codes,
x-ref in StarTEC, E-Catalog
Inventory pull-down of non-compliant parts
RoHS compatible Product availability (limited
exceptions)
Last Build Non-compliant parts (some exemptions)
Customer Surveys
Manage Customer Transition
Jan 06
Jul 06 RoHS
Apr 05
Jan 05
Oct 05
Jul 05
10 RoHS Compliant Product Shipments
90 RoHS
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RoHS Compliance vs. Compatibility

• Tyco terminology
• RoHS Compliant means elimination of all hazardous
  materials
• RoHS Compatible means resistant to higher solder
  temperatures (approx 30 C higher)

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Compliance

• Alternative for tin-lead plating
• Identify suitable alternatives
• Assess performance characteristics of the
  plating layers
• Solderability
• Whiskers
• Press-fit connections
• Separable interfaces (Durability / Friction)
• Contact Resistance

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Implications solderability (1)

• SnPb finishes converted to pure Sn
• No impact to product performance or customer
  process plating is backward (SnPb) and forward
  (lead free) process compatible.
• Sn plated product meets existing product
  specification

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Implications solderability (2)
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Implications solderability (3)
Wetting balance test results
wetting force
time
Zero cross time
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Implications whiskers (1)
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Lead-free tin plating baths

• Several types commercially available
• Pure Sn easier to produce (no composition
  check)
• - risk of whiskers
• SnCu3 sometimes preferred in Far East
• - alloy, so composition to be controlled -
  some types showed high contact resistance
• - risk of whiskers
• SnAg3.5 - composition of plated layer difficult
  to control - cost
• SnBi - low melting phases with Pb, fillet
  lifting

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Implications whiskers (2)

• Major concern with move to Sn plating is Sn
  Whiskers
• No single root cause has been identified
• Stresses on the Sn finish (internal or
  mechanical) are widely accepted as contributors
• Extensive testing/evaluation of Sn plating baths
  has occurred in Tyco/industry over past several
  years
• Whisker tests have been developed and are used
  for bath qualification.
• Ongoing audits of baths for whiskers is being
  implemented

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Implications whiskers (3)

• cause
• grain size
• thickness
• carbon content
• intermetallic compounds

internal stress

• remedy
• use min 0.5 mm minimum Ni underlayer - 1.27 mm
  already standard on most products
• control crystal structure of layer - development
  of special tin baths
• avoid external stresses to the tin surface

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Implications whiskers (4)

• Tyco has tested and selected several "whisker
  mitigating tin plating solutions
• Tyco reviewed and modified all productsto avoid
  external stress on the tin surface
• Nickel underplate should be present in all cases

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Implications press-fit connections (1)
press-fit types, press-in force
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Implications press-fit connections (2)
press-fit types, push-out force
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Implications press-fit connections (3)
board finishes, press-in force, new data (recent)
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Implications press-fit connections (4)
board finishes, push-out force
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Separable interfaces

• Coefficient of friction was tested for like on
  like interfaces
• Room temperature and humidity
• 100 g normal force
• 6mm ball on flat geometry

coating friction wear
93/7 SnPb 0.46 control
Sn 0.52 Same
Sn/Cu 0.55 same
No significant difference between tin-lead and
lead free finishes
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RoHS Compliance vs. Compatibility

• RoHS Compliant means elimination of all hazardous
  materials
• RoHS Compatible means resistant to higher solder
  temperatures (approx 30 C higher)

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Implications resistance to soldering heat (1)
solder types
Sn/0.7Cu
Sn/3.8Ag/0.5Cu
Sn/3.5Ag/0.7Cu
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Implications resistance to soldering heat (2)
Generally accepted for reflow and wave
soldering Tm T solder Tmax "SAC"
(SnAgCu ) 217 ºC 235 - 240 ºC 260
ºC Sometimes preferred for wave
soldering SnCu0.7 227 ºC 275 - 280 ºC 275
- 280 ºC Conventional (reference) Sn60Pb40 18
3 ºC 220 - 230 ºC 245 ºC
outsiders Sn96 Ag2.5 Bi1.01) Cu0.5
210 - 215 ºC 217 ºC 231 ºC Sn93.5 Ag3.8
Bi2.01) Cu0.7 215 - 219 ºC 217 ºC 231
ºC Sn93.5 Ag3.5 Bi31) 200 - 210
ºC 217 ºC 231 ºC 1) Concerns about
interaction of Bi and Pb during transition from
conventional to LF
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Implications resistance to soldering heat (3)
reflow soldering
Coldest spot on assembly is determining
factor. Depends on board design, which is out
of our control.
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Implications resistance to soldering heat (4)
wave soldering
Local exposure to soldering heat. T max mainly
dependant product design . Much testing
necessary due to great variation in connector
design. Prediction is not trivial.
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Implications resistance to soldering heat (5)

• Jointly developed by Tyco, FCI, Molex and
  Amphenol
• Download from http//www.tycoelectronics.com/envi
  ronment/leadfree/techdata.stm

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Implications resistance to soldering heat (6)

• Higher solder temperature means higher
  temperature load on plastic.
• Present criteria
• maximum temperature part is exposed to, (T max
  )
• relative to melting point (T melt)
• heat deflection temperature (HDT_at_1.82MPa)

T max
T max gt T melt NO
T melt
HDT(1.82 MPa) lt T max lt T melt TEST
HDT (1.82 MPa)
T max lt HDT(1.82 MPa) OK
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Implications resistance to soldering heat (7)
Generally accepted "danger temperature" 280 deg C
Selected maximum temperature, for SMD we prefer
260 degC for wave can be 260 to 280
back
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Logistics Issues/Strategy Connectors

• Conversions for ELV completed as Running Change
• No part number change (mandated by our automotive
  customers)
• Attempted FIFO inventory management and labeling
  to control
• Conversions for RoHS per Standard EC/PCN Process
• TE Strategy new part numbers for all parts
  which need conversion to become RoHS compatible
• Any material change must be coordinated w/
  plating change
• Updated product documentation application
  specification will be provided as appropriate
• Key for TE is NOT to support 2 versions of
  product (SnSnPb) for extended time period
• Intent will be to obsolete non-compliant part by
  7/1/2006 in most cases

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Part coding/X-referencing

• Codes/Systems/X-references have been developed to
  capture and maintain this information
• RoHS/EVL Code created/maintained in database
• Processing capability code created/maintained
  in database
• X-reference (alternate part) created and
  maintained in database
• Above codes/information is disseminated to other
  systems
• E-Catalog (accessible by customers)
• Global part master (DMF)
• SAP and other manufacturing systems (codes only)

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Product Labeling

• Marking individual products will be cost
  prohibitive as infrastructure does not exist
  today
• Compliant products manufactured will have RoHS
  compliant text/label at a minimum on shipping
  carton
• Can be an additional sticker or pre-printed in
  reverse print
• TE has no plans to implement JEDEC or IPC label
  spec for connector
• No room on product/label
• Information on label not useful for process
  setup, rework, or recycling
• Part number change precludes need to use labels
  for material control or process compatibility

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The End
questions?