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BSM Product Assurance Plan Team Briefing

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BSM Product Assurance Plan Team Briefing & PA plan roll-out Ian Pain – PowerPoint PPT presentation

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Title: BSM Product Assurance Plan Team Briefing


1
BSM Product Assurance PlanTeam BriefingPA
plan roll-out
  • Ian Pain

2
Overview
  • The BSM is a high reliability precision cryogenic
    mechanism
  • PA plan goal is to provide
  • traceability and assurance to the customer
  • specific assurance that the product is fit for
    purpose in the space environment.
  • the Acceptance Data Package (ADP)
  • Reduced cost!

3
Quality Assurance at the UK ATC
  • UK ATC mission
  • be the UK's National Centre for the design and
    production of state of the art astronomical
    technology".
  • Quality management (ATC PM procedures)
  • ... is the process of ensuring that the quality
    expected by the customer is achieved....All work
    packages must be traceable back to the customer
    requirements to ensure that they are met.
  • General ATC practice,
  • project engineers responsible for the quality of
    their work
  • supervisory aspects covered by the relevant Head
    of Specialism.
  • The Chief Engineer is responsible for approving
    the overall quality of the products delivered to
    customers.
  • For the SPIRE BSM
  • a Product Assurance Manager is designated
  • to ensure that the unique quality aspects of
    space flight projects are fully met.

4
BSM PA - People
5
BSM PA Plan Contents
  • ATC QUALITY ASSURANCE
  • PROCUREMENT CONTROL
  • MANUFACTURING AND ASSEMBLY CONTROL
  • NON-CONFORMANCE PROCESS
  • PRODUCT ASSURANCE MANAGEMENT
  • GENERAL
  • DESIGN QUALITY ASSURANCE
  • CONFIGURATION MANAGEMENT AND CONTROL
  • MATERIAL AND PROCESS SELECTION AND CONTROL
  • ELECTRONIC PARTS SELECTION AND CONTROL
  • CLEANLINESS AND CONTAMINATION CONTROL
  • SOFTWARE PRODUCT ASSURANCE
  • RELIABILITY ASSURANCE
  • INTEGRATION AND TEST CONTROL
  • ACCEPTANCE AND DELIVERY

6
Applicability of PA to the BSM models
A Applicable P Partially Applicable N
Non-Applicable
7
Key to PA applicability table
  • 1. Space rated parts are not required, but
    performance should be equivalent (e.g. Mil-Spec)
  • 2. Applied via LAM
  • 3. Applicable for components coming into direct
    contact with flight standard hardware (e.g.
    interfacing connectors from GSE cables).
  • 4. Applicable to elements directly interfacing
    with the flight hardware, when an impact on the
    flight hardware is possible.
  • 5. Applicable to all activities related to design
    verification

8
PA plan roll-out
  • What
  • 2 axis Prototype
  • data,
  • build,
  • fault logging
  • Development Model
  • Design
  • Manufacture
  • Assembly
  • Test
  • When
  • starts now
  • Why
  • it will take us 3 months to get it right
  • we need to fine tune the PA plan
  • we may want to re-use some DM bits on the STM or
    CQM
  • How
  • PA reviewed monthly
  • Produce all logs etc
  • apply as we go.

9
Design Documentation
10
DESIGN QUALITY ASSURANCE
  • PA during design
  • Verifying the presence of all necessary inputs,
  • Safety and reliability studies,
  • The formalization of the functional analysis,
  • Verifying interactivity between
    mechanical-electrical and software design,
  • Verifying the presence and compliance of "latest
    design" files and documents.
  • Controlled documents
  • Design Description
  • Specification
  • ICDs
  • PA Plan, Development Plan
  • Mechanical Electrical Design Drawings/Models
  • Analysis Reports

11
Documentation control
  • Q-Pulse
  • New ATC doc management system
  • used on VISTA, SPIRE, others
  • ATC SPIRE documents are migrating to it now.
  • Will also use it for NCRs
  • Intralink
  • for models and drawings
  • Livelink
  • for SPIRE project office consortium files
  • Bug-track
  • Fault logging during lab work

12
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13
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14
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15
MATERIAL AND PROCESS SELECTION AND CONTROL
  • Material and process controls implemented
  • Space approved materials selected
  • Proven cryogenic heritage
  • Declared Lists
  • Materials
  • Parts
  • Processes
  • .all finalized by the IBDR Nov/Dec.01

16
ELECTRONIC PARTS SELECTION AND CONTROL
  • Warm Electronics
  • Responsibility divided between ATC LAM,
  • ATCs bits - Cold Electronics
  • Motors,
  • Zeiss/PACS
  • Sensors
  • Infineon (ISOPhot)
  • up-screen PAD
  • Launch Latch
  • LAM/SMEC
  • Harness
  • approved wiring
  • RAL supply?
  • In-house solder repair - trained personnel

17
Part Approval Document (PAD Sheet)
18
RELIABILITY ASSURANCE
  • Reliability Block Diagram
  • Single Point Failures
  • FMEA/FMECA
  • Cumulative Operating Time (Log!)
  • Environmental Assurance
  • Environmental Testing
  • Critical Items Identification and Control (Log!)
  • may include flex pivots
  • may include sensor bonded assemblies

19
Procurement Manufacture
20
PROCUREMENT CONTROL
  • Traceable Purchase Orders (PPARC FMs)
  • Supplier Selection
  • Incoming Inspection Report
  • verification of the packaging conditions
  • visual inspection,
  • conformance to ordering data,
  • certificate of conformance,
  • supplier's inspections and control results,
  • remaining lifetime (for products with limited
    lifetimes).
  • Quarantine Bonded Store
  • until released (inspection OK)

21
MANUFACTURING AND ASSEMBLY CONTROL
  • Manufacturing Request
  • Route Card
  • Serial Number identification (S/N book)
  • Inspection Reports
  • Operator Inspection
  • Independent Inspection as required
  • External attendance at MIP/KIPs if required
  • Bonded Store
  • Assembly Control Logs

22
Manufacturing Documents
Request
Inspection Record
Material Certificates,
Process Records,
23
NON-CONFORMANCE PROCESS
  • Identify a Non-Conformance
  • Quarantine component
  • Raise NCR
  • NCR review
  • Responsible engineer, PA manager others
  • Classification (major/minor)
  • Disposition
  • Report
  • Close Out

24
NCR management - enter details of CA.
25
Non Conformance Report
  • Raise using Q-Pulse
  • Review
  • investigate and close out each NCR,
  • recommendation for disposition and corrective
    action
  • NCR register reviewed at BSM project meetings,
  • NCR review panel
  • the responsible engineer identified on the
    Workshop Effort Request,
  • the BSM PA manager
  • the member of staff raising the NCR.
  • Additional staff as required. UK-SPO and/or ESA
    for major NCRs.
  • Disposition as
  • 'Use as is', with/without requirement for waiver
  • 'Re-work or Repair', with attached repair
    instructions.
  • 'Scrap'
  • Corrective action
  • documented and circulated to the relevant HoS.

26
Assembly Test
27
CLEANLINESS AND CONTAMINATION CONTROL
  • Clean Room assembly
  • Class 1000 cleanroom
  • Class 100 air-bench
  • Bakeout
  • 80degC
  • Transfer from clean room to test dewar
  • Limit exposure time
  • clean up CCD lab!!
  • Bag/purge/cover
  • Test Dewar
  • cleanliness enforced (semi-clean area)
  • Storage
  • Dry Nitrogen purge of storage containers

28
Cleanliness Certificate
29
INTEGRATION AND TEST CONTROL
  • Assembly, Integration and Test
  • Test Procedures
  • Test Witnessing
  • Test Reports
  • Fault Logging (bug-track)
  • Historical Record (Logbook)
  • Handling, Storage, Packaging, Marking and
    Labeling, Transportation

30
Assembly Log
31
Mate/ De-mate Log
32
Acceptance data pack
  • Shipping Documents
  • Procedures for Transport Handling Installation
  • Certificate of Conformance/Delivery Review board
    MOM AI Lists
  • Qualification Status/Test Matrix
  • Top Level Drawings incl... Family Tree
  • Interface Drawings
  • Functional Diagrams (Block Diagram)
  • Electrical Circuit Diagrams
  • As built configuration lists
  • Serialized Components List
  • List of Waivers
  • Copies of Waivers
  • Operation Manual
  • Historical Record
  • Logbook/Diary of Events
  • Operating Time/Cycle Record
  • Connector Mating Record
  • Test Record
  • Calibration Data record
  • Temporary Installation Record
  • Open Work / Deferred Work / Open Tests
  • List of Non-Conformance reports (NCR's)
  • Copies of Non-Conformance reports (NCR's)
  • Test Reports
  • Mass records / Power Budgets
  • Cleanliness Statement
  • Compliance Matrix
  • Photographs

33
PA Plan Summary
  • PA Plan Goal Fitness for purpose
  • Purpose
  • Reliable cryogenic high precision mechanism
  • Space qualified
  • Integrated to a 10M instrument
  • Method
  • Rigorous Design
  • Configuration Control
  • Traceable Materials, Parts, Documents
  • Fully documented clean room assembly
  • Non-conformances design changes, raised
    tracked
  • Qualification Programme backs the design
  • ADP demonstrated fitness for purpose
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