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Status of CSC Trigger

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Status of the Next Generation CSC Track-Finder D.Acosta University of Florida – PowerPoint PPT presentation

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Title: Status of CSC Trigger


1
Status of the Next Generation CSC
Track-Finder D.Acosta University of Florida
2
Track-Finder Crate Tests
  • Last Fall we successfully tested a complete
    chain of prototypes, yielding perfect agreement
    with the simulation for millions of events
  • Documented in TDR, with detailed Note to follow

SP
SR
CCB
MPC
Bit3 VME Interface
Custom backplane
100m optical fibers
3
A Compact Muon Trigger
  • The next step is to reduce the CSC latency by
    consolidating several boards and chips and by
    increasing the clock frequency to 80 MHz
  • New 1.6 Gbit optical link technology
  • Texas Instruments TLK2501 80 MHz serializer
    new optics
  • Reduces connections from peripheral crate (1? /
    link) so that all receivers can fit onto one
    board
  • Synchronous pipelined SRAM
  • Samsung, IDT
  • Allows LUTs on Sector Receiver to operate at ?80
    MHz in order to reduce chip count
  • High Density FPGAs
  • 2.5M gates with Xilinx Virtex XCV2000E
  • Fits all 17 FPGAs LUTs of Sector Processor
    into one chip
  • Thus, the entire CSC Track-Finder can fit into 1
    crate

4
Possible Crate Layout
15
5
Possible Board Layout
6
SR/SP Inputs
  • Muon Port Cards deliver 15 track stubs each BX
    via optical
  • DT Track-Finder delivers 2 track stubs each BX
    via LVDS

Delivers 240 bits _at_ 80 MHz
7
SR/SP Outputs
  • 6 track stubs are delivered to DT Track-Finder
    each BX via LVDS (can we multiplex at 80 MHz to
    save connector space?)
  • 3 muons per SP are delivered to Muon Sorter via
    GTLP backplane

8
SR Memory Scheme
  • Use cascaded synchronous SRAM to accomplish
    transformation of LCT bit patterns into global
    tracking variables
  • Includes alignment corrections
  • Multiplex muons _at_ 80 MHz to reduce chip count to
    45

9
Pipelined Memory Tests
  • Developed small evaluation board to test two
    pipelined memories in series
  • Samsung 1M x 18 synch. SRAM (K7A161800M)
  • Include scheme to multiplex two muon stubs
    through same memory set _at_ 80 MHz
  • Tested chips up to 150 MHz and encountered no
    errors with random number inputs
  • Specified maximum frequency is 180 MHz
  • Low power
  • 1W per memory at 150 MHz
  • Latency determination
  • 2 clocks per memory (4 clocks for two in series)
  • 7 clocks total including 80 MHz serialization
    and de-serialization of muon stubs ? 3.5 BX _at_
    80 MHz
  • May be possible to shave 0.5 BX

10
SR Memory Prototype
Tested hardware
Simulation illustrating clocking of board
11
SR Latency Estimate _at_ 80 MHz
  • Optical links (T.I.)
  • 76 82 ns latency for serialization and
    de-serialization of one frame, 0.5 BX to wait
    for second frame of data
  • Therefore, 2 BX for receiving complete muon
    stub in SR (was 2 BX for HP Glink as well)
  • Track stub conversion
  • 3.5 BX (was 2 BX in last prototype ? 1.5 BX)
  • Includes track stub serialization/de-serializatio
    n _at_ 80 MHz and propagation through two memories
  • Total latency is 5.5 BX
  • Compare to 4 BX of last prototype ? 1.5 BX
  • However, this estimate is conservative
  • Possible to process track stub data off optical
    link without waiting for second frame
  • Saves 0.5 BX 1 BX by not waiting removing
    some logic
  • Judicious choice of data in first frame of
    optical link, and new LUT scheme
  • Could run clock for synch. SRAM at 120 or 160
    MHz

12
SP in a Chip Study
  • Feasibility study was performed to fit all Sector
    Processor logic into one FPGA
  • Merged all separate schematics from current SP
    prototype into one project (17 FPGAs)
  • Transformed large Track Assembler LUTs into a
    Verilog algorithm for FPGA
  • Utilized 63 of the resources of a Xilinx
    Virtex-E (XCV1600EFG680-8)
  • Simulation shows that the latency of the SP
    logic is 11 BX at a maximum frequency of 41 MHz
  • Add 1 BX for final PT Assignment LUT
  • Compare to 15 BX of current SP prototype ? save
    3 BX
  • ChannelLink between SR and SP removed (save 4
    BX more)
  • Improvement to total SRSP latency ? save at
    least 5.5 BX
  • SP Chip I/O
  • 300 input bits (80 MHz)
  • 100 output bits (40 MHz)

13
Backplane Development
  • First CSC TF backplane technology was
    ChannelLink
  • It worked ! Serialization reduced 600 signals
    into 200 for SP
  • Latency is long 4 clocks
  • Next generation backplane technology will be GTLP
  • No differential signals (fewer traces)
  • We have tested a small prototype backplane with
    GTLP signals
  • It works tested drivers from Fairchild, and
    Xilinx Virtex I/O
  • We have developed and produced a full 21 slot
    custom VME backplane for use in the CSC front-end
    peripheral crate
  • Includes 40 MHz bussed signals and 80 MHz
    point-to-point
  • Highest density is 660 signals into Muon Port
    Card(vs. 680 signals into CSC Muon Sorter in
    CSC TF crate) multiplexed at 80 MHz
  • Have tested bussed signals with backplane fully
    loaded ?

14
Prototype Peripheral Crate Backplane
15
Schedule Plans
  • The merged Sector Receiver/Sector Processor
    concept looks feasible and saves latency
  • Approximately 5.5 BX savings so far, work
    continuing
  • All RD successful
  • New optical links, new synch SRAM, SP-on-a-chip,
    GTLP backplane
  • Single crate Track-Finder is simpler to maintain
  • Proposal is to develop a new prototype by late
    summer 2002
  • Possible use for integration tests with DT
    Track-Finder?
  • Possible use for structured beam tests?
  • Need to define a DAQ interface for readout
  • Slow control monitoring is presumably through VME
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