HT Summary Slides

1
HT Summary Slides
2
TI High Temperature Products

• Two HT Product Types
• High Temperature (HT) 200C parts
• -55C to 210C - 1000 hours
• Ceramic KGD packaging
• 175C Plastic Parts
• -55C to 175C operation
• Plastic surface mount packaging

High Temperature

• Complete High-Temp (HT) signal-chain solutions
  for harsh environments
• Unique Die and Packaging optimized for HT
• Thermal shut-down removal
• HT products offerings
• HT Plastic -55?C to 175?C
• HT Ceramic -55?C to 210?C
• HT Die -55?C to 210?C

• The are 3 areas TI has developed expertise to
  guarantee reliability on our released HT products
• Initial qualification of process, package and
  silicon across temperature
• Silicon, Package Material set and Process
  modifications
• On-going production quality monitors

3
TI Enhanced Industrial Packaging
Complete signal chain solutions
Widest Package Type Options
Smallest Footprint
Ruggedized Packages
Hermetic Packages
Up to 175C Plastic Packaging
Up to 210C Ceramic Packaging
Up to 150C Plastic Packaging
Bare Die/Wafers Solutions

• Ruggedized Applications
• Enhanced Qualification
• Extended Temperature
• Up to -55C to 150C
• Multiple Package types

• Smallest size
• Most Integration
• Multiple options
• 25C tested wafers to
• -55C to 210C Known Good Die (KGD)
• Broad portfolio

• Ruggedized Applications
• Enhanced Qualification
• Extended Temperature
• Up to -55C to 175C
• Multiple Package types
• Special High Temperature Material Sets

• Extreme Applications
• HT Qualification
• Extended Temperature
• Up to -55C to 210C
• Multiple Package types
• Most rugged hermetic material option

4
High Temperature Offering

Power
TPS76901-HT
TPS62000-HT
ISO7221-HT
TPS62110-HT
TPS40200-HT
TPS40210-HT
TPS50301-HT
ADS6142-HT
TPS7H1201-HT
TPS54363-HT
REF5025-HT

Legend
150/175C Plastic
210C Ceramic/KGD
5
TI High Temperature Products

• HT Webpage http//www.ti.com/ht
• TI HiRel Contact
• Mont Taylor
• mont-taylor_at_ti.com
• [phone]

6
Comments/Feedback Please Visit www.ti.com/ht
7
Full TI High Temperature Products Presentation
8
HiRel Business Segments
High Temperature
Enhanced Products
Space
Bare Die

• Complete High-Temp (HT) signal-chain solutions
  for harsh environments
• Unique Die and Packaging optimized for HT
• Thermal shut-down removal
• HT products offerings
• HT Plastic -55?C to 175?C
• HT Ceramic -55?C to 210?C
• HT Die -55?C to 210?C

• Commercial-of-the-shelf (COTS) plastic solution
  for long life-cycle applications
• Controlled baseline, traceability
• Extended Product Change Notification (PCN)
• Extended Temperature (-55C to 125C)
• Additional test coverage and characterization

• Ability to support complete signal chain
  solutions in die form
• Full Known-good die (KGD) for military, space and
  high temp applications
• Tested die (TD) for commercial applications
• Wafer support and small quantity waffle pack
  support

• Complete signal chain solution for Space
  environments
• QMLV-certified wafer fabs
• RHA certification
• Radiation hardening IP
• TID/SEE testing on products

9
TI HiRel Advantage
Commitment

• 30 years of experience working with HiRel
  customers
• Largest dedicated organization in the industry
• Worldwide sales and support infrastructure

• Leading-edge technology and manufacturing
• HiRel approved fabs (certified by Defense
  Aerospace standards)
• Access to latest process technologies (HPA07,
  BiCom, etc.)
• Broad packaging capabilities

As short as 9 months
As long as 30 years
ConsumerLife Cycle

• Extended product life cycles
• Obsolescence mitigation
• Supply beyond commercial availability
• Product resurrection

HiRel Products Life Cycle
Phase Out
Intro
Decline
Maturity
Growth

• Market expertise
• Baseline control and qualification per unique
  market requirements TID, SEU, high-temp,
  ceramic, QML Q/V, EP, die solutions, etc.

10
High temperature and harsh environments markets

• Down hole
• Drilling
• Logging
• Well monitoring

• Avionics
• Jet Engines
• Brakes

• Heavy Industrial
• Chemical Processing
• Sensors
• Actuation/Control

• Geothermal
• Drilling
• Well monitoring

• Medical
• Autoclave
• Sterilization

Market requirements

• Ruggedized packages
• Small size

• Low power
• Qualified operation gt150C

10
11
TI HiRel High Temperature Products

• Two HT Product Types
• High Temperature (HT) 200C parts
• -55C to 210C - 1000 hours
• Ceramic KGD packaging
• 175C Plastic Parts
• -55C to 175C operation
• Plastic surface mount packaging

12
HT Reliability

• There are 3 areas TI has developed expertise to
  guarantee reliability on our released HT products
• Initial qualification of process, package and
  silicon across temperature
• Silicon, Material set and Process modifications
• On-going production quality monitors

13
Parametric Characterization done for each HT
Release

• Functionality
• AC and DC Parametrics
• Speed / Performance
• Leakages Power Analysis
• IO Peripheral timing / performance

14
High Temperature 210C Quality and Reliability
These qualification tests are typically preformed
for each new 210C HT Ceramic product release

• Package Qualification
• Bond Strength
• Die Attach Strength
• Mechanical Shock (1.5K g)
• Constant acceleration (30K g)
• Technology Verification
• Electromigration Design Rule Verification
• Voltage Box Characterization
• Negative Bias Temperature Instability Rules
  Verification
• Operational Characterization (from three lots)
• Life Test (1000Hours/200C)
• By technology node (function, wafer fabrication
  process, and feature size)
• 2,000 hours at 200C, 1000 hours to release
• Static (e.g., Analog) or Dynamic (e.g. DSP/MCU)
• Sample size is 15 units minimum (3 lots) with no
  failures

• Variable Frequency Vibration (20 g peak 20Hz to
  2KHz)
• Temperature Cycle (-65C/150C 1000 cycles)
• Hermetic test (Fine and Gross Leak)
• Thermal Shock (-65C/150C 100 cycles)

15
New Leadform Packages
8-pin Ceramic FP
84-pin Ceramic QFP
16
Leadformed Releases
ADS8320SHKQ Released
OPA2333SHKQ Released
SN65HVD1040SHKQ Released
OPA211SHKQ Released
REF5025SHKQ Released
INA271SHKQ Released
INA129SHKQ Released
TPS76901SHKQ Released
SN65HVD233SHKQ Released
INA333SHKQ Released
THS4521SHKQ Released
SN65HVD11SHKQ Released
ADS1278SHKP Released
SM470R1B1MHKPS Released
17
175C Plastic Packages

• There are several ways TI provides a ruggedized
  plastic package for our 175C offerings
• We have a different material set than the
  commercial/industrial devices to improve
  reliability at temperature
• Special leadframe, mold compounds, and die attach
  to withstand the stresses from CTE mismatch
• Special bonding wires and processes to minimize
  Kirkendall voiding causing degraded bond strength

18
Differences in Flows
Commercial IC Flow - Cost Driven
EP Flow - Quality Driven
HT Plastic Flow - Quality and Temp Driven
Wafer Fab
Wafer Fab
Wafer Fab
One Wafer Fab
One Wafer Fab/HT Die
AT Site
AT Site
AT Site
AT Site
AT Site
Material Set
Material Set
Material Set
Material Set
HT Material Set
EP products are built in one FAB, one AT site
and use one material set for product build
Commercial products can be built in multiple
FABs, AT sites and may use various material
sets for each product build
HT products are built in one FAB, one AT site
and use one material set optimized for HT
19
175C Plastic Package Qualification
The following high temperature plastic package
qualification test sequence is required for each
pin/package and die technology combination in
addition to the EP standard qualification
requirements. Data can be combined from
different device types from the same pin/package
and die technology.

• Preconditioning (surface mount packages)
• HTSL (Bake) 2000 hours at TA TJ, where TJ is
  the maximum recommended operating temperature for
  the device type
• Temperature Cycle 500 cycles at -65C to
  150C
• Electrical Test per datasheet at 125C minimum
  with additional pin-to-pin leakage testing.
• CSAM 5 units/lot
• TSAM (PowerPad packages only) 5 units/lot
• Bond Pull 5 units/lot - 15 wires/device
• Bond Shear 5 units/lot - 15 bonds/device
• Cross section 1 unit/lot - 1 bond/unit or 1
  bump/pad

20
HT Plastic Qualification
Initial X-Ray

• Commercial plastic failing HT Qual
• Delamination
• Bond degradation

CSAM
Bond Pull
Bond Cross Section
Before
After
21
175C Plastic Package Summary

• TI HT Plastic parts use special leadframes, mold
  compounds, die attach, and bonding
• We have a material set different from the
  commercial/industrial devices to improve
  reliability at temperature
• Special leadframe, mold compounds, and die attach
  to withstand the stresses from CTE mismatch
• Special bonding wires and pad processes to
  mimimize Kirkendall voiding causing degraded bond
  strength

22
High Temperature Wafer Lot Qualification

• New qualification test performed on each HT wafer
  lot
• 45 units from every wafer lot used for HT
  products will be subjected to
• 210C burn in for 240 hours then,
• End point electrical testing at operating
  temperature of -55C t o 210C
• Requirement for all to pass standard HT tests
• Allows any parametric drifts to be observed
• Requirement for all new HT products beginning in
  2Q12.
• Allows HiRel to keep a tight monitor on all HT
  products to control process variations that might
  affect performance across temperature.

23
High Temperature Products
HT Advantage Qual
DC/DC Controller
Power FET
Point Of Load Power
Voltage Reference
Precision Op-Amp
Processor
Communication Interface
Flash Memory
TI HT Roadmap
Power Driver
Power FETs or BJTs
Precision Op-Amp
Digital To Analog Converter
24
High Temperature Qualified Data Converters
ADS1282-HT High Resolution ?S, 250SPS to 4KSPS
ADC
ADS1278-HT Octal Simult. Sampling 24-bit, 128KSPS
?S
ADS1243-HT Octal Low Power 24-bit ?S ADC
24
210
175
DIE
210
175
DIE
210
DIE
PFLC
ADS8509-HT 16-bit 250kHz CMOS ADC
16
175
ADS8320-HT 16-bit 2.7V to 5V µ-Power Sampling ADC
Resolution (Bits)
175
210
ADS6142-HT 14-bit, 65 MSPS ADC w/ selectable
outputs
14
PFLC
DIE
210
175
DIE
DAC
Released
Development
Planned
lt1
100K
250K
128K
4K
65M
Sample Rate (SPS)
25
High Temperature Qualified Instrumentation
Amplifiers
INA271-HT Voltage Output Wide Common-Mode Shunt
Monitor
10K
210
DIE
PFLC
INA128-HT Low Power Wide-Supply Instrumentation
Amp
50
Input Offset (µV)
210
175
INA333-HT Low Power Single Supply Instrumentation
Amp
Released
25
Development
210
DIE
Planned
PFLC
130
500
200
1,000
Bandwidth (kHz) for G100
26
High Temperature Qualified Amplifiers
High Temperature Qualified Amplifiers
LM95172 13 to 16-bit Digital Temperature Sensor
Temperature Sensors
210
THS4521-HT Single-Channel Rail-to-Rail Output
Differential Amp
Differential Amplifiers
210
175
DIE
PFLC
OPA2333-HT Very Low Power Zero-Drift Series
OPA211-HT 1.1nV/vHz 45MHz /-10V
OPA820-HT Unity-Gain Low-Noise Voltage Feedback
Op-Amp
Standard Op-Amps
210
175
210
150
210
PFLC
DIE
DIE
PFLC
PFLC
DIE
Released
Development
Planned
27
High Temperature Qualified Amplifiers
High Temperature Qualified Power Management
LM5116WG-HT Wide Range 100V Synchronous Buck
Controller
TPS40200-HT Wide Input, Low-pin Buck Controller
TPS40210-HT 4.5 to 52V Input Current-Mode Boost
Controller
DC/DC Controllers
210
DIE
210
175
210
DIE
DIE
PFLC
DRV8332-HT Motor Driver
Motor Driver
210
175
DIE
REF5025-HT 2.5V Precision Voltage Reference
Voltage References
210
DIE
PFLC
TPS50301-HT 3Amp, 3V to 7V Step-Down SWIFT
DC/DC Converter
TPS54362-HT 1Amp, 48V Step-Down SWIFT DC/DC
Converter
TPS62110-HT Adjustable, Step-Down Converter
DC-DC POL Converter
DC-DC POL Converter
175
175
210
Released
TPS7H1201-HT Single-Output 500mA Adjustable LDO
TPS76901-HT Single-Output 100mA Adjustable LDO
Development
LDO
Planned
210
DIE
210
175
DIE
PFLC
28
High Temperature Qualified Amplifiers
High Temperature Qualified Processors and Memory
SM470R1B1M-HT ARM 7 Microcontroller
SM320F2812-HT Digital Signal Controller
SM320F28335-HT Digital Signal Controller
MSP430-HT 16-bit Ultra Low Power MCU
Embedded Controllers
210
150
220
210
150
150
DIE
PFLC
DIE
DIE
DIE
OMAPL137-HT C674x DSP ARM9 Processor
Embedded Processors
175
DIE
SM28VLT32-HT 4MByte FLASH Storage Device Memory
Memory
210
Released
DIE
PFLC
Development
Planned
29
High Temperature Qualified Amplifiers
High Temperature Qualified Interface Products
SN65HVD1040-HT Low-Power CAN Transceiver with BUS
Wake-Up
SN65HVD233-HT CAN Transceiver with
Diagnostic Functions
CAN
210
175
210
DIE
PFLC
DIE
PFLC
ISO7221C-HT Dual High-Speed Digital Isolator
Isolators
175
SN65HVD11-HT 3,.3V RS485 Single Half-Duplex
Transceiver
RS485
Released
210
175
DIE
PFLC
Development
Planned
30
Introducing the H.E.A.T. EVM

• Harsh Environment Acquisition Terminal (H.E.A.T.)
  EVM
• Features and benefits
• Full high-temperature data acquisition system
  utilizing TIs comprehensive signal-chain product
  portfolio
• Eight Analog Input Channels
• Six channels optimized for temperature, pressure
  sensors and accelerometers
• Two general-purpose channels (fully differential
  and single-ended)
• Comprehensive set of TI components qualified for
• Operating temperatures from -55ºC to 210ºC
• Minimum 1,000 hours operating life
• Board is made with polyimide material, and
  incorporating high-temperature rated passive
  components and solder materials
• EVM is test oven ready and can withstand
  temperatures up to 200C for 200 operating hours.
  

31
H.E.A.T. EVM high-temperature components

• SM470R1B1M-HT ARM7 microcontroller
• ADS1278-HT octal simultaneous sampling 24- bit
  128KSPS ADC
• OPA211-HT low-noise operational amplifier

• OPA2333-HT low power zero-drift series
  operational amplifier
• INA333-HT zero drift, low power, single supply
  instrumentation amplifier
• THS4521-HT low-power fully differential
  amplifier

• REF5025-HT 2.5V precision voltage reference
• SN65HVD233-HT CAN transceiver
• SN65HVD11-HT RS485 transceiver

32
New HT Design Support for 2013

• H.E.A.T. Power Reference Design
• Demonstrating TI HT power solutions
• Sequencing
• TPS50301-HT POL Evaluation Board
• Standard temperature board and evaluation
• Spot for TPS7H1201-HT LDO when available
• HT FLASH EVM
• Generic HT Op Amp Board

33
PowerHEAT EVM w/ Voltage Sequencing

• Output Voltages
• 3.3V uP
• 3.3V Adc ( Analog)
• 1.8V uP
• 1.8V Adc (Analog)
• 5.0V Adc (Analog)

34
HIGH TEMP POL EVM
35
Generic HT Op Amp Board

• Unpopulated HT board for oven evaluations
• Options for multiple configurations

36
4MB HT Flash EVM Board

• Simple HT board allowing oven testing of 14-pin
  ceramic package

37
TI High Temperature Products

• HT Webpage http//www.ti.com/ht
• TI HiRel Contact
• Mont Taylor
• mont-taylor_at_ti.com
• [phone]

38
Comments/Feedback Please Visit www.ti.com/ht
39
HT Product one page overview slides
40
Released
ADS1278-HT Octal Simultaneous Sampling 24-Bit
128KSPS ADC
Features
Benefits

• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Selectable Operating Modes

• Simultaneous Sampling of 8 inputs up to 128KSPS
  Data Rate _at_ 103 dB SNR
• Low-Power 52 kSPS, 57 mW/ch
• SPI or Frame-Sync Serial Interface
• AC Performance
• -96 dB THD
• 101 dB SNR (High Resolution Mode)
• Linear Phase Digital Filter
• Modulator Output Option (digital filter bypass)
• ENOB 16.9 bits at 210C

Mode Data Rate SNR Power Diss.
High Speed 128kSPS 96dB 985mW
High Resolution 52kSPS 101dB 985mW
Low Power 52kSPS 97dB 455mW
Low Speed 10kSPS 98dB 120mW
Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range and Package

• -55C to 175C (64-pin Plastic QFP (PAP) 1Q13
• -55C to 210C (84-pin Ceramic QFP (HFQ) KGD)
• -55C to 210C (4Ceramic Lead-formed FP (HKP))

41
ADS1282-HT Ultra-High Performance ?S ADC with
Low-Noise PGA
Released
Features
Benefits

• Extremely High Resolution
• 122-dB SNR (250 SPS, High-Res. Mode)
• 119-dB SNR (250 SPS, Low-Power Mode)
• Ultra-Linear THD 101 dB, INL 0.5ppm
• Flexible Data Rate 250SPS to 4KSPS
• Onboard High Performance Digital Filter
• SINC FIR IIR (selectable)
• Linear or Minimum Phase
• 0.5Hz to 7.5Hz High Pass
• Filter Bypass Mode
• Low Power 56.1 mW (High-Res. Mode) and 46.1
  mW (Low-Power Mode)

• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range and Package

• -55C to 175C (28-pin Plastic TSSOP (PW))
  Released
• -55C to 210C (28-pin Ceramic DIP (JDJ) KGD)
  Released

42
ADS1243-HT Octal Low Noise Low-Power 24-Bit ADC
Released
Features
Benefits

• 24-Bits No Missing Codes
• Up to 8 Inputs Channels and Eight Data I/Os
• Programmable 15SPS Data Output Rates
• Internal Input Buffer and PGA
• 21-Bits Effective-Resolution (PGA1)
• On-Chip Calibration
• Highly linear (no linearity below 15ppm)
• Simultaneous 50 Hz and 60 Hz Rejection
• Single-Cycle Settling
• External Differential Reference of 0.1V to 5V
• SPI Interface Compatible
• 1ppm of full-scale Noise Performance
• 600 µW/ch power consumption
• 20-pin Ceramic FP (SJD), KGD and PW packages

• Multiple transducer signals can be easily sampled
  using the internal multiplexer
• Allows user to measure input signals from 20mV
  (full-scale) to VDD
• Allows user to easily correct for off-set errors
  by issuing a calibration command
• Enables high accuracy measurements throughout
  entire input range
• Excellent 50 and 60Hz Rejection
• Controlled Baseline
• One Assembly/Test Site Fabrication Site
• Extended Product Life Cycle
• Product Traceability

Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C Released
• -55C to 175C Potential

43
ADS8320-HT 16-Bit High-Speed, 2.7 to 5V
microPower Sampling ADC
Released
Features
Benefits

• Pin-out compatible with ADS7816 and ADS7822
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

• 16-Bit, 100kHz Sampling Rate
• MicroPOWER
• lt4mW at 100kHz and 2.7V
• Power-Down lt60 uW
• Serial SPI and SSI Interface
• 8-pin Ceramic FP (HKJ) Package and KGD

Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C (8-pin Ceramic FP (HKJ) and KGD)
  Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released

44
ADS8509-HT 16-Bit 250KSPS True Bipolar Serial ADC
Released
Features
Benefits

• Pin Compatible With ADS7809
• Low Off-Set
• Very Low Off-set Drift
• Data can be read during device power-down
• Highly Integrated- with onboard reference,
  reference buffer and conversion clock
• Long-term stability from No Probing Laser Trim
• Controlled Baseline
• One Fabrication and Assembly/Test Sites
• Extended Product Life Cycle
• Product Traceability
• Selectable Operating Modes

• 250-kHz Sampling Rate
• 4V, 5V, 10V, 3.33V, 5V, 10-V Input Ranges
• SPI Compatible Serial Output
• Daisy-Chain (TAG) Feature
• On board reference, reference buffer Clock
• Internal or External Reference
• Low Power Dissipation at 250 KSPS
• Simple DSP Interface
• 20-pin Plastic (DB) Package

Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 175C Released

45
Released
ADS6142-HT Low-Power High-Performance 14-bit, 65
MSPS ADC w/ Selectable outputs
Features
Benefits

• Highest performance 14-bit available gives best
  performance in extended temperatures
• Better dynamic performance, Gain, and
  programmability enables more margin
• Low power enhances battery life and reduces
  thermal effects
• Gain and other programmable settings allow device
  to be optimized to your needs
• Controlled Baseline
• One Fabrication and Assembly/Test Site
• Product Traceability
• Extended Product Life Cycle
• Extended Product-Change Notification

• 14-bit resolution with No Missing Codes
• Maximum Sample Rate 125 MSPS
• Selectable LVDS or CMOS outputs
• No External Decoupling required for Reference
• 74.7 dBFS SNR, 95 dBc SFDR at 50MHz IF
• Internal coarse and fine gain settings
• 73.5 dBFS SNR, 96 dBc SFDR _at_ 50MHz IF
• 70.4 dBFS SNR, 80 dBc SFDR _at_ 170MHz IF
• Low power dissipation 285mW (CMOS)
• Programmable Output Clock Position and Drive
  Strength to Ease Data Capture
• 32-pin plastic package and KGD

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -40C to 210C KGD Released
• -55C to 175C (Plastic) RTM 2H13

46
Released
LM95172 13-Bit to 16-Bit 200C Digital Output
Temperature Sensor with 3-Wire Interface
Features
Benefits

• Analog and Digital Supply Voltage 3.0V -5.5V
• Total Operating Supply Current 400 µA (Typ)
• Shutdown -40C to 175C ? 12 µA
• Shutdown -40C to 200C ? 28 µA
• Temperature Accuracy
• 175C to 200C ? 3.0C (max)
• 160C to 175C ? 2.0C (max)
• Temperature Resolution
• 13-bit 0.0625C/LSB
• 16-bit 0.0078125C/LSB
• Conversion Time
• 13-bit 43 ms (Max)
• 16-bit 350 ms (Max)
• 10-pin Ceramic Dual Flat-Pack Package

• Shutdown mode saves power yet wakes up for
  one-shot temperature update
• Integrated linear ?S ADC produces high accuracy,
  fast conversion rates and extremely low output
  noise which improves system performance
• Universal SPI and MICROWIRE Bus interface
  standards provides flexibility
• High noise immunity of the Serial I/O (SI/O)
  output is ideal for challenging electromagnetic
  environments
• Controlled Baseline
• One Fabrication and Assembly/Test Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• Automotive high temperature applications
• Heavy Industrial Power Controllers
• Heavy Industrial motors, gear boxes
• Geothermal instrumentation
• High Temperature Test Equipment

Temperature Range

• -40C to 200C

47
Released
INA129-HT Precision, Low Power Instrumentation
Amplifiers
Features
Benefits

• Low Offset Voltage
• Low Drift 1µV/C max
• Low Input Bias Current 50nA max
• High CMRR 110dB min
• Inputs Protected To 40V
• Wide Supply Range 2.25V to 18V
• Low Quiescent Current 2mA
• 8-pin Ceramic Dual FP (HKJ) and Ceramic DIP
  (JDJ) Packages and KGD

• Ideal for Bridge, Thermo-couple, and RTD Sensor,
  Amplifier and Data Acquisition applications
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C (8-pin Ceramic Dual FP (HKJ))
  Released
• -55C to 210C (8-pin Ceramic DIP (JD) KGD)
  Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released

48
Released
INA333-HT Micro-Power, Zero Drift, Low Power,
Single Supply Instrumentation Amplifier
Features
Benefits

• Low Offset Voltage 15uV
• Low Drift 0.2uV/C
• Low Input Bias Current 2044pA max
• Input Voltage Noise 55nV/rt-Hz, 1kHz
• Supply Current 345uA max
• Wide Supply Range 1.8V to 5.5V
• RFI Filtered Inputs
• 8-pin Ceramic Dual FP (HKJ), Ceramic DIP (JD)
  Packages, KGD, and Plastic SOIC (D)

• Creates excellent accuracy
• Ideal for maximum power efficiency
• Easy compatibility for battery powered apps
• Great for high impedance applications
• Low Noise
• Enables high accuracy
• Enhances noise immunity
• Controlled Baseline
• One Fabrication and Assembly/Test Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C (8-pin Ceramic Dual FP (HKJ))
  Released
• -55C to 210C (8-pin Ceramic DIP (JD) KGD)
  Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released
• -55C to 175C (8-pin Plastic SOIC (D))
  Potential

49
Released
INA271-HT Voltage Output High-Side Current Shunt
Monitor
Features
Benefits

• Eliminates need for additional protective
  components in the event of supply reversals
• Buffered output with filtering for simplified use
  in current control loops
• Preserves buffered voltage output
• Saves using an additional Op-Amp
• Controlled Baseline and Product Traceability
• One Fabrication and Assembly/Test Site
• Extended Product Life Cycle
• Extended Product-Change Notification

• -16V to 80V common-mode range
• Extended Bandwidth Up to 130kHz
• Split stages for filtering
• Two gain option family
• INA270 20 V/V (potential)
• INA271 14 V/V

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C (8-pin Ceramic Dual FP (HKJ)
  KGD) Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released
• -55C to 175C (8-pin Plastic SOIC (D))
  Potential

50
THS4521-HT One Channel RRO Ultra Low Power Fully
Differential Amplifier
Released
Features
Benefits

• Low quiescent current
• Delivers high accuracy for 24-bit conversion
• Allows easy DC coupling to ADC
• Larger outputs with low voltage applications
• Flexible supply for power sensitive apps
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• Low Iq, Power-Down mode
• Bandwidth 145 MHz, Slew Rate 490 V/µs
• Low Input Voltage Noise
• Negative rail input output Common-Mode Control
• RRO Rail-to-Rail Output
• Single, Dual and Quad options
• 2.5 to 5.5 (or 1.25V to 2.75) Supply
  Operation
• 8-pin Ceramic Dual FP (SHK) and KGD

THS4521 Driving a 24-bit Delta Sigma ADC
Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range and Package

• -55C to 175C (8-pin Plastic SOIC (D))
• -55C to 210C (8-pin Ceramic Dual FP (SHK) and
  KGD) Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released

51
INA128-HT Precision, Low Power Instrumentation
Amplifiers
Released
Features
Benefits

• Low Offset Voltage
• Low Drift 1µV/C max
• Low Input Bias Current 30nA
• High CMRR 120dB min
• Inputs Protected To 40V
• Wide Supply Range 2.25V to 18V
• Low Quiescent Current 2mA
• 8-pin Plastic SOIC (D) Package

• Ideal for Bridge, Thermo-couple, and RTD Sensor,
  Amplifier and Data Acquisition applications
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 175C Released

52
Released
OPA2333-HT Very Low Power Zero-Drift Series
Operational Amplifier
Features
Benefits

• Low Offset and Drift Removes Need for Calibration
  in Application
• RRIO Increases Dynamic Range
• 1.8V Supply Excellent for Battery Devices
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• Ultra-Low Quiescent Current 80µA (max)
• Low Offset Voltage 26µV (max)
• Offset Voltage Drift 0.05µV/C
• Low Voltage Noise 1.5 µVP-P
• Bandwidth 350kHz
• Rail-to-Rail Input and Output
• Single-Supply Operation
• 1.8V to 5.5V Supply Voltage

Applications

• Down-Hole Drilling
• High Temperature Environments
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range and Package

• -55C to 175C (8-pin Plastic SOIC (D)) -
  Released
• -55C to 210C (8-pin Ceramic DIP (JD),
  Ceramic FP (HKJ) and
  KGD) Released
• -55C to 210C (8-pin Ceramic Lead-formed
  FP (HKQ)) Released

53
Released
OPA211-HT Lowest Power 1.1nV/vHz 36V Operational
Amplifier
Features
Benefits

• Low Noise Bipolar Input 1.1nV/vHz at 1kHz
• Low Offset Voltage 260µV (max)
• Low Offset Voltage Drift 2µV/C (max)
• Low Quiescent Current 7.5mA (max)
• Wide Gain Bandwidth 80MHz _at_ G100
• Wide Supply Range 2.25 to 18V
• Slew-Rate 27V/µs
• 16-Bit Settling 750 ns
• Output Current 30 mA
• Rail-to-Rail Output (unique in industry)
• 8-pin Ceramic QFP (HKJ) Package and KGD

• Provides Minimal Signal Distortion
• Very High Signal Accuracy
• Very Wide Dynamic Range
• Spans 5V to Full Industrial Range
• Maximum Amplification at any VCC Range
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C (8-pin Ceramic QFP (HKJ) and
  KGD)Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released

54
OPA2211-HT Dual Lowest Power 1.1nV/vHz 36V
Operational Amplifier
Development
Features
Benefits

• Provides Minimal Signal Distortion
• Very High Signal Accuracy
• Minimal Offset Change Over Temperature
• Lowest Power at this Noise Level
• Very Wide Dynamic Range
• Spans 5V to Full Industrial Range
• Maximum Amplification at any VCC Range
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

• Low Noise Bipolar Input
• Low Offset Voltage
• Low Offset Voltage Drift
• Low Quiescent Current
• Wide Gain Bandwidth
• Wide Supply Range 2.25 to 18V
• Slew-Rate 27V/µs
• Output Current 30 mA
• Rail-to-Rail Output
• 8-pin Plastic SOIC (D) Package

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 175C

55
Released
TPS40200-HT Wide Input, Low Pin Count Buck
Controller
Features
Benefits

• 5.5V to 52V operation
• Voltage Mode Control with Feed Forward
  Compensation
• 753mV Voltage Reference
• Internal Under-Voltage Lockout
• Programmable Frequency (35kHz-500 kHz)
• Programmable Over-current Protection
• Frequency Synchronization
• Closed Loop Soft Start
• Integrated Driver

• Many Applications w/ Wide input range
• Voltage feed forward great line regulation,
  fast transient response
• Programmability allows frequency, over-current
  protection under voltage lockout
• Softstart enables smooth controlled power up
• Minimal external components needed
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range and Package

• -55C to 175C (8-pin Plastic SOIC (D))Released
• -55C to 210C (8-pin Ceramic FP (HKJ) and
  KGD) Released
• -55C to 210C (8-pin Ceramic Lead-formed
  FP (HKQ)) Released

56
Released
TPS40210-HT 4.5 to 52V Input Current Mode Boost
Controllers
Features
Benefits

• Prevents inrush current
• Enables use of small ISENSE resistors with lower
  power dissipation
• Design and implementation flexibility
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• Soft Start
• Enable function
• Externally compensated
• Low ISENSE threshold (150mV)
• Supports Boost, Flyback, and SEPIC topologies
• 10-pin Ceramic DFP (HKK) Package, KGD, and
  Plastic TBD

VIN 4.5V-52V UVL
N-channel FET gate driver 500mA drive current
Freq adj., 35KHz-1MHz
Soft Start prevents inrush current has time-out
timer when in OCP
Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

ENABLE for on/off control
External compensation for design flexibility
Senses switch current and sets OC threshold low
Isense threshold enables use of small resistor,
and lower power dissipation
Provides current feedback in the control loop
detects an OC based on 150mV threshold
Temperature Range

• -55C to 210C Released
• -55C to 175C (Plastic TBD) Potential

57
Development
LM5116WG-HT Wide Range 100V Synchronous Buck
Controller
Features
Benefits

• Emulated peak-current mode
• Wide Input Operating Range up to 100V
• Low IQ shutdown (lt10µA)
• Programmable Soft Start
• Free-run or synchronous operation 50kHz-1MHz
• Optional diode emulation mode
• Drives standard or logic level MOSFETs
• Robust 3.5A peak gate drive
• Programmable output from 1.215V to 80V
• Precision 1.5 voltage reference
• Programmable current limit
• Programmable line under-voltage lockout
• Automatic switch to external bias supply
• 16-pin Ceramic DIP (HKK), KGD, Plastic TBD

• Reduces PWM circuit noise sensitivity found in
  peak-current mode controllers - allowing reliable
  control of very small duty cycles
• Supports high-voltage or wide-varying input
  supply applications
• Provides Low standby mode dark current
• Enables smooth well controlled power-up
• Slow Switching-Frequency allows higher efficiency
  and smaller duty-cycles while Fast
  Switching-Frequencies enable smaller space
• Enables discontinuous mode operation for improved
  efficiency at light loads
• Controlled Baseline
• One Fabrication and Assembly/Test Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C 16-pin Ceramic DIP RTM 3Q13

58
DRV8332-HT Three Phase PWM Motor Driver
Development
Features
Benefits

• High linearity of output signals to guarantee
  precise and smooth operation
• No external snubber schottky diodes
• Unmatched on-chip protection reduces design
  complexity and enables higher system reliability
• Controlled Baseline and Product Traceability
• One Fab site and Assembly/Test Site
• Extended Product Life Cycle
• Extended Product-Change Notification

• Highest power integrated drive on the market
• Supply Voltage up to 50V (70V abs max)
• Output Current 8A RMS/13A peak/Bridge
• Advanced arch. with high efficiency up to 97
• PWM operation frequency up to 500kHz
• Low RDSON MOSFETs (80mO)
• Intelligent gate drive and cross conduction
  prevention
• Short dead time (5ns)
• Spike voltage control to reduce overshoot
• Integrated Protection Features
• Programmable cycle-by-cycle current limit
• Two stage thermal protection
• 44-pin plastic DDV Package

Applications

• Down-Hole Drilling
• Brushless DC Motors
• Vibration Analysis
• Pressure Sensors
• Actuators and Pumps

Temperature Range

• -55C to 175C RTM 7/30/13

59
Released
REF5025-HT 2.5V Precision Voltage Reference
Features
Benefits

• Low Noise
• High Accuracy
• Low Temperature Drift 40 ppm/C
• High output Current 7mA
• 2.5V Voltage Output
• Wide Supply 3.25V to 18V
• Thermal Shutdown Removed
• 8-pin Ceramic DFP (HKJ) Package, KGD, and
  Plastic (DGK)

• High Accuracy and Low Noise for High Resolution
  Precision Applications
• Minimize system error over temperature
• Directly provide accurate voltage reference to
  ADC without additional op amp buffer
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C (8-pin Ceramic DFP (HKJ) and
  KGD)Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released
• -55C to 175C (8-pin Plastic (DGK)) Potential

60
Released
TPS62000-HTAdjustable, High Temperature
Step-Down Converter
Features
Benefits

• Robust general purpose DC/DC converter
• Low quiescent current
• Supports low voltage DSPs and processors
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• 2V to 5.5V input voltage range
• High Efficiency
• 300-mA output current
• Output voltage adjustable(0.9V to 5V)
• 1.4-mA quiescent current (typ)
• 500 KHz switching frequency
• Thermal Shutdown Removed
• 10-pin Ceramic DFP (HKK) Package and KGD

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C

61
TPS62110-HT 17Vin, 700 mAOUT Step-Down Converter
Released
Features
Benefits

• High Efficiency
• Input Voltage 3.1V to 17V
• Output Voltage 1.2V to 16V(TPS62110)
• Output Current 700 mA
• Low Quiescent Current
• Switching Frequency 1.0MHz
• Thermal Shutdown Removed
• 16-pin Plastic TSSOP (PWP) Package

• Highest integration (FETs and Diode integrated)
• Smallest foot-print with only a small Inductor
  needed
• High efficiency and easy-to-use functionality!
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Wide Input Voltage
Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 175C

62
TPS54362-HT 1Amp, 48V Step-Down DC/DC Converter
With Low IQ Buck Converter
Released
Features
Benefits

• Wide Inp Voltage Range 4.8V to 48V
• 60V Load Dump protection
• Max. Load Current 1A
• Adjustable Output Voltage 0.9V to 18V
• Shutdown current lt5 µA typical
• Adjustable Frequency 200kHz to 2.2MHz
• Synchronization to external clock
• Soft start controlled with external capacitor
• Output Switch slew rate control
• Reset function with de-glitch timer
• Reset threshold and delay programmable
• Over voltage detect Programmable
• Thermal Shutdown Removed
• 20-pin Plastic HTSSOP (PWP) Package

• Low dark current in standby mode
• Wide input voltage range, no external protection
  required
• Integrated Voltage supervisor
• Smaller LC Output filters
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 175C

63
TPS50301-HT 3V to 6.3V Input, 3Amp Synchronous
Step-Down SWIFT Converter
Released
Features
Benefits

• Split Power Rail 3V to 6.3V on PVIN
• Integrated Power MOSFETS
• Load Current of 3-A at 210C
• Monotonic Start-Up into Pre-Biased Outputs
• Flexible Switching Frequency Options
• 300kHz 1MHz Adjustable Internal Oscillator
• External Sync capability from 100KHz 1MHz
• Sync pin can be configured as a 500KHz output for
  Master/Slave applications
• Low 100-µA Shutdown Quiescent Current
• Adjustable Under voltage Lockout
• 20-pin Ceramic FP (HKH) Package

• 90 Peak Efficiency Optimized for Low Output
  Voltages
• Minimal external RCL components
• Easy On/Off Control
• Self-Protected from Fault Conditions
• Supported by SwitcherPro Software tool
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C Released

64
Released
TPS76901-HT Single Output LDO, 100mA, Adjustable
Features
Benefits

• Ultra-low quiescent current LDO
• Extends Battery Life and saves space in portable
  designs
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• 100 mA output current
• Adjustable output voltage
• Vin up to 10V Max
• Family includes numerous voltage options
• Logic enabled shutdown puts the LDO in standby
  and reduces supply current
• Thermal Shutdown Removed

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range and Package

• -55C to 175C (5-pin Plastic SOT (DBV))
  Released
• -55C to 210C (8-pin Ceramic DFP (HKJ) and KGD)
  Released
• -55C to 210C (8-pin Ceramic Lead-formed FP
  (HKQ)) Released

Prev
65
Released
MSP430F2619S-HT 16-Bit Ultra-Low-Power MCU
Features
Benefits

• 120KB256B Flash Memory
• 4KB RAM
• 12-Bit ADC
• Dual DAC
• 2 USCI
• Thermal Shutdown Removed
• 64-pin Plastic QFP (PM) Package

• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 150C

66
Released
SM320F2812-HT Digital Signal Controller
Features
Benefits

• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• Processor Performance
• 110-120 MIPS with Flash Acceleration Tech
• 150 MIPS out of RAM for time-critical code
• Memory
• 128Kw Flash
• External memory interface (XINTF) supports
  systems w/ larger memory models
• Control Peripherals
• PWM outputs interfaces for three 3-phase motors
• 12-bit ADC
• 172-pin Ceramic QFP (HFG) Package and KGD

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 220C

67
Released
SM320F28335-HT Digital Signal Controller
Features
Benefits

• Processor Performance
• 200 MFLOPS_at_100MHz, Single-cycle MAC
• 6-ch DMA support for EMIF, ADC, McBSP
• Memory
• Up to 512KB flash and 68KB RAM
• Configurable 16- or 32-bit EMIF
• Control Peripherals
• PWM outputs interfaces
• 6 High-resolution PWM outputs
• Highest-speed on-chip ADC
• Communications Ports
• Each McBSP configurable as SPI, CAN 2.0b with 32
  mailboxes, I2C at 400 Kbps
• Development Tools
• Code Composer StudioIDE
• 181-pin Ceramic PGA (GB) Package and KGD

• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 210C

68
Released
SM470R1B1M-HT Arm 7 Microcontroller
Features
Benefits

• ARM7TDMI Compatible
• Thumb extension
• Debug module
• Multiplier with JTAG Interface
• Performance Enhancements
• ARM7 CPU Accelerator
• 60 MHz RISC Co-Processor
• High Performance DMA
• TMS470R1B1M
• 1024 HB Flash and 64 KB RAM
• 12-Channel ADC
• 16 Channel DMA
• 84-pin Ceramic QFP (HFQ) and 144-pin Plastic LQFP
  (PGE) Packages KGD

• Open-Architecture w/ Full 3rd Party Support
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• Acoustics

Temperature Range

• -55C to 220C (84-pin Ceramic QFP (HFQ) and
  KGD) Released
• -55C to 175C (144-pin Plastic LQFP (PGE))
  RTM 4Q12

69
OMAPL137-HT C674x DSP ARM9 Processor
Released
Features
Benefits

• Dual CPU Cores
• ARM926EJ-S (MPU)
• C674x DSP Core
• Memory
• ARM 16K I, 16K D, 64K ROM
• DSP 32K L1D, 32K L1P, 256K L2 Cache, 128K RAM
  and 1MB ROM
• Peripherals (1.8/ 3.3V IOs)
• 10/100 Ethernet MAC
• EMIF1Supports 133MHz SDRAM 16/32-bit
• EMIF2Supports Async/NAND Flash 8/16 bit
• USB 2.0
• UHPI, McASP (3), UART(3), I2C(2), SPI(2), RTC,
  Timers (3)

• Compatible with C6747 DSP
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors

Temperature Range and Package

• -55C to 175C (176-pin Plastic QFP (PTP))
  Released
• -55C to 175C (KGD)

70
SM28VLT32-HT 4-Mbyte Flash Storage Device Memory
Released
Features
Benefits

• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification

• 32-Megabit Flash Memory Device
• Serial Peripheral Interface (SPI) Compatible
• 3.3-V Supply for IO, 1.8 V for Core
• 2-M x 16-Bit Word Access
• Synchronous Read/Write/Erase Operations
• Sector Protection Through Programmable Hardware
  Locks
• 20-MHz Maximum Clock Frequency
• Built-In-Self-Test (BIST)
• Data Retention 1000 hrs
• 14-pin Ceramic FP (HKN) Package and
  KGD

Applications

• Down-Hole Drilling
• High Temperature
• Vibration Analysis
• Pressure Sensors
• General Data Collection Applications at Extreme
  High/Low-Temperatures

Temperature Range

• -55C to 210C

71
SN65HVD233-HT CAN High-Temp Transceiver With
Diagnostic Functions
Released
Features
Benefits

• Device is unharmed by shorts to these voltages
• Compatibility with existing signaling schemes
• Up to 120 nodes on bus
• Ideal for microcontrollers and DSPs
• Hot pluggable without data Corruption
• Loopback for Diagnostic Functions Available
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

• Bus pin short-circuit protection to 36V
• ESD protection exceed 16kV
• Designed for signaling rates up to 1 Mbps
• High Impedance
• 3.3 V supply
• Glitch free power up power down protection
• Thermal Shut-down removed

Applications

• Down-Hole Drilling
• High Temperature Environments
• CAN Data Bus
• Industrial Automation

Temperature Range and Package

• -55C to 175C (8-pin Plastic SOIC (D))
  Released
• -55C to 210C (8-pin Ceramic FP, Ceramic DIP
  (JDJ), and KGD) Released

72
ISO7221C-HT Dual High-Speed Digital Isolator
Released
Features
Benefits

• Silicon Integrated SiO2 Dielectric Capacitor
• 025 Mbps and DC Signal Pass with Fail Safe
• 25 Mbps Signaling Rate
• TTL Inputs
• 1ns Skew, 1ns Jitter, 2ns Pulse Distortion
• Input Threshold, Noise Filter
• High Magnetic Immunity (1E6 gt Inductive)
• 3-KV HBM ESD on All Pins
• 3.3V and 5V Supply Supported
• Estimate 3000-V Max Isolation
• 8-pin Plastic SOIC (D) Package

• Proven Reliability of SiO2 Dielectric
• Low Skew, Jitter, Pulse Width Distortion
• Filters Noisy Signals before Entering System
• High Immunity for Noisy Environments
• High Reliable in Harsh Environments
• Flexibility with Power Supplies
• Highly Reliable in Harsh Environments
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

Applications

• Down-Hole Drilling
• High Temperature Environments
• Industrial Controls (PLC, Servo, Motor Control,
  Sensors)
• Power Supply/Regulation Systems
• Industrial Automation (Fieldbus, Modbus,
  Profibus, Device Net Data Buses, Smart
  Distributed Systems (SDS), CAN, RS485, USB
• Automotive Electronics Hybrid Vehicles

Temperature Range

• -55C to 175C

73
SN65HVD11-HT 3.3V RS-485 High-Temp Single
Half-Duplex Transceiver
Released
Features
Benefits

• Based on ANSI TIA/EIA-485-A
• Operate with single 3.3-V supply
• Speed of 10Mbps
• Common-mode voltage range (-7V to 12V)
• 16-kV HBM Bus I/O ESD protection
• Failsafe receiver for open circuit, short circuit
  and idle-bus conditions
• gt41mV receiver input hysteresis
• Glitch free power up power down protection
• Industry standard SN75176 pinout
• Thermal Shut-down removed
• 8-pin Ceramic FP (HKJ), CDIP SB (JDJ), KGD, and
  Plastic SOIC (D) offerings

• RS-485 standard versatile
• Ideal for use with DSPs
• Enables use in long cable networks
• Extended ESD level of protection
• Protected in all situations
• Rejects spurious noise signals and prevents false
  changes in the receiver output state
• Hot pluggable without data Corruption
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability

Applications

• Down-Hole Drilling
• High Temperature Environments
• Digital Motor Control

Temperature Range

• -55C to 175C (8-pin Plastic SOIC (D) Package
  Released
• -55C to 210C (8-pin Ceramic FP (HKJ) Package)
  Released
• -55C to 210C (8-pin Ceramic DIP SB (JDJ)
  Package) Released
• -55C to 210C (Known-Good-Die) Released
• -55C to 210C (8-pin Cera