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IGBT Gate Driver Calculation

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Gate Driver Requirement IGBT Gate Driver Calculation What is the most important requirement for an IGBT driver ? – PowerPoint PPT presentation

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Title: IGBT Gate Driver Calculation


1
IGBT Gate Driver Calculation
  • Gate Driver Requirement

2
What is the most important requirement
for an
IGBT driver ?
  • Gate Peak current

3
  • Which gate driver is suitable for the module SKM
    200 GB 128D ?

reverse recovery current Diode should be - 1.5 x
I diode by 80 degree case 130A x 1.5 195A
Design parameters fsw 10 kHz Rg ?
Gate resistor in range of test gate resistor
Conditions for a safety operation
4
How to find the right gate resistor ?
195A max reverse recovery current
Rg 7 Ohm
Two gate resistors are possible for turn on and
turn off Ron 7 Ohm Roff 10 Ohm
5
Difference between Trench- and SPT Technology
  • Trench Technology needs a smaller Gate charge
  • Driver has to provide a smaller Gate charge
  • SPT Technology needs more Gate charge compared to
    Trench Technology
  • Driver has to provide a higher Gate charge

6
Driver performance different IGBT technologies
needs different gate charge
  • Trench IGBT with same chip current

Gate charge is 2.3 uC
7
Driver performance different IGBT technologies
needs different gate charge
  • SPT IGBT with same chip current

Gate charge is 3 uC
8
  • The suitable gate driver must provide the
    required
  • Gate charge (QG) power supply of the driver
    must provide the average power
  • Average current (IoutAV) power supply
  • Gate pulse current (Ig.pulse) most important
  • at the applied switching frequency (fsw)

Demands for the gate driver
9
  • Gate charge (QG) can be determined from fig. 6 of
    the SEMITRANS data sheet

The typical turn-on and turn-off voltage of the
gate driver is VGG 15V VGG- -8V
15
-8
? QG 1390nC
1390
Determination of Gate Charge
10
  • Calculation of average current
  • IoutAV P / ?U ?V Vg -Vg
  • with P E fsw QG ?V fsw
  • ? IoutAV QG fsw
  • 1390nC 10kHz 13.9mA

Absolute value
Calculation of the average current
11
Power supply requirements
  • Gate charge
  • The power supply or the transformer must provide
    the energy (Semikron is using pulse transformer
    for the power supply, we must consider the
    transformed average power from the transformer)
  • Average current
  • Is related to the transformer

12
  • Examination of the peak gate current with minimum
    gate resistance
  • E.g. RG.on RG.off 7?
  • Ig.puls ?V / RG Rint 23V / 7? 1? 2.9 A

Calculation of the peak gate current
13
Pulse power rating of the gate resistor
  • P total Gate resistor
  • Ppulse Gate resistor I out AV x ?V
  • More information

The problem occurs when the user forgets about
the peak power rating of the gate resistor. The
peak power rating of many "ordinary" SMD
resistors is quite small. There are SMD
resistors available with higher peak
power ratings. For example, if you take an SKD
driver apart, you will see that the gate
resistors are in a different SMD package to all
the other resistors (except one or two other
places that also need high peak power).
The problem was less obvious with through hole
components simply because the resistors were
physically bigger. The Philips resistor data
book has a good section on peak power ratings.
14
  • The absolute maximum ratings of the suitable gate
    driver must be equal or higher than the applied
    and calculated values
  • Gate charge QG 1390nC
  • Average current IoutAV 13,9mA
  • Peak gate current Ig.pulse 2.9 A
  • Switching frequency fsw 10kHz
  • Collector Emitter voltage VCE 1200V
  • Number of driver channels 2 (GB module)
  • dual driver

Choice of the suitable gate driver
15
  • According to the applied and calculated values,
    the driver e. g. SKHI 22A is able to drive
    SKM200GB128D
  • Calculated and
  • applied values
  • Ig.pulse 2.9 A_at_ Rg 7? R int
  • IoutAV 13.9mA
  • fsw 10kHz
  • VCE 1200V
  • QG 1390nC

Comparison with the parameters in the driver data
sheet
16
  • PCB Driver and PCB mountable Driver for single,
    half bridge, six pack modules
  • integrated potential-free power supply
  • switching frequency up to 100kHz
  • output peak current up to 30A
  • Gate charge up to 30µC
  • dv/dt capability up to 75kV/µs
  • high EMI immunity
  • TTL- an CMOS-compatible inputs and outputs with
    potential isolation via opto coupler or
    transformer (isolation up to 4kVAC)
  • protection (interlock, short pulse suppression,
    short circuit protection via VCE -monitoring,
    under voltage monitoring, error memory and error
    feedback)

SEMIDRIVER
17
Product overview (important parameters)
18
  • Simple
  • Adaptable
  • Expandable
  • Short time to market
  • Two versions
  • SKYPER (standard version)
  • SKYPER PRO (premium version)

Driver core for IGBT modules
19
  • SKYPER
  • Driver board
  • SEMIX 3 IGBT half bridge
  • with spring contacts

Assembly on SEMiXTM 3 Modular IPM
20
take 3 for 6-packs
with adapter board
solder directly in your main board
modular IPM using SEMiX
SKYPER more than a solution
21
Selection of the right IGBT driver
  • Advice

22
Problem 1--------------------- Cross conduction
Low impedance
23
vGE,T1(t) vGE,T2(t)
VGG
T1
D1
VGE, Io
VGE(th)
0
t
vCE,T1(t) iC,T1(t)
VCC
T2
D2
IO
iv,T2
0
t
vCE,T2(t) vF,D2(t) iF,D2(t), iC,T2(t)
VCC
IO
  • Why changes VGE,T2 when T1 switches on?

0
t
Cross conduction behavior
24
  • When the outer voltage potential V changes, the
    load Q has to follow
  • This leads to a displacement current iV

IGBT - Parasitic capacitances
25
iC,T2
CGC,T2
iv,T2
vCE,T2
RGE,T2
vGE,T2
  • Diode D2 switches off and takes over the voltage
  • T2 sees the voltage over D2 as vCE,T2
  • With the changed voltage potential, the internal
    capacitances change their charge
  • The displacement current iv,T2 flows via CGC,T2,
    RGE,T2 and the driver
  • iv,T2 causes a voltage drop in RGE,T2 which is
    added to VGE,T2
  • If vGE,T2 gt VGE(th) then T2 turns on (Therefore
    SK recommends VGG- -5-8-15 V)

Switching Detailed for T2
26
Problem 2 ----------------------------- gate
protection
Z 16 -18
27
Gate clamping ---- how ?
Z18
PCB design because no cable
close to the IGBT
28
Problem 3 -----------------booster for the gate
current
Use MOSFET for the booster
For small IGBTs is ok
29
Problem 4 ---------------------------- Short
circuit
  • Over voltage
  • 1200V ----- is chip level ---- consider internal
    stray inductance
  • /- 20V----- gate emitter voltage ---- consider
    switching behavior of freewheeling diode
  • Over current
  • Power dissipation of IGBT (short circuit current
    x time)
  • Chip temperature level

30
Problem 5 dead time between top and bottom IGBT
Turn on and turn off delay must be symetrical
31
Dead time explanation
32
Dead time explanation
  • Example
  • Dead time 3 us logic level
  • Turn on delay 1 us
  • Turn off delay 2.5 us
  • Td toff delay ton delay real dead time
  • Real dead time 3us (2.5us1us) 1.5 us

33
Our final recommendation
  • IGBT driver must provide the peak Gate current
  • The stray inductance should be very small in the
    gate driver circuit
  • Gate/Emitter resistor and Gate/Emitter capacitor
    (like Ciss) very close to the IGBT
  • Turn off status must have a very low impedance
  • High frequency capacitors very close to the IGBT
    driver booster
  • Dont use bipolar transistors for the booster
  • Protect the Gate/Emitter distance against over
    voltage
  • Dont mix
  • Peak current
  • Gate charge

34
Thanks
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