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New Detectors for Synchrotron Radiation Research: Higher Time and Spatial Resolution

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Active area: 4 x 1 cm2. Applications: angle ... X. rays. support bar (behind plane. of sensors) Crystal. sample. MEMS ... 90% x 2. 90 sensors. 36000 ... – PowerPoint PPT presentation

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Title: New Detectors for Synchrotron Radiation Research: Higher Time and Spatial Resolution


1
New Detectors for Synchrotron Radiation
Research Higher Time and Spatial Resolution
P. Denes1, C. S. Fadley1,2, B. Ludewigt1 1Lawrence
Berkeley National Laboratory, 2Dept. of Physics
UC Davis
  • 1 and 2-D upgrades of current high-speed detector
    for electrons and photons (previous presentation
    by Bussat et al.) for time/space resolved
    spectroscopy/microscopy
  • Pixel systems for protein crystallography
  • Large-scale pixel systems - position and
    energy-resolving for very high count rate
    applications, e.g. for x-ray fluorescence
    holography

Capitalizing on large investment in IC/detector
development for high-energy physics
2
Current ALS High-Speed Detector
Collector 50µ pitch
CAFÉ-M Si strip IC
BMC IC
3
Upgraded, Higher-Speed 1-D Detector
  • Very high-speed, deadtimeless readout for
    dynamics
  • Increase system readout speed by factor 100
  • Combine CAFE BMC into one CMOS IC
  • New mechanical platform for 1-D and 2-D versions
  • 2 µs to read complete detector in 8-bit mode
  • 4 µs to read complete detector in 16-bit mode
    (for compatibility)
  • 80 GHz theoretical maximum rate for detector (100
    MHz max/strip)

Semi-rigid coax
Gigabit serializer
200 channel ASIC
Applications Time-resolved photoemission and
x-ray absorption, incl. nanoscale magnetic
switching
4
2-D Version of ALS High-Speed Detector
e?
  • Monolithic detector
  • Top layer of ASIC metalization serves as
    (pixellated) collector
  • 10k counters/chip
  • Gigabit link ? 100 Mbytes/s? 200 µs to read out
    system

MCP
Metal Pad
Screen
Discr.
Clt 100 fF
16-bit counter
Preamp
Thresh 5 ke?
shift register
1 pixel
5
2-D Version of ALS High-Speed Detector
Active area 4 x 1 cm2
Pixel 50µ x 200µ
1cm
Gap ?200µ
Applications angle-resolved photoemissionx-ray
emission spectroscopy inelastic scattering
6
Inside a Pixel
  • CIN 70 fF (pad)
  • QTHR 5k e?
  • 1300 transistor/pixel
  • CMOS 0.25µ
  • 50µ x 200µ pixels
  • 13M transistor/chip
  • CMOS 0.13µ
  • 50µ x 50µ pixels
  • 55M transistor/chip

Test Pulse
Preamp Discriminator
Digital part (16-bit counter, shift register ...)
Envelope 50µ x 200µ
7
3DX x-ray Detector - Protein Structure
  • MEMS technology sensor
  • Vertical collection electrodes (speed)
  • Trench-cut edges (active edge)

Molecular Biology Consortium, LBL, U. Hawaii,
Brunel, Stanford
8
3DX Detector
  • Direct conversion (rather than scintillatorsCCD)
  • Large area - 30x30 cm2
  • Edgeless detector
  • Prototype readout being submitted now in 0.25µ
    CMOS
  • On-chip ADC
  • 144x150 µ2 pixels

Prototype (8x64 pixel) Circuit
9
X-ray Fluorescence Holography
Excitation x-ray
Detector
  • Current Method
  • Fixed, single-element detector
  • Rotate sample in ?,?

SAMPLE
10
XFH with Pixellated Detector
Excitation x-ray
Large area pixel detector (? 2?, ?? small, GHz
rate)
11
Ideas from the ATLAS Pixel Detector
1.3 m
10 cm ? (Inner-most layer)
Cylinders are simpler than spheres! ATLAS pixel
8x107 Pixels
12
XFH Detector
5 cm
Sensor - 2x2 cm2 Pixels - 1x1 mm2 ?? ? (1?)2 ?
90 x 2? 90 sensors 36000 pixels
20 cm
2 cm ladders
Applications Holograms in seconds or single XFEL
pulse simplified detector for XRD in single FEL
pulse
13
Inside a Pixel
Trigger
R
W
PED
Preamp
ADC
W
RST
Peak Detector
Readout format
  • 200-300 eV FWHM
  • Adjustable shaping times
  • 50 kHz / pixel
  • 8-bit ADC / pixel
  • Pedestal measurement mode

Time
Addr
ADC
  • ADC value
  • Geographical address
  • Time stamp

Small detector compared to ATLAS (1/2000 as many
pixels) But data rate is challenge (gt5 Gbyte/s)
14
Large-Scale Pixel Detectors are Complex Systems
100 mm wafer with 3 Si sensors
0.25µ CMOS Readout IC
18x160 pixels
Readout
Solder Bumps
50µm
A module is 1 sensor with 2x8 bump-bonded chips
15
Conclusions
  • Use knowledge gained in building strip and pixel
    systems for HEP. Not only in detector and IC
    design, but also in assembly and system
    integration
  • Designs for building updated 1- and 2-dimensional
    spectroscopy detectors
  • Plans for a large-area, energy-resolving pixel
    detectors for both protein crystallography and
    x-ray fluorescence holography/XFEL diffraction
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