MTII Company Profile Presentation

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Pioneers in Non-contact Measurement
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MTI Instruments, Inc.

• Founded in 1961--now a public company listed on
  NASDAQ
• Designs, manufactures and markets non-contact
  measurement instruments and systems for
  manufacturing and laboratory applications

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Company Profile

• We apply our technical expertise in
  electronics, optics and software to meet the
  precision measurement needs of end-users and
  OEMs
• Key attributes of our products
• Non-contact High resolution
• Custom probe sizes High frequency response
• Accurate Reliable
• Global sales, service and support network
• Total customer commitment

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Company Profile

• MTI Instruments, Inc.

• PBS Group
• Portable engine balancing systems for the
  aircraft industry

• General Instruments Group
• Measurement probes and electronics for laboratory
  and industrial applications

• Semiconductor
• Products Group
• Measurement systems designed specifically for the
  semiconductor industry

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Core Technologies

• MTI Instruments employs three unique sensing
  technologies to meet the diverse measurement
  needs of our customers
• Accumeasure? - Capacitance
• Displacement
• Thickness
• Micro-positioning
• Microtrak? - Laser triangulation
• Robotic Control
• Flatness
• Dimensional Measurement
• Fotonic? - Fiber Optic
• Vibration
• Positioning
• Modal Analysis

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Semiconductor Products Group

• MTI Instruments offers a complete line of
  semiconductor metrology systems to meet the
  stringent requirements of the industry
• Proforma 300 - Manual wafer thickness
  measurement
• Proforma 300GR - Manual thickness and
  resistivity in single compact design
• Proforma 200 SA - Semi-Automated wafer surface
  mapping
• Proforma AutoScan 200 - Fully automated wafer
  mapping system

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PROFORMA? Wafer Thickness Measurement Systems

• Based on MTIs proprietary Push-Pull? capacitance
  technology
• Ideal for both semiconducting and semi-insulating
  materials
• Manual, semi-automated and fully-automated models
  for laboratory and manufacturing process
  applications

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Push-Pull Probes

• Single Sensing Face
• Constant current supply, linear voltage change
  based on air gap
• Electrical grounding of target required

• Dual Sensing Element
• No electrical grounding of target required
• Ideal for highly resistive materials

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Semiconductor Applications

• Wafer Specifications
• Material Semiconducting and Semi-Insulating
• Diameter 50 - 200 mm.
• Surface As-Cut, Lapped, Etched, Polished,
  Patterned
• Flat/Notch All SEMI standard Flat(s) or Notch
• Conductivity P or N type
• Mounting Bare Wafer, Sapphire/Quartz, Tape
• Process Monitoring
• Slicing Blade and wire guide degradation
  monitoring
• Lap/etch and Polishing Removal Rates
• Backgrinding
• Final Inspection

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PROFORMA? 300

• Manual, non-contact wafer thickness gage
• Thickness, TTV, continuous and 5-point
  measurement
• Measures diverse materials without re-calibration
• Output data to any PC
• Portable, easy to set up and operateideal for SPC

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PROFORMA? 300 Key Features
Teflon wafer stage for easy non-abrasive
positioning
High-resolution LCD display
Proprietary Push-Pull probe technology
Adjustable stage for precise leveling
On-board microprocessor for accurate, repeatable
measurement

• Menu-driven for fast, easy setup

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PROFORMA? 200 SA

• Semi automated operation
• Windows based control interface
• Measures thickness, bow, warp, global and site
  flatness, TTV
• Complete wafer surface mapping
• Multiple chucks for all wafer sizes
• Economical alternative to fully automated system

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PROFORMA? AUTOSCAN 200

• Fully automated wafer measurement system for
  semiconducting and semi-insulating materials
• Thickness, TTV, bow, warp, resistivity, site and
  global flatness
• Outstanding accuracy and repeatability
• Integrated, modular design

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PROFORMA? AUTOSCAN 200

• Standard Windows NT user interface for easy
  set-up.
• Choose from standard or user-programmable wafer
  scan patterns to mach your measurement needs.

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PROFORMA? AUTOSCAN 200

• Precise site flatness measurements are obtained
  through programmable wafer and site geometries.

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PROFORMA? AUTOSCAN 200

• Automated, full surface scanning allows for
  3-dimensional imaging of wafer profile.

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PROFORMA? AUTOSCAN 200 System Features

• Completely automated wafer handling and surface
  scanning
• Measures all wafer materials --Si, Ge, GaAs, InP
• Full 1000 um thickness measurement range without
  re-calibration
• Measures wafers from 75-200 mm. in diameter
• 100 wafer/hour throughput
• Universal robot end effector
• Automatic detection of wafer diameter
• Laser cassette scanning detects crossovers, empty
  slots, broken wafers

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PROFORMA? AUTOSCAN 200 System Features
(continued)

• SEMI compliant modular design
• Integrated control system
• Ethernet network interface
• Customized data reporting
• Enclosed environment for Class 10 compatibility
• Optional laser OCR mark reading and resistivity
  modules

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The new standard for measuring semiconducting
and semi-insulating wafers