COST MP0602 Hisold Expression of Interest

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COST MP0602 HisoldExpression of Interest

• Nanostructured Solders for High-Temperature
  Joints via Transient Liquid Bonding

J. Janczak-Rusch, EMPA, Switzerland
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Objectives

• Outline of activity to be undertaken
• The aim of this work is
• to develop nanostructured solders with
  application-oriented properties based on TLP
  bonding
• to enable a low temperature, short duration
  bonding method for the fabrication of
  high-temperature (260-320C), high-performance
  joints.
• Description
• The effort is motivated by the joining
  requirements of wide band-gap semiconductor
  devices, specifically the need for a robust
  die-attach method capable of supporting the
  high-temperature, high-reliability operational
  demands of these devices while accessible through
  benign processing conditions. A route enabling a
  decrease in processing temperature and time
  through nano-scale assembly of the solders
  constituents should be developed.

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Resources collaborations

• Resources available in laboratory of proposer
• The Laboratory of Joining and Interface
  Technology is a multidisciplinary materials
  science research group with expertise in the
  fields of joining, physical metallurgy,
  nano-technology.
• The Laboratory possesses a wide range of
  processing and test equipment that may be
  utilised for the proposed work.
• Available Infrastructure and Instruments
• Process laboratory with various equipment for
  soldering and welding processes
• Laboratory with various furnaces,
  microscopy/analysis rooms, rooms for sample
  preparation,
• Skills or expertise sought from other partners
• The team seeks collaborations with groups on
  similar activities and complementary expertise.