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MEMS-BASED INTEGRATED-CIRCUIT MASS-STORAGE SYSTEMS

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IBM Millipede. Uses a 32 x 32 array of probe tips. Each tip is placed at the end of a ... Melting pits in a polymer (IBM Millipede): Raises tip wear issues ... – PowerPoint PPT presentation

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Title: MEMS-BASED INTEGRATED-CIRCUIT MASS-STORAGE SYSTEMS


1
MEMS-BASEDINTEGRATED-CIRCUITMASS-STORAGE SYSTEMS
  • L. R. Carley, G. R. Ganger, D. F. Nagle
  • Carnegie-Mellon University

2
Paper highlights
  • Discusses a new secondary storage technology that
    could revolutionize computer architecture
  • Faster than hard drives
  • Lower entry cost
  • Lower weight and volume
  • Lower power consumption
  • Paper emphasis is on physical description of
    device

3
DISK DRIVE LIMITATIONS
  • Disk drive capacities double every year
  • Better than the 60 per year growth rate of
    semiconductor memories
  • Two major limitations of disk drives are
  • Access times decreases have been minimal
  • Minimum entry cost remains too high for many
    applications

4
Stating the problem
  • We need a type of new mass storage that can
    break both barriers of
  • Access times
  • Minimum entry cost
  • New mass storage should also be significantly
    cheaper than non-volatile RAM
  • 100 now buys 1 GB of flash memory

5
MEMS
  • Microelectromechanical systems (MEMS) use
  • Same parallel wafer-fabrication process as
    semiconductor memories
  • Keeps the prices low
  • Same mechanical positioning of R/W heads as disk
    drives
  • Data can be stored using higher density thin-film
    technology

6
Main advantages of MEMS (I)
  • Potential for dramatic decreases in
  • Entry cost
  • Access time
  • Volume
  • Mass
  • Power dissipation
  • Failure rate
  • Shock sensitivity

7
Main advantages of MEMS (II)
  • Integrate storage with computation
  • Complete systems-on-a-chip integrating
  • Processing unit
  • RAM
  • Non-volatile storage
  • Many many new portable applications

8
THE CMU MEMS PROTOTYPE
  • Like a disk drive, it has
  • recording heads
  • a moving magnetic recording medium
  • Major departures from disk drive architecture are
  • MEMS recording headsprobe tipsare fabricated in
    a parallel wafer-level manufacturing process
  • Media surface does not rotate

9
How the media surface moves
  • Media surfaces that rotate require ball bearings
  • Very small ball bearings have striction
    problems that prevent accurate positioning
  • Elements would move by sticking and slipping
  • Best solution is to have media sled moving inX-Y
    directions
  • Sled moves in Y-direction for data access
  • Sled is suspended by springs

10
Conceptual view
Sled suspension is omitted from drawing
Sled with magnetic coating on bottom
Fixed part with tip array
11
The media sled
  • Size is 8mm x 8mm x 500 mm
  • Held over the probe tip array by a network of
    springs
  • Motion applied through electrostatic actuators
  • Motion limited to 10 or less of
    suspension/actuator length
  • Each probe tip can only sweep 1 of the media sled

12
The probe tip array
  • Includes a large number of probe tips for
  • Being able to access whole media sled(in
    combination with X-Y motions of sled)
  • Improving data throughput
  • Increasing system reliability

13
Probe tip positioning (I)
  • Most MEMS include some form of tip height control
    because
  • Media surface is not perfectly flat
  • Probe tip heights can vary
  • CMU prototype places each probe tip on a
    separate cantilever
  • Cantilever is electrostatically actuated to a
    fixed distance from the media surface

14
Probe tip positioning (II)
  • IBM Millipede
  • Uses a 32 x 32 array of probe tips
  • Each tip is placed at the end of aflexible
    cantilever
  • Cantilever bends when tip touches surface
  • HP design places media surface and probe tips
    sufficiently apart
  • No need to control probe tips

15
Probe tip positioning (III)
  • CMU solution is most complex of three
  • Must control individual heights of 6,400 probe
    tips
  • Required by recording technology

16
Probe tip fabrication
  • Major challenge is fabricating read/write probe
    tips in a way that is compatible with the
    underlying CMOS circuitry
  • This includes
  • thermal compatibility
  • geometrical compatibility
  • chemical compatibility
  • ...

17
Media positioning
  • Systems current target is to have each probe tip
    in the middle of a 100 mm square
  • Media actuator must be able to move at least 50
    mm in each direction
  • Can be achieved with an actuation voltage of 120V
  • Well above CMOS rated voltage

18
Storing, reading and writing bits
  • CMU prototype uses same magnetic recording
    technology as current disk drives
  • Minimum mark size is around 80mm x 80mm
  • Other solutions include
  • Melting pits in a polymer (IBM Millipede)
  • Raises tip wear issues
  • Phase change media (HP prototype)
  • Same technology as CD-ROM

19
PROTOTYPE PERFORMANCE (I)
  • All data were obtained through simulation
  • Average service time around 0.52 ms
  • Disk drive service time is 10.1 ms
  • Key factor for service time is X-seek time
  • I/O bandwidth depends on
  • number of simultaneously active tips
  • per-tip data rate

20
PROTOTYPE PERFORMANCE (II)
  • Sustainable data rate is not a linear function of
    access data rate
  • Track switching time now depends on access
    velocity
  • Faster sled means higher turn around time
  • Maximum sustainable data rate ofsingle tip
    varies from 1.4 to 1.8 Mb/s
  • Reached for peak data rate of 2 to 3 MB/s

21
Application performance
  • PostMark benchmark
  • Models file activity in Internet servers
  • Prototype is 3.4 times faster than current
    drives
  • Much faster metadata updates
  • TPC-D benchmark
  • Models transaction processing
  • Prototype is 3.9 times faster despite extensive
    caching in competing disk drive

22
POTENTIAL APPLICATIONS
  • Lighter and less shock sensitive than disk drives
  • Great for notebook PCs, PDAs and video
    camcorders
  • Lower cost than disk drives in 1 to 10 GB range
  • Will open many new applications
  • High areal densities
  • Great for storing huge amounts of data
  • Can combine computing and storage on a single chip

23
MY OVERALL OPINION
  • Technology has a bright future if and when
    production kinks get solved
  • We should remain somewhat skeptical
  • Not the first gap-filling technology to be
    tried
  • Bubble memories were hot in the 70s
  • Lower RAM prices killed them in the early 80s
  • Watch prices of non-volatile RAM
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