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BIRD100: A Series of Package Choices

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BIRD100 constructs (instance_name used or not?) 96 different combinations in all ... 'Endpoint' is assumed the die pad; which one? ... – PowerPoint PPT presentation

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Title: BIRD100: A Series of Package Choices


1
BIRD100A Series of Package Choices
  • Michael Mirmak
  • Intel Corp.
  • Chair, EIA IBIS Open Forum

2
Status
  • Creation of BIRD100 has hit a wall
  • Intended to define IBIS-ICM link syntax
  • What the draft BIRD100 includes today
  • instance_name -- a subparameter of Pin
  • Permits multiple Models on one pin, and
    multiple pins tied to a single Model instance
  • Pad a subparameter of Pin Numbers
  • Permits traditional Package Model constructs to
    connect to multiple Models
  • Notes on ICM Naming Convention
  • A set of instructions on properly naming ICM
    nodes to map to Model and External Model
    connection points

3
The Problem
  • IBIS ambiguities force choices for ICM linking
  • Need definitive statements on the application of
    and relationships between several keywords
  • Pin Mapping and package models
  • POWER and GND Pins and package models
  • Package models and Pins / Models
  • Additionally
  • For what IBIS constructs should ICM be available?
  • For what IBIS constructs should traditional
    packages be available?
  • Interactions to check
  • IBIS buffer construct (native, E. Model, E.
    Circuit)
  • Pin modeling of power/ground (Pin uses POWER or
    not?)
  • Pin Mapping (used or not?)
  • Package model type (Package, Package Model,
    ICM, R_pin, etc.)
  • BIRD100 constructs (instance_name used or not?)
  • 96 different combinations in all

4
Key Questions
  • BIRD100 as written is incomplete
  • Not all IBIS 4.1 Fig. 12 cases addressed
  • The following slides ask key questions which must
    be answered to complete BIRD100
  • Answers to these questions will impact how
    BIRD95, AMS are implemented
  • These may also affect tools currently
    implementing Pin Mapping and other package
    keywords
  • Keep in mind potential EMI and non-PC
    applications (JEITA requests)

5
Figure 12 (top)

6
Figure 12 (bottom)

7
Q1 Pin Mapping
  • Pin Mapping
  • What is the relationship between Pin Mapping
    and package models (Package, Package Model,
    R_pin)?
  • Where are Pin Mapping connections made?
  • At the buffer rail? (option a below)
  • If so, packages sit between Pin Mapping
    busses and pins
  • At the pin, with ideal shorts? (option b below)
  • If so, packages sit between Pin Mapping
    busses and individual buffer rails
  • R_pin makes less sense in this version
  • May we assume Circuit Call prohibits Pin
    Mapping?
  • For just the affected pins?
  • For the entire component?
  • Will instance_name work with Pin Mapping?
  • We cannot avoid a choice here

8
(a) Pin Mapping as On-die
  • Package model associated with pins
  • Pin Mapping is between packages and buffers

Package, Pin
Pin Mapping
Package Model
A2 (POWER)
pullup_ref
Digital Port
A1
pulldown_ref
A3 (GND)
9
(b) Pin Mapping as Pin Shorts
  • Pin Mapping shorts pins together

Pkg
A2 (POWER)
pullup_ref
Pkg
A1
A5 (POWER)
Pkg
A3 (GND)
Pkg
pulldown_ref
Digital Port
Pkg
A4
A6 (GND)
Pkg
10
Q2 Traditional Packages
  • Traditional Package Models
  • Package, Package Model and R_pin, etc.
  • How do these relate to power/ground connections?
  • Example
  • Pin A1 is defined POWER. It has R_pin, L_pin,
    C_pin associated with it (this is not prohibited)
  • Is the package model connected to this pin?
  • If so, where is the other end of the package?
  • If not, is pin A1 a direct short (and if so, to
    where)?
  • Same question applies to Package Model
  • Endpoint is assumed the die pad which one?
  • Currently, only Pin Mapping resolves this
    situation
  • Without 4.1 port definitions (A_puref) or Pin
    Mapping, package details on power are meaningless

11
Q3 IBIS 4.1 Ports
  • IBIS 4.1 creates standard ports (A_puref) for E.
    Model
  • Same port names can be applied to E. Circuit
  • Should we allow use of A_puref, etc. ports for
    package definitions, Pin Mapping, etc.?
  • Example Pin A1 (POWER) connects to A_puref for
    I/O pin A2
  • If not, External Model cannot connect to
    packages without ICM
  • See Fig. 12 in IBIS 4.1 where do these ports go?
  • How do Pin Mapping and Package Model connect
    to A_puref?
  • Option 1 assume A_puref pullup_ref
  • Shorts all External Model supplies
  • This prohibits multiple buffer instances now in
    BIRD100
  • Option 2 allow A_puref in Pin Mapping syntax
  • Option 3 allow instance_name.A_puref in Pin
    Mapping
  • Also allows Package Model to use ports
    multiple instances

12
Q4 IBIS 4.1 Ports for Model
  • IBIS 4.1 suggests ports apply to native Models
  • Native Model Model without External
    Model
  • Do we allow A_puref to be used with native
    Models?
  • Should instance_name be permitted alongside these
    constructs?
  • If so, External Model just got expanded to work
    with multiple instantiations (not necessarily bad)

13
Proposals
  • Prohibit Pin Mapping and External Circuit
  • Prohibit Pin Mapping and External Model
  • Document Pin Mapping as connecting packages to
    buffers (packages connect to pins)
  • Permit use of ports with traditional IBIS
  • Example, A_puref for Model without E. Model
  • Permit use of Package Model with E. Model
  • Allow dot notation Pad subparameter in Package
    Model
  • Example Padmyinstance.A_puref, where myinstance
    is a specific instance_name under Pin
  • Permit ICM for ALL flavors of IBIS (native,
    multi-lingual)
  • Model, External Model links must use the die
    node syntax instance_name.port_name
  • Integrate ICM parser into IBIS parser
  • Raise total IBIS parser fee to 3000
  • Permits checking of ICM as Package Model file
  • Permit ICM code within an IBIS model
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