Business Models and Technology Advances in Dual Interface and Multi Technology Cards

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Business Models and Technology Advances in Dual
Interface and Multi Technology Cards

• ICMA EXPO 2005
• Miami, 16th 19th October
• Presented by Thies Janczek

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Content

• Introduction
• Business Cases for Dual Interface Cards
• Banking Application
• ID Application
• Technology Advances
• DIC Dual Interface Cards
• Multi Technology Cards
• Driving factors
• Summary

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Introduction
Increasing complexity

• Smart cards are developing to increasing
  functionality
• Increasing Employment of Dual Interface Cards
• Dedicated Contactless and Contact Usage
• Integration of Electrical Functional Components
• Battery, Display, Solar Power Unit,
  Switch,Sensors (e.g. Biometric) etc.
• Project driven ? Customizing, Non Standard
• Low Volume and High Costs

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Dual Interface Card- Applications

• Wireless Interface for Identification
• Access
• Low security ID
• Border control
• Contact Interface for Security/Signature
• PKI for Transaction
• Data Exchange with High Rates/Volume
• High Security ID (e.g. Biometric)

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Dual Interface CardsBanking Application

• Contactless transactions (e.g. Paypass) in North
  America in project status
• EMV application in planning
• Contact for EMV application
• Europe, Asia, EMEA, Africa
• Existing card reader infrastructure
• Open platforms for non-financial add-ons
• Dual Interface Card projects in Asia

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Dual Interface CardsBanking Application

• Mastercard and Visa provide Dual Interface
  Operating systems
• MChip and JCOP
• Existing Card Reader Infrastructures
• Europe contact reader in business and private
  environment
• North America currently building up Contactless
  systems
• Interoperability

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Dual Interface CardsBanking Application

• Multi Application of financial cards will ask for
  Dual functionality
• Non financial Add ons (e.g. public transport)
• Involved costs to be paid by
• Scheme provider
• Customer
• Interoperability in payment between Continents
  just for a minority of customer

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Dual Interface CardsID Application

• Contactless Interface for travel documents is
  defined by ICAO
• Passport with biometric data storage projects in
  every country
• Current set up of border control infrastructures
• Need for increased security

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Dual Interface CardsID Application

• ID cards
• ID cards are employed in many countries with
  increasing use
• Card size is merging to ID-001
• In the EU Schengen area ID cards are valid travel
  documents
• PKI infrastructures for governmental applications
  (tax, registration etc. via internet) are
  installed on contact basis.

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Dual Interface CardsID Application

• The ID card in the EU will merge to a Dual
  Interface ID-001 card.
• For traveling identification with an ICAO conform
  contactless interface
• Including storage of biometric data
• For secure authentification in a PKI
  infrastructure on a contact interface
• Including key generation and verification for
  multiple applets

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DIC Technology AdvancesBasics

• Module Contacts Antenna
• Electrical Connection by
• Anisotropic conductive adhesive (ACA)
• Isotropic conductive adhesive (ICA)
• Welding Technologies (TC bonding)
• Electro Magnetic Coupling

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DIC Technology AdvancesBasics

• Main target is on the card sideto get a
  reliable connection between the module/chip and
  the antenna

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DIC Technology Advances- ACA Connection

• Further technology development
• Optimization of the polymer matrix
• Optimization of the conductive filler
• In testing at various cardmanufacturer

Anisotropic Conductive Adhesive

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DIC Technology Advances- ICA Connection

• Epoxy silver filled has been replaced by flexible
  systems on silicone basis
• Flexible Bump (Mühlbauer, D)
• Polymer Spring (SPS, F)
• Good reliability results due to permanent
  elastical pressure onto the contacts
• Systems are in testing and qualification at card
  manufacturer

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DIC Technology Advances- Welding Connection
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DIC Technology Advances- Welding Connection

• Thermal Compression welding results in a very
  hard and strong connection.
• Different technologies available
• Wire pull out on the finished card (China)
• Prelams with module connected (Smartrac)available
  as blank white cards, prelaminated inlays
  (development), and unlaminated inlays (Q4/05)
• Cards in testing and qualification at card
  manufacturer

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DIC Technology Advances- Electro Magnetic
Coupling

• The contact between the module and a special
  trimmed ID1 antenna (booster) is a specific
  electromagnetic coupling.
• NO contact between the devices.
• Highest reliability, material independent (PVC,
  PC, PET etc.)
• Testing and qualification at card manufacturer
  and passport producer

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Technology AdvancesMulti Technology Cards

• DISPLAY
• KEYPAD
• BATTERY
• RELOADABLEBATTERY
• ANTENNA

• SENSORS
• BIOMETRIC SENSOR
• SOLAR POWER UNIT
• DATA STORAGE
• COMPUTING

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Multi Technology Cards- Development

• ISO compliant sample cards are in development.
• High development activity for certain components
• Driving factor are electronic devices (e.g. PDA,
  Mobile, electronic paper)

DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH -
DIODES - BATTERY - ANTENNA - SENSORS -
AKKUMULATOR - SOLAR POWER UNIT - DATA STORAGE -
COMPUTING
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Summary

• Increased DIC demand lead to reliable
  Module/Antenna connections
• Industrial High Volume DIC Production in 2006
• High Potential for Lucrative Business Cases
• Products with Complex Electronic Circuits have
  been proposed and are under further development
• High RD Activity lead to New Components and
  Technologies for Smart Cards

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Business Models and Technology Advances for DIC
THANK YOU FOR YOUR ATTENTION
More Information COCASO Thies Janczek
Moewenstrasse 5a 24113 Molfsee Germany Phone
49-(0)4347-703526 Email janczek_at_cocaso.com ww
w.cocaso.com
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