Measurement of the Mechanical Properties of Thin Films By Microbeam Bending

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Measurement of the Mechanical Properties of Thin
Films By Microbeam Bending

• Micromachined cantilever beam structures for
  mechanical testing
• Mechanical testing highlights
• Deposited Cu film on Si beam
• Use nanoindenter to deflect bi-layer
  beams
• Utilizing triangular geometry to extract
  mechanical behavior of the film
• An as-deposited 1 mm Cu film has a 0.2 yield
  stress of nearly 400 MPa
• Pictures on right
• SEM photo of triangular Si microbeam
• Measured stress-strain behavior of an
  as-deposited Cu film

User Jeffrey Florando, MSE, Stanford Principal
Investigator Prof. William D. Nix, MSE, Stanford
NNUN Site Stanford Univeristy