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ASICS for MEMS

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ASICS for MEMS. BRILLANT Gr gory. 13th of October ... Among off-chip components in a wireless communication circuit, the quartz ... – PowerPoint PPT presentation

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Title: ASICS for MEMS


1
ASICS for MEMS
  • BRILLANT Grégory
  • 13th of October

2
60 MHz Wine-Glass Micromechanical-Disk Reference
Oscillator
3
Introduction
  • Among off-chip components in a wireless
    communication circuit, the quartz crystal used in
    the reference oscillator is perhaps the most
    difficult to miniaturize
  • Qgt 10 000 and thermal stabilities better than 35
    ppm uncompensated over 0-70C are generally
    unavailable on-chip.
  • Recently, on-chip vibrating micromechanical
    resonators based on MEMS technology have become
    increasingly attractive as on-chip frequency
    selective elements for communication-grade
    oscillators and filters
  • Q gt100 000 at 60 MHz,
  • frequency temperature dependencies of only 18 ppm
    over 25-105C at 10 MHz

4
Introduction
  • Recently, an on-chip vibrating clamped-clamped
    beam (CC-beam) micromechanical resonator based on
    MEMS technology has been demonstrated at 10MHz
    with a Q of 4,000 and a frequency stability of
    34ppm over 0-70C, which matches that of quartz.
  • But, the problem is the far-from-carrier phase
    noise (only -120dBc/Hz )
  • This value is caused by the insufficient power
    handling ability of the CC-beam micromechanical
    resonator device used
  • This paper presents a work which achieves an
    effective 25dB improvement in phase noise
    performance over the previous 10MHz oscillator
  • Replacement of the wide-CC-beam resonator by a
    60MHz MEMS-based wine glass disk micromechanical
    resonator

5
The wine glass resonatorresults
  • Q gt 48 000
  • The combination of this resonator with a CMOS
    trans-resistance sustaining amplifier designed to
    accept the high impedance of the wine glass disk
    yields a 60MHz reference oscillator that
    achieves
  • phase noise density of -100dBc/Hz at 1kHz offset
    from the carrier
  • -130dBc/Hz at far-from-carrier offsets
  • Dividing down to 10MHz, these values correspond
    to
  • -115dBc/Hz at 1kHz offset from a 10MHz carrier
  • -145dBc/Hz at far-from-carrier value.

6
The wine glass oscillatorprinciple
  • The wine glass disk resonator consists of a
    3µm-thick disk supported by two beams that attach
    to the disk at its nodal points
  • The nodal points are motionless when the disk
    vibrates in its wine glass mode shape

7
The wine glass oscillatorprinciple
  • There is different vibrating modes
  • This modes are distinguishable by the phasing
  • Each mode exhibits unique resonator phasing
  • A single mode can be selected by choosing the
    input ac signal to match the phasing of the
    desired mode
  • In the mode shape used in this work, the disk
    expands along one axis and contracts along the
    orthogonal axis

8
The wine glass oscillatorprinciple
  • Wine-glass resonator array can be use in order to
    achieve better performances

9
The wine glass oscillatorprinciple
  • To excite vibrations a dc-bias voltage Vp and an
    ac input signal Vi to oppositely located input
    electrodes are applied to the disk structure
  • These voltages result in a force proportional to
    the product VpVi that drives the resonator into
    its vibration mode shape
  • This occurs when the frequency of Vi matches the
    wine glass resonance frequency
  • ? is a modified Bessel function quotient, fo is
    the resonant frequency, R is the disk radius, and
    ?, s, and E, are the density, Poisson ratio, and
    Young's modulus, respectively, of the disk
    structural material
  • Seen through its terminals, the whole device can
    be equated to a LCR circuit

10
Realization
  • The key to achieving improvements lies not only
    in the use of a wine glass disk resonator but
    also in the specific advances applied to its
    design
  • The wine glass disk of this work differs from
    that of a previous prototype in that its
  • thickness is increased to 3µm and gap is reduced
    from 100nm to 80nm ? it increases its power
    handling and lower its impedance
  • The number of supports used is reduced from four
    to two, in order to decrease energy loss from the
    disk to the substrate through anchors ? maximize
    the device Q
  • The stiffness of this wine glass disk is 6.6e5N/m
    ? more than 55X the 1.2e4N/m of the 10MHz
    wide-CC-beam device ?This allows it to handle
    powers 55X higher.

11
Realization
  • Even with these enhancements, the resistance of
    the device is 1.5kO for a 64µm-diameter 60MHz
    wine glass disk with Vp12V and Q48,000
  • It is larger than the 50O normally exhibited by a
    off-chip quartz crystals
  • A sustaining amplifier capable of supporting high
    tank impedance is required.
  • A trans-resistance CMOS sustaining amplifier is
    used

12
Realization
  • A fully balanced differential CMOS op amp
    connected in shunt-shunt feedback
  • M1-M5 the basic differential Opamp
  • M11-M18 common-mode feedback circuit that sets
    bias point.
  • MOS resistor MRf serves as a shunt feedback
    element that allows control of the
    trans-resistance gain via adjustment of its gate
    voltage

13
Realization
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