Thermo Compression Bonder Market Competitive Research And Precise Outlook 2023 To 2030

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Thermo Compression Bonder Market
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Clientele
Some of the global leading clients that we have
served
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Clientele
Some of the global leading clients that we have
served
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Market Overview
Wafers can be joined by the method of thermo
compression bonding, which goes by other names
like as diffusion bonding, pressure bonding, hot
compression welding, and solid welding. Thermal
compression machines are able to join or weld
semiconductor wafers together by applying
pressure and a vacuum. The atoms in a crystal
migrate closer together as it vibrates, creating
a lattice. These atomic contacts are what keep
interfaces together. Diffusion processes are
classified into three categories surface
diffusion, grain boundary diffusion, and bulk
diffusion. The aim behind this technique is to
rapidly increase and then decrease the
temperature, allowing for extremely fast
processing with minimal margin for error. In
addition, both semi- and fully-automatic versions
of these gadgets can be purchased. As there are
no manual steps or specialized machinery
involved, it can provide results at a
considerably higher rate than wire bonding.Growth
in the semiconductor industry is expected to fuel
the economy.Demand from numerous end-user
markets, such as the semiconductor, FPD, PV cell,
and packaging substrate markets, is increasing,
which is a major reason in this growth. The
demand for thermal compression is rising as
semiconductor production processes are
increasingly outsourced. Demand for automated
manufacturing processes, the rise of automated
equipment, and government encouragement of
production capacity increase are all trends that
will have a significant impact on the industry
and help drive its expansion. Traditional
producers are under increased pressure to embrace
cutting-edge technologies and restructure
operations and organizational structures in order
to keep up with rising demand

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By Region
North America, Europe, Asia Pacific, Latin
America, and the Middle East Africa (MEA) are
just some of the regions studied to determine how
the worldwide Thermo Compression Bonder market is
faring.From 2022 to 2030, Asia-Pacific is
expected to have the highest compound annual
growth rate (CAGR), at 5.5. The use of thermal
compression bonder in more and more industries is
a major driver of this expansion. Since China has
a sizable manufacturing base and is rapidly
urbanizing, it will likely continue to be a key
market in the Asia-Pacific area. Moreover, India
has experienced both rapid development in recent
years and the opposite impact of economic
policies pursued by each government.From 2008 to
2030, the Asia-Pacific region grew at a faster
rate than Europe did, by 5.7. This is mostly
attributable to the fact that, following a severe
economic slump in 2008/09, a recovery in account
balances was witnessed in 2016/2017. The European
construction industry is predicted to increase at
a moderate pace over the forecast period, but
still facing numerous problems like as Brexit,
high unemployment, and severe environmental
requirements.
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The Global Thermo Compression Bonder Market has
been segmented into

• By Type
• Automatic Thermo Compression Bonder
• Manual Thermo Compression Bonder

• By Application
• IDMs
• OSAT

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The Global Thermo Compression Bonder Market has
been segmented into

• By Region
• Europe
• Germany
• France
• Italy
• Spain
• UK
• Nordic Countries
• Denmark
• Finland
• Iceland
• Sweden
• Norway
• Benelux Union
• Belgium
• The Netherlands
• Luxembourg
• Rest of Europe

• By Region
• North America
• US
• Canada
• Mexico
• Rest of North America
• The Middle East Africa
• Saudi Arabia
• UAE
• Egypt
• South Africa
• Rest of the Middle East Africa
• Latin America
• Brazil
• Argentina
• Rest of Latin America

• By Region
• Asia-Pacific
• Japan
• China
• India
• Australia
• South Korea
• Southeast Asia
• Indonesia
• Thailand
• Malaysia
• Singapore
• Rest of Southeast Asia
• Rest of Asia-Pacific

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INDUSTRY DEVELOPMENT

• In January 2022, the first vendor to introduce
  copper hybrid-bonded chips was Advanced Micro
  Devices, an American semiconductor manufacturer.
  The first hybrid-bonded AMD processors have been
  introduced. Even more established tech firms are
  working to perfect hybrid bonding, including
  Intel and Samsung.
• The world's leading provider of semiconductor
  solutions, ASM Pacific Technology Ltd (ASMPT),
  has announced that it would deliver its 250th
  thermo-compression bonding tool to a customer in
  February 2021.

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Market Players

• ASMPT (AMICRA)
• KS
• Besi
• Shibaura
• SET
• Hanmi
• others.

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