2.5D and 3D ASIC design technologies-2.5D SoC SiP-HBM 3D-stacked-DRAM technology PowerPoint PPT Presentation

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Title: 2.5D and 3D ASIC design technologies-2.5D SoC SiP-HBM 3D-stacked-DRAM technology


1
2.5D and 3D ASIC design technologies
  • As an early advocate of 2.5D and 3D ASIC design
    technologies and by leveraging its experience
    from the industrys first multiple successful
    2.5D SoC SiP demonstration, OpenFive plays a key
    role in enabling industry applications that
    leverage the HBM 3D-stacked DRAM technology.
  • HBM3/2E/2 IP Subsystem The HBM3/2E/2 IP is
    suitable for applications involving graphics,
    high-performance computing, high-end networking,
    and communications that require very high
    bandwidth, lower latency and more density.
  • Integrated HBM controller and HBM PHY subsystem
    solution supporting HBM3, HBM2E and HBM2 JEDEC
    spec for a wide range of technology and foundry
    nodes. 

https//openfive.com/hbm3-2e-2-ip-subsystem/
2
HBM3/2E/2 IP Subsystem
  • HBM3/2E/2 IP Subsystem The HBM3/2E/2 IP is
    suitable for applications involving graphics,
    high-performance computing, high-end networking,
    and communications that require very high
    bandwidth, lower latency and more density.

https//openfive.com/hbm3-2e-2-ip-subsystem/
3
HBM3/2E/2 ASIC SiP
  • As an early advocate of 2.5D and 3D ASIC design
    technologies and by leveraging its experience
    from the industrys first multiple successful
    2.5D SoC SiP demonstration, OpenFive plays a key
    role in enabling industry applications that
    leverage the HBM 3D-stacked DRAM technology.

https//openfive.com/hbm3-2e-2-ip-subsystem/
4
Protocol controller
  • JEDEC (JESD235B) HBM3/2E/2 DRAM specification
    compliant
  • Pseudo-channel mode support
  • Multi stack HBM3/2E/2 memory support
  • Power down self-refresh modes
  • Low latency controller features
  • Per channel data rate Up to 3.2Gbps/pin
  • Configurable independent channels
  • Memory access optimizations for bandwidth
    efficiency
  • Configurable error injection mechanisms for
    testability
  • DFI-like controller/PHY interface
  • Supports 11 21 PHY/controller frequency
    ratios
  • Memory die diagnostic features
  • JTAG connectivity for IEEE-1500 access, lane
    repair, training and loopback test modes
  • Multiple in-built test diagnostic features

https//openfive.com/hbm3-2e-2-ip-subsystem/
5
  • Please do visit my website for
  • in-depth information.
  • Website
  • https//openfive.com/hbm3-2e-2-ip-subsystem/
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