Market Research Future Analyzes Impact of COVID-19 on Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC) Market 2023

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Power Supply in Package (PSiP) and Power Supply
on Chip (PwrSoC)Market Set to Witness an Uptick
by 2023
Industry Survey, Growth, Competitive
Landscapeand Forecasts to 2023
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Power Supply in Package (PSiP) and Power Supply
on Chip (PwrSoC)Market

As per the latest report published by Market
Research Future (MRFR), the global power supply
in package (PSiP) and power supply on chip
(PwrSoC) market is set to reach a valuation of
USD 2,350.4 Mn by the year 2023. Power
electronics are witnessing widespread adoption
across various industry verticals. The incessant
technological innovation has led to the need for
greater power efficiency, high density, and
design flexibility of power modules. PSiP and
PwrSoC are hardware components that work as an
intermediary to supply power in electrical device
via a package or a chip. They facilitate a smooth
flow of power over the printed circuit board
(PCB). Simple manufacturing process of PSiP and
PwrSoC as compared to conventional DC to DC
converters ICs is major factor driving the market
growth. PwrSoC and PSiP is superior technology,
which eliminate the need for external components
and offer a shorter version of the design process
as compared to DC-DC converter IC. Furthermore,
integrating mixed-signal technology with PSiP and
PwrSoC IC is another factor driving their
adoption.  The diverse offerings of these compact
ICs with low power consumption and manufacturing
cost with greater functionality and fault
management for various applications make them a
sough-after IC solution. The growth of
silicon-carbide (SiC) and gallium nitride (GaN)
is likely to create new application opportunities
for PSiP and PwrSoC ICs in the years to come.
Innovation in silicon-based technology has led to
increased utilization of wide-bandgap materials
such as gallium nitride (GaN) and silicon carbide
(SiC) electrical modules. Such technologies are
yet to reach their fullest potential, hence the
prospects for PSiP and PwrSoC remain
boundless. Get Free Sample Report
_at_ https//www.marketresearchfuture.com/sample_requ
est/7764
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Power Supply in Package (PSiP) and Power Supply
on Chip (PwrSoC)Market

Global Power Supply in Package (PSiP) and Power
Supply on Chip (PwrSoC) Market Segmental
Analysis MRFRs report includes a comprehensive
segmental analysis of the market on the basis of
product, application area, and region.  Based on
product, the market has been segmented into PSiP
and PwrSoC. In terms of value, the PSiP segment
accounted for an astronomical 89.4 market share
in 2017. In addition, the segment is expected to
surpass a market valuation of USD 2,000 Mn by
2023, reflecting a double-digit growth rate. By
application area, the market has been segmented
into telecom and IT, automotive, consumer
electronics, medical devices, and military and
defense. The consumer electronics segment
accounted 58.8 share of the market and is poised
to increase at a CAGR of 25.7 during the
forecast period (2018-2023). Global Power Supply
in Package (PSiP) and Power Supply on Chip
(PwrSoC) Market Regional Outlook On the basis of
region, the market has been segmented into North
America, Europe, Asia Pacific (APAC), and the
Rest of the World (RoW). The market in APAC is
expected to remain highly attractive during the
forecast period. In 2017, APAC commanded 48.3
share of the market and projected to exhibit
26.9 CAGR during the assessment period.
Emergence of China as global manufacturing hub
has been instrumental in driving the market
growth in APAC. Meanwhile, the market in North
America is set to witness the highest CAGR over
2023. Presence of a strong consumer electronics
market in North America remains a favorable
factor for market players operating in the
region. Europe is expected to maintain its
position as the third largest market for PSiP and
PweSoC throughout the review period. Global Power
Supply in Package (PSiP) and Power Supply on Chip
(PwrSoC) Market Competitive Landscape Intel
Corporation, ASE Group, Amkor Technology, TDK
Corporation, Panasonic Corporation, Bel Fuse
Inc., Jiangsu Changjiang Electronics Technology
Co. Ltd., Texas Instruments Incorporated, ON
Semiconductor and Vicor Corporation are some of
key companies profiled in MRFRs report. Get
Complete Report _at_ https//www.marketresearchfuture
.com/reports/power-supply-in-package-chip-market-7
764
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