Potting and Encapsulating Compounds Market - Industry Insights, Global Analysis And Forecast to 2026 - PowerPoint PPT Presentation

} ?>
View by Category
About This Presentation
Title:

Potting and Encapsulating Compounds Market - Industry Insights, Global Analysis And Forecast to 2026

Description:

Potting component is highly dielectric materials and is generally used in electronic and electrical devices which provide electrical insulation and protection against harsh environmental conditions such as moisture and fire flames. Whereas encapsulation is a method of assembling an electronic device with a solid compound to protect against corrosion, shock, moisture, and vibration. They are majorly used for various applications in electronic and electrical industry and these devices have capability to work under heat, stress, and attain a low outgassing performance. – PowerPoint PPT presentation

Number of Views:12

less

Write a Comment
User Comments (0)
About PowerShow.com