Potting and Encapsulating Compounds Market - Industry Insights, Global Analysis And Forecast to 2026

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Potting and Encapsulating Compounds Market -
Industry Insights, Global Analysis And Forecast
to 2026
Potting and Encapsulating Compounds Market By
Type (Epoxy Resin, Polyurethane Resin, Silicone
Resin, Polyester System, Polyamide), Application
(Electronics, Electrical), Curing technique (Room
Temperature Cured, High Temperature or Thermally
Cured, UV Cured), End user industry (Consumer
Electronics, Transportation, Energy Power,
Solar Power, Others), Geography (North America,
South America, Europe, Asia-Pacific, Middle East
and Africa) Industry Trends and Forecast to
2026
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tresearch.com/reports/global-potting-and-encapsula
ting-compounds-market
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Report Description
Global potting and encapsulating compounds market
is expected to rise in the forecast period of
2019-2026. The report contains data of the base
year 2018 and historic year 2017. This rise in
market value can be attributed to the advancement
tin technology and growing trend for polyurethane
resins globally. Potting component is highly
dielectric materials and is generally used in
electronic and electrical devices which provide
electrical insulation and protection against
harsh environmental conditions such as moisture
and fire flames. Whereas encapsulation is a
method of assembling an electronic device with a
solid compound to protect against corrosion,
shock, moisture, and vibration. They are majorly
used for various applications in electronic and
electrical industry and these devices have
capability to work under heat, stress, and attain
a low outgassing performance.
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ing-compounds-market
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Major Key Players

• Some of the major players operating in this
  market are
• Henkel Adhesives Technologies India Private
  Limited
• Dymax Corporation
• Master Bond Inc.
• Electrolube
• CHT UK Manchester Ltd
• EFI Polymers
• Epic Resins

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potting-and-encapsulating-compounds-market
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Market Segmentation

• By Type (Epoxy Resin, Polyurethane Resin,
  Silicone Resin, Polyester System, Polyamide)
• By Application (Electronics, Electrical)
• By End user industry (Consumer Electronics,
  Transportation, Energy Power, Solar Power,
  Others)

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l-potting-and-encapsulating-compounds-market
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Regional Analysis

• Based on geography, the market is segmented into
  five geographical regions
• North America
• Europe
• Asia-Pacific
• South America
• Middle East
• Africa

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