Next-Generation Memory Market

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MarketsandMarkets Research Private Ltd.
Presents
Next-Generation Memory Market worth 9.7 billion
by 2023 with a growing CAGR of 26.5
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The report "Next-generation Memory Market by
Technology (Volatile Memory Technology (HMC and
HBM), Non-volatile Memory Technology (MRAM, FRAM,
ReRAM, 3D XPoint, and NRAM)), Wafer Size (200 mm,
300 mm, and 450 mm), Application, and Region-
Global Forecast to 2023", is projected to grow
from USD 2.4 billion in 2017 to USD 9.7 billion
by 2023, at a CAGR of 26.5 between 2017 and
2023. The requirement for highly scalable, low
power consumption, and high bandwidth memory
devices to store data generated from the advent
of technologies such as the Internet of Things
(IoT), big data, and Artificial Intelligence (AI)
is expected to drive the market growth.
Additionally, the need for increased bandwidth of
universal memory devices, and rise in the use of
enterprise storage solutions to backup and
archive data is likely to augment market growth.
Browse gtgt 70 Market data
tables 49 figures
173 pages and in-depth TOC on
Next-Generation Memory Market
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Next-generation memory devices refer to the
emerging memory solutions that have already been
introduced in the market or are currently under
development and are expected to penetrate the
market in the coming years. These devices offer
high power efficiency, excellent endurance,
increased scalability, and high density. They
have fast switching time, low power consumption,
and low operating voltages. The increasing demand
for emerging non-volatile memory solutions for
use in connected devices and the growing
requirement to replace traditional flash memory
used in smartphones, tablets, etc. with new and
advanced memory are also expected to act as
growth opportunities for the next-generation
memory market in the coming years. Non-volatile
memory technology led the next-generation memory
market in 2016 Storage devices using
non-volatile memory technology can retain data
stored in them even without a power source. They
are used typically for secondary storage or
long-term persistent storage. The devices using
this technology are fast, efficient, and
cost-effective. The non-volatile memory
technology segment led to the next-generation
memory market in 2016. The growth of this segment
can be attributed to the increasing demand for
resistive random access memory (ReRAM),
spin-transfer torque magnetoresistive random
access memory (STT-MRAM), and 3D XPoint memory
that offer better speed and improved performance
as compared to volatile memory such as dynamic
random access memory (DRAM) and static random
access memory (SRAM).
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Among applications, the consumer electronics
segment of the next-generation memory market is
projected to grow at the highest CAGR between
2017 and 2023 Consumer electronics is among the
largest application areas of next-generation
memory solutions. The performance requirements in
consumer electronics are continuously increasing
in terms of processing power and memory density
while ensuring persistence in product costs. The
next-generation memory solutions can meet the
requirements of consumer electronics equipped
with advanced technologies such as AI, IoT, and
big data analytics to store large volumes of data
generated. Next-generation memory solutions are
used widely in consumer electronic devices such
as wearable devices, set-top boxes, digital
cameras, tablets, handheld personal communication
systems, desktops, and laptops. The consumer
electronics segment of the next-generation memory
market is projected to grow at the highest CAGR
between 2017 and 2023. Among wafer sizes, 450
mm wafers are projected to witness the highest
demand during the forecast period 450 mm wafer
fabs can accommodate more dies per wafer than 300
mm wafer fabs. These wafers are expected to
become the preferred choice for next-generation
memory technologies, owing to increasing wafer
costs and feature dimensions. Thus, the 450 mm
segment of the market is projected to grow at the
highest CAGR from 2017 to 2023.
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Asia Pacific is projected to lead the
next-generation memory market from 2017 to
2023 The Asia Pacific region led the
next-generation memory market in 2016. It is
expected to lead the market during the forecast
period as well. The growth of the market in this
region can be attributed to the increasing number
of data centers and servers, a growing number of
network equipment shipped, and rising
manufacturing activities in the consumer
electronics sector in Asia Pacific. Samsung
(South Korea), Toshiba (Japan), Intel (US),
Micron (US), Western Digital (US), SK Hynix
(South Korea), Fujitsu (Japan), Everspin (US),
Microchip (US), Adesto (US),  Avalanche (US),
Cypress (US), IBM (US), NXP Semiconductors
(Netherlands), Rambus (US), Open-Silicon (US),
Spin Transfer Technologies (US), Viking (US),
Texas Instruments (US), and 4DS Memory
(Australia) are leading companies in the
next-generation memory market.
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