Title: Molded Interconnect Devices (MID) Market Size worth USD 629.5 Million by 2023: Global Market Insights, Inc.
1Molded Interconnect Devices (MID) 2016 2023
2Global Market Scenario of Molded Interconnect
Devices (MID)
- Molded interconnect devices (MID) market
size was valued at over USD 225 million in 2015,
with 13.8 CAGR growth forecast from 2016 to
2023. Higher function density and design
flexibility is anticipated to propel industry
demand. - Molded interconnect devices enable integration
of mechanical and electronic components and
circuits directly on 3D (three-dimensional)
plastic components. - This helps in integrating chips elegantly with
their assemblies, and also allows the antennae in
smartphones or notebooks to be installed directly
within the housing. This in turn facilitates in
saving a great amount of space and
miniaturization. - These products offer high level of design
freedom and also exhibit less assembly steps when
compared to conventional printed circuit boards
(PCB). - https//www.gminsights.com/industry-analysis/molde
d-interconnect-devices-MID-market
3Continue.....
- Furthermore, integration of functions and
sensors aids in reducing assembly times as well
as number of production steps. This is expected
to optimize the supplementary costs and also
facilitate in manufacturing high quality
components. - Technique such as direct bare chip assembly on
substrates is anticipated to further fuel
industry demand over the forecast period. - Selective metallization offered by these products
is expected to drive MID market size over the
next seven years. - High reliability as a result of low failure ratio
can be attributed to low degree of complexity of
the systems due to existence of very less number
of auxiliary components. They also have superior
environmental benefits as it uses thermoplastic
materials with minimal additives. - https//www.gminsights.com/industry-analysis/molde
d-interconnect-devices-MID-market
4China molded interconnect device market size, by
application, 2012-2023 (USD Million)
https//www.gminsights.com/industry-analysis/molde
d-interconnect-devices-MID-market
5360 Analysis
- Application Analysis
- Telecommunication application accounted for more
than 60 of the global revenue in 2015, and is
poised to grow at 13.6 CAGR from 2016 to 2023.
The growth can be primarily attributed to
increasing usage in antennas. Automotive is
forecast to witness the fastest growth in the
coming years at 14.8 CAGR, owing to increasing
product adoption in brake-light fixtures. - Regional Analysis
- Asia Pacific molded interconnect devices market
size was valued at over USD 175 million in 2015.
Growth across the region can be mainly credited
to availability of low priced components in
China. - Europe MID market share is expected to exhibit
potential growth owing presence of large number
of automotive industries across the region. - Competitive Market Share
- Key industry participants accumulating major
molded interconnect device market share include
Molex, TE Connectivity and Harting Technology
Group. Other notable players are MacDermid
Incorporated, LPKF Laser Electronics,
SelectConnect Technologies, and RTP Company.
6 Latest Research Report On Molded interconnect
devices (MID) Market _at_ https//www.gminsights.com/
industry-analysis/molded-interconnect-devices-MID-
market Download Latest Report PDF _at_
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