Molded Interconnect Devices (MID) Market Size worth USD 629.5 Million by 2023: Global Market Insights, Inc.

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Molded Interconnect Devices (MID) 2016 2023
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Global Market Scenario of Molded Interconnect
Devices (MID)

• Molded interconnect devices (MID) market
  size was valued at over USD 225 million in 2015,
  with 13.8 CAGR growth forecast from 2016 to
  2023. Higher function density and design
  flexibility is anticipated to propel industry
  demand.
• Molded interconnect devices enable integration
  of mechanical and electronic components and
  circuits directly on 3D (three-dimensional)
  plastic components.
• This helps in integrating chips elegantly with
  their assemblies, and also allows the antennae in
  smartphones or notebooks to be installed directly
  within the housing. This in turn facilitates in
  saving a great amount of space and
  miniaturization.
• These products offer high level of design
  freedom and also exhibit less assembly steps when
  compared to conventional printed circuit boards
  (PCB).
• https//www.gminsights.com/industry-analysis/molde
  d-interconnect-devices-MID-market

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• Furthermore, integration of functions and
  sensors aids in reducing assembly times as well
  as number of production steps. This is expected
  to optimize the supplementary costs and also
  facilitate in manufacturing high quality
  components.
• Technique such as direct bare chip assembly on
  substrates is anticipated to further fuel
  industry demand over the forecast period. 
• Selective metallization offered by these products
  is expected to drive MID market size over the
  next seven years.
• High reliability as a result of low failure ratio
  can be attributed to low degree of complexity of
  the systems due to existence of very less number
  of auxiliary components. They also have superior
  environmental benefits as it uses thermoplastic
  materials with minimal additives.
• https//www.gminsights.com/industry-analysis/molde
  d-interconnect-devices-MID-market

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China molded interconnect device market size, by
application, 2012-2023 (USD Million)
https//www.gminsights.com/industry-analysis/molde
d-interconnect-devices-MID-market

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360 Analysis

• Application Analysis
• Telecommunication application accounted for more
  than 60 of the global revenue in 2015, and is
  poised to grow at 13.6 CAGR from 2016 to 2023.
  The growth can be primarily attributed to
  increasing usage in antennas. Automotive is
  forecast to witness the fastest growth in the
  coming years at 14.8 CAGR, owing to increasing
  product adoption in brake-light fixtures.
• Regional Analysis
• Asia Pacific molded interconnect devices market
  size was valued at over USD 175 million in 2015.
  Growth across the region can be mainly credited
  to availability of low priced components in
  China.
• Europe MID market share is expected to exhibit
  potential growth owing presence of large number
  of automotive industries across the region.  
• Competitive Market Share
• Key industry participants accumulating major
  molded interconnect device market share include
  Molex, TE Connectivity and Harting Technology
  Group. Other notable players are MacDermid
  Incorporated, LPKF Laser Electronics,
  SelectConnect Technologies, and RTP Company.  

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Latest Research Report On Molded interconnect
devices (MID) Market _at_ https//www.gminsights.com/
industry-analysis/molded-interconnect-devices-MID-
market Download Latest Report PDF _at_
https//www.gminsights.com/request-sample/detail/4
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