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AdvancedTCA

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The main fabric mesh has up to 10Gbps between all boards, and ... use the same switched fabric boards ... pairs) links between fabric slot and each node ... – PowerPoint PPT presentation

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Title: AdvancedTCA


1
AdvancedTCA
About PICMG 3.x
  • PICMG 3.0 defines mechanics, board dimensions,
    power distribution, power and data
    connectors,
  • and system management
  • PICMG 3.1 defines an Ethernet switch fabric for
    data up to 10 Gbps per link
  • PICMG 3.2 defines how InfiniBand systems are
    built within this architecture
  • PICMG 3.3 defines a StarFabric implementation
    over the backplane providing TDM, cell,
    control, and packet connectivity over the same
    fabric
  • PICMG 3.4 defines PCI Express
  • PICMG 3.5 defines RapidIO

2
AdvancedTCA
About PICMG 3.x
  • Scalable capacity up to 2.5Tbs
  • Board size 8U (322.25mm) high and 280mm deep
  • 140 sq. inch compared with 54 sq. inch for VME
    and cPCI
  •   Slot pitch is now 1.2 (taller components like
    next generation CPUs)
  • The main fabric mesh has up to 10Gbps between
    all boards, and supports Ethernet (1G or
    10G), InfiniBand (2.5G or 10G), StarFabric
  • (2.5G to 10G) , PCI Express (10G), or RapidIO
    (2.5 to 10G)
  • Dissipated power 150- 200W per board
  • 8 high speed differential pairs per data link,
    each pair capable of data transmission up to
    5Gbps          

3
AdvancedTCA
About PICMG 3.x
  • Zone1 Power Distribution System Management
    zone (new Positronic 34 pin
    connector)
  • Zone2 Data Transport zone (ZD high speed
    differential connector)
  • Zone3 Rear I/O Access zone (connecter free for
    the customer)

4
AdvancedTCA
About PICMG 3.x
  • Power distribution Dual -48VDC DC-DC
    converters on boards
  • Slot types Hub Slots Node Slots Mesh
    Enabled Slots
  •  Topologies Dual Star two Hub
    Slots  Dual-Dual Star four Hub Slots   Mesh
    all slots are Mesh Enabled Slots   
    Replicated Mesh
  •  Rear Transition Module solutions
  •   Front Board direct connect to RTM the
    backplane has no Zone 3 implemented
  • Cable bulkhead
  • Front Board connect to RTM via the Zone 3
    connectors  

5
VITA 34 Embedded Modular Architecture
About VITA 34
  • Board size 8Uhigh / 220mm deep or 4U high /
    220mm deep (6U may also be an option)
  • Slot pitch 6HP (1.2inch)
  • Boards encased in metal (shielding)
  • Optical connectors planed (TBD for the future)
  • Signal connectors (TBD ZD connector possible)
  • Power connectors (TBD Positronic connector
    possible)
  • Supports liquid and spray cooling for high power
    applications

6
VITA 34 Embedded Modular Architecture
About VITA 34
  • Defines an entirely new equipment practice
    (components are not available right now)
  • Power is handled by distributed 48 VDC to each
    board DC/DC converters for other voltages  

7
VITA 41 VXS VME Switched Serial Standard
About VITA 41
  • Enables high speed communication in a VME
    compatible system
  • New features High speed connector on P0/J0,
    alignment and keying, board with high speed
    connectors acting as a switch
  • Switch fabric links are implemented between
    Switch Slots and Payload Slots (P0 area)
  • Each Payload board route one standard 4X link to
    each Switch board
  • A standard 4X link is a group of four 1X links
    (2 differential pair, 1 for transmitting and 1
    for receiving)

8
VITA 41 VXS VME Switched Serial Standard
About VITA 41
  • Topologies Single Star Topology (one Switch
    slot) Dual Star Topology (two Switch
    slots). Mesh is also possible.
  • Protocols supported InfiniBand (41.1), RapidIO
    (41.2), and in future may support
    Ethernet (41.3), PCI Express (41.4)
    and StarFabric (41.5) protocols

9
VITA 41 VXS VME Switched Serial Standard
About VITA 41
  • No. of layers for additional high speed signals
    4 positive layers
  •  Backward compatibility Standard VME boards can
    be installed in VXS Payload slots, do not
    participate in the high speed communication
  • Connector used P0 connector MultiGig from Tyco

10
VITA 31.1 Gigabit Ethernet on VME64x
About VITA 31.1
  • Defines a pinout for implementing a
    10/100/1000BASE-T Ethernet switched network
    on a VME64x backplane
  • Adopts the PICMG 2.16 P3 connector pinout for
    use on VME64x boards
  •  Slot types Node slots (P1/P2 DIN 160pin / P0
    HM2.0mm) Fabric Slots
    (P1-P5 HM2.0mm connectors)
  • VME64x systems and CompactPCI PSB (PICMG 2.16)
    systems can use the same switched fabric
    boards
  •  Links implementation 10/100Mbps (2 differential
    pairs) links or 1000Mbps (4 differential
    pairs) links between fabric slot and each node
  •  Topologies Single Fabric Topology Dual Fabric
    Topology

11
VITA 31.1 Gigabit Ethernet on VME64x
About VITA 31.1
  • Backward compatibility Standard VME boards can
    be used without participating in the
    Ethernet communication
  • Features IPMB supported on Fabric Slots P1/P2
    and Node Slots according to VITA 38 (System
    Management for VME)
  • Scalable bit rate/slot (10-1000Mbps) using
    Ethernet Auto Negotiation         

12
RapidIO
  • Intra-system solution between chips and boards
  • Inter-system connection via bridge
  • RapidIO packet-based point-to-point system
    interconnect architecture using LVSD
  • Direct link between to destination
  • 10 Gbps aggregate bandwidth using 8-bit wide
    input and output data ports

13
Infiniband
  • Chip-to-chip and board-to-board communications
    (inside the box)
  • Packet-switched architecture similar to internet
    protocol (IP)
  • Inter-system connection
  • Competition to Fibre Channel and Ethernet
  • Up to four PCI devices per bridge
  • 16-bit LVDS at 400 Mhz
  • I/O architecture interoperates with any server
    technology on the market
  • Three levels of link performance - 2.5 Gbits, 10
    Gbits, and 30 Gbs

14
PCI Express
  • I/O technology compatible with the current PCI
    software environment
  • Packetized protocol
  • Uses embedded clocking scheme to enable better
    frequency scaling
  • For chip-to-chip and add-in card applications
    (in-the-box applications)
  • The Base specification describes the protocol,
    signaling and software

15
Thank You!
Further information about High-Speed Backplanes
www.bustronic.com
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