Techniques and Tools for Product-Specific Analysis Templates Towards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics

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Techniques and Tools for Product-Specific
Analysis TemplatesTowards Enhanced CAD-CAE
Interoperability for Simulation-Based Design and
Related Topics
2002 International Conference on Electronics
Packaging (ICEP) JIEP/ IMAPS Japan, IEEE CPMT
Japan Chapter Dai-ichi Hotel Seafort, Tokyo,
Japan April 17-19, 2002
http//eislab.gatech.edu/pubs/conferences/2002-jie
p-icep-peak/

• Russell Peak
• Senior Researcher
• Manufacturing Research Center
• Georgia Tech

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Abstracthttp//eislab.gatech.edu/pubs/conferences
/2002-jiep-icep-peak/
Techniques and Tools for Product-Specific
Analysis TemplatesTowards Enhanced CAD-CAE
Interoperability for Simulation-Based Design and
Related Topics Design engineers are becoming
increasingly aware of analysis template pockets
that exist in their product domain. For example,
thermal resistance and interconnect reliability
analysis are common templates for electronic chip
packages, while tire-roadway templates exist to
verify handling, durability, and slip
requirements. Such templates may be captured as
paper-based notes and design standards, as well
as loosely structured spreadsheets and electronic
workbooks. Often, however, they are not
articulated in any persistent form. Some CAD/E
software vendors are offering pre-packaged
analysis template catalogs like the above
however, they are typically dependent on a
specific toolset and do not present
design-analysis idealization associativity to the
user. Thus, it is difficult to adapt, extend, or
transfer analysis template knowledge. As noted
in places like the 2001 International Technology
Roadmap for Semiconductors (ITRS), domain- and
tool-independent techniques and related standards
are necessary. This paper overviews
infrastructure needs and emerging analysis
template theory and methodology that addresses
such issues. Patterns that naturally exist in
between traditional CAD and CAE models are
summarized, along with their embodiment in a
knowledge representation known as constrained
objects. Industrial applications for airframe
structural analysis, circuit board
thermomechanical analysis, and chip package
thermal resistance analysis are noted. This
approach enhances knowledge capture, modularity,
and reusability, as well as improves automation
(e.g., decreasing total simulation cycle time by
75). The object patterns also identify where
best to apply information technologies like STEP,
XML, CORBA/SOAP, and web services. We believe
further benefits are possible if these patterns
are combined with other efforts to enable
ubiquitous analysis template technology. Trends
and needs towards this end are discussed,
including analogies with electronics like JEDEC
package standards and mechanical subsystems.
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Nomenclature
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Contents

• Motivation
• Introduction to Information Modeling and
  Knowledge Representation
• Analysis Template Applications
• International Collaboration on Engineering
  Frameworks
• Recommended Solution Approach

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Motivation Product ChallengesTrend towards
complex multi-disciplinary systems
MEMS devices
Demanding End User Applications
http//www.zuken.com/solutions_board.asp
3D interconnects
Source www.ansys.com
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Motivation Engineering Tool Challenges2001
International Technology Roadmap for
Semiconductors (ITRS)http//public.itrs.net/Files
/2001ITRS/Home.htm 

• Design Sharing and Reuse
• Tool interoperability
• Standard IC information model
• Integration of multi-vendor and internal design
  technology
• Reduction of integration cost
• Simulation module integration
• Seamless integration of simulation modules
• Interplay of modules to enhance design
  effectiveness

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Advances Needed in Engineering Frameworks2001
International Technology Roadmap for
Semiconductors (ITRS)http//public.itrs.net/Files
/2001ITRS/Home.htm 
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AnalogyPhysical Integration Modules ? Model
Integration Frameworks
Design System Architecture
Stacked Fine-Pitch BGA
www.shinko.co.jp
System-On-a-Package (SOP)
www.prc.gatech.edu
2001 ITRS
Multidisciplinary challenges require innovative
solution approaches
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Interoperability
Seamless communication between people, their
models, and their tools.

• Requires techniques beyond traditional
  engineering
• Information models
• Abstract data types
• Object-oriented languages (UML, STEP Express, )
• Knowledge representation
• Constraint graphs, rules,
• Web/Internet computing
• Middleware, agents, mobility,
• Emerging field engineering information methods
• Analogous to CAD and FEA methods

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Contents

• Motivation
• Introduction to Information Modeling and
  Knowledge Representation
• Analysis Template Applications
• International Collaboration on Engineering
  Frameworks
• Recommended Solution Approach

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Collaborative Modeling vs. Tool Usage
Existing Tools
Tool A1
Tool An
...
Content Coverage Gaps
Product Model - integrated information model -
knowledge representation
Integration Gaps
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Example Information Model in Express (ISO
10303-11) spring system tutorial
SCHEMA spring_systems ENTITY spring
undeformed_length REAL spring_constant
REAL start REAL end0 REAL length0
REAL total_elongation REAL force
REAL END_ENTITY ENTITY two_spring_system
spring1 spring spring2 spring
deformation1 REAL deformation2 REAL
load REAL END_ENTITY END_SCHEMA
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Instance Model and Example Application spring
system tutorial
Fragment from an instance model - (a.k.a. Part 21
STEP File - ISO 10303-21) 1TWO_SPRING_SYSTEM(
2,3,1.81,3.48,10.0) 2SPRING(8.0,5.5,0.0,9.81,9
.81,1.81,10.0) 3SPRING(8.0,6.0,9.8,19.48,9.66,1
.66,10.0)
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PWB Stackup Design Analysis Tool
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Application-Oriented Information Model -
Express-G notation PWB Stackup Design Analysis
Tool
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Contents

• Motivation
• Introduction to Information Modeling and
  Knowledge Representation
• Analysis Template Applications
• International Collaboration on Engineering
  Frameworks
• Recommended Solution Approach

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Analysis Template CatalogChip Package
Simulationthermal, hydro(moisture), fluid
dynamics(molding), mechanical and electrical
behaviors

• PakSi-TM and PakSi-E tools
• http//www.icepak.com/prod/paksi/ as of 10/2001
• Chip package-specific behaviors
• thermal resistance, popcorning, die cracking,
  delaminating, warpage coplanarity, solder joint
  fatigue, molding, parasitic parameters
  extraction, and signal integrity

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Analysis Template Methodology X-Analysis
Integration Objectives (XDesign, Mfg., etc.)

• Goal
• Improve engineering processes via analysis
  templates with enhanced CAx-CAE interoperability
  
• Challenges (Gaps)
• Idealizations Heterogeneous Transformations
• Diversity Information, Behaviors, Disciplines,
  Fidelity, Feature Levels, CAD/CAE Methods
  Tools,
• Multi-Directional Associativity
• Design?Analysis, Analysis ? Analysis
• Focus
• Capture analysis template knowledge for modular,
  regular design usage
• Approach
• Multi-Representation Architecture (MRA)using
  Constrained Objects (COBs)

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X-Analysis Integration Techniquesfor CAD-CAE
Interoperabilityhttp//eislab.gatech.edu/tools/Xa
iTools/
a. Multi-Representation Architecture (MRA)
b. Explicit Design-Analysis Associativity
c. Analysis Module Creation Methodology
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COB-based Constraint Schematic for
Multi-Fidelity CAD-CAE InteroperabilityFlap Link
Benchmark Example
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An Introduction to X-Analysis Integration (XAI)
Short Course Outline

• Part 1 Constrained Objects (COBs) Primer
• Nomenclature
• Part 2 Multi-Representation Architecture (MRA)
  Primer
• Analysis Integration Challenges
• Overview of COB-based XAI
• Part 3 Example Applications
• Airframe Structural Analysis (Boeing)
• Circuit Board Thermomechanical Analysis (DoD,
  JPL/NASA)
• Chip Package Thermal Analysis (Shinko)
• Summary
• Part 4 Advanced Topics Current Research

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Chip Package Products Shinko
Quad Flat Packs (QFPs)
Plastic Ball Grid Array (PBGA) Packages
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Flexible High Diversity Design-Analysis
Integration Electronic Packaging Examples Chip
Packages/Mounting Shinko Electric Project
Phase 1 (completed 9/00)
Analysis Modules (CBAMs) of Diverse Behavior
Fidelity
Modular, Reusable Template Libraries
Design Tools
Prelim/APM Design Tool
Analysis Tools
XaiTools ChipPackage
XaiTools ChipPackage
General Math Mathematica
FEAAnsys
Thermal Resistance
Analyzable Product Model
3D
XaiTools
PWB DB
Materials DB
ThermalStress
EBGA, PBGA, QFP
Basic 3D
Basic Documentation Automation
AuthoringMS Excel
Demonstration module
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COB-based Analysis TemplateTypical Highly
Automated Results
COB constrained object
Auto-Created FEA Inputs (for Mesh Model)
Analysis Module Tool
FEA Temperature Distribution
Thermal Resistance vs. Air Flow Velocity
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Pilot Initial Production Usage ResultsProduct
Model-Driven Analysis
VTMB variable topology multi-body technique
Koo, 2000

• Reduced FEA modeling time gt 101 (days/hours ?
  minutes)
• Reduced simulation cycle gt 75

References 1 Shinko 5/00 (in Koo, 2000) 2
Shinko evaluation 10/12/00

• Enables greater analysis intensity ? Better
  designs
• Leverages XAI / CAD-CAE interoperability
  techniques
• Objects, Internet/web services, ubiquitization
  methodology,

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Analysis Template Merits

• Provides methodology for bridging associativity
  gap
• Multi-representation architecture (MRA)
  constrained objects (COBs)
• Address fundamental issues
• Explicit CAD-CAE associativity multi-fidelity,
  multi-directional, fine-grained
• Enable analysis template methodology ?
  Flexibility broad application
• Increase quality, reduce costs, decrease time
  (ex. 75)
• Capture engineering knowledge in a reusable form
• Reduce information inconsistencies
• Increase analysis intensity effectiveness

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Contents

• Motivation
• Introduction to Information Modeling and
  Knowledge Representation
• Analysis Template Applications
• International Collaboration on Engineering
  Frameworks
• Recommended Solution Approach

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Towards Greater Standards-Based Interoperability
Target Analogy with Electronics Systems

• Today - Monolithic software applications Few
  interchangeable parts
• Next Steps - Identify other formal patterns and
  use cases
• (natural subsystems / levels of packaging)
• - Define standard architectures and interfaces
  among subsystems

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Progress on Standards-Based Engineering
Frameworks that include STEP AP210 (Electronics),
PDM Schema, and AP233 (Systems)An Engineering
Framework Interest Group (EFWIG) Overview
2002 NASA-ESA Workshop on Aerospace Product Data
Exchange ESA/ESTEC, Noordwijk (ZH), The
Netherlands April 9-12, 2002
ISO 10303 series

• Russell Peak - Georgia Tech, Atlanta GA, USA
• Mike Dickerson - JPL/NASA, Pasadena CA, USA
• Lothar Klein - LKSoft, Kuenzell, Germany
• Steve Waterbury - NASA-Goddard, Greenbelt MD, USA
• Greg Smith - Boeing, Seattle WA, USA
• Tom Thurman - Rockwell Collins, Cedar Rapids IA,
  USA
• Jim U'Ren - JPL/NASA, Pasadena CA, USA
• Ken Buchanan - ATI/PDES Inc., Charleston SC, USA

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Scope of Engineering Framework Interest Group A
PDES Inc. Systems Engineering Subprojecthttp//ei
slab.gatech.edu/efwig/

• Interoperability in multi-disciplinary
  engineering development environments
• Emphasis dimensions
• Organizational Level engineering
  group/department
• Domains systems s/w engineering,
  electromechanical, analysis
• Design stages WIP designs at concept,
  preliminary, and detailed stages
• Awareness of design interfaces to other life
  cycle phases
• pursuit order capture, mfg., operation/service,
  and disposal

An international consortium for standards-based
collaborative engineering http//pdesinc.aticorp.o
rg/
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What is the context of Systems Engineering?
User/Owner/Operator
Acquisition Authority
Systems Engineering
Specifications
STEP ISO SC4
UML ISO SC7
Engineering Disciplines
2002-04 - Mike Dickerson, NASA-JPL
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Spacecraft Development Using ISO 10303 and Other
Standards

• Electrical Engineering
• Standard AP210
• Software Mentor Graphics
• Status Prototyped
• Rockwell, Boeing

• Cabling
• Standard AP212
• Software MentorGraphics
• Status Prototyped
• Daimler-Chrysler, ProSTEP

• Propulsion
• Standard STEP-PRP
• Software-
• Status In Development
• ESA, EADS

• Fluid Dynamics
• Standard CFD
• Software -
• Status In Development
• Boeing,

• Software Engineering
• StandardUML - (AP233 interface In Development)
• SoftwareRational Rose, Argo, All-Together
• Status In Production
• Industry-wide

• Mechanical Engineering
• Standard AP203, AP214
• Software Pro-E, Cadds, SolidWorks, AutoCad, SDRC
  IDEAS, Unigraphics, others
• Status In Production
• Aerospace Industry Wide, Automotive Industry

• Optics
• Standard NODIF
• Software - TBD
• Minolta, Olympus

• Systems Engineering
• Standard AP233
• Software Statemate, Doors, Matrix-X, Slate,
  Core, RTM
• Status In development / Prototyped
• BAE SYSTEMS, EADS, NASA

• Structural Analysis
• Standard AP209
• Software MSC Patran, Thermal Desktop
• Status In Production
• Lockheed Martin, Electric Boat

• PDM
• Standard STEP PDM Schema/AP232
• Software MetaPhase, Windchill, Insync
• Status In Production
• Lockheed Martin, EADS, BAE SYSTEMS, Raytheon

• Thermal Radiation Analysis
• Standard STEP-TAS
• Software Thermal Desktop, TRASYS
• Status In Production
• ESA/ESTEC, NASA/JPL Langely

• Inspection
• Standard AP219
• Software Technomatics, Brown, eSharp
• Status In Development
• NIST, CATIA, Boeing, Chrysler, AIAG

• Machining
• Standard STEP-NC/AP224
• Software Gibbs,
• Status In Development / Prototyped
• STEP-Tools, Boeing

• Life-Cycle Management
• Standard PLCS
• Software SAP
• Status In Development
• BAE SYSTEMS, Boeing, Eurostep

2001-12-16 - Jim URen, NASA-JPL
File SLIDE_STEP-in-Spacecraft-Development-Ver4.pp
t
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STEP AP 210 (ISO 10303-210) Domain Electronics
Design
800 standardized concepts (many applicable to
other domains) Development investment O(100
man-years) over 10 years
Adapted from 2002-04 - Tom Thurman,
Rockwell-Collins
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Rich Features in AP210 PWB tracesAP210
STEP-Book Viewer - www.lksoft.com
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Rich Features in AP210 Via/Plated Through Hole
Z-dimension details
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Rich Features in AP210 Electrical Component
The 3D shape is generated from these smart
features which have electrical functional
knowledge. Thus, the AP210-based model is much
richer than a typical 3D MCAD package model. 210
can also support the detailed design of a package
itself (its insides, including electrical
functions and physical behaviors).
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Rich Features in AP210 3D PCB Assembly
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PWA/PWB Assembly Simulation using AP210
User Alerted on Exceptions to Producibility Guidel
ines
Rules (From Definition Facility)
Generic Manufacturing Equipment Definitions
Specific Manufacturing Equipment Used
2002-03 - Tom Thurman, Rockwell-Collins
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AnalogyPhysical Integration Modules ? Model
Integration Frameworks
Design System Architecture
Stacked Fine-Pitch BGA
www.shinko.co.jp
System-On-a-Package (SOP)
Challenge Integrating Diverse Technologies
www.prc.gatech.edu
2001 ITRS
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Recommended Solution Approach

• Philosophy Consider engineering design
  environmentsas analogous to electronic packaging
  systems
• Leverage international collaboration with other
  industries
• Follow systems engineering approach
• Decompose problem into subsystems
• Architectures, components (standards, tools, ),
  and techniques
• Identify define gaps
• Identify existing solutions where feasible
• Define solution paths
• Identify who will supply/develop these
  components
• Develop prototype solutions
• Advocate solution standardization and vendor
  support
• Test in pilots
• Deploy in production usage