Highvoltage nanoimprint lithography of refractory metal films

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High-voltage nanoimprint lithography of
refractory metal films Dr. John A. Dagata
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Benefits of nanoimprint lithography Wafer-scale
fabrication of micro/nanostructures Stamp
curable resist - thermal or laser energy
source Advantages of incorporating an electric
field Induces a wide range of chemical
reaction and mass transport mechanisms Beyond
standard fab materials processing Functionalize
organics ? localize nanoparticles ? oxidize metal
films
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• Technology
• SPM oxidation of silicon Appl. Phys. Lett. 56
  2001 (1990)
• Electric field induces a water meniscus between
  the probe tip and substrate
• Everything oxidizes above 108 V/m

Major drawback is low throughput
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Overcome the throughput problem by extending a
serial concept to a parallel one
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• Commercial Applications
• Photonic waveguides and crystals
• Optical communications
• Nanoelectromechanical systems
• Sensors/actuators
• Biochips

ZrN/ZrO
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Application Fabrication of MRI calibration
prototypes
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Collaboration Opportunities CRADA SBIR For
technical details see the poster High-voltage
nanoimprint lithography of refractory metal
films N. Farkas, et al.
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Contact Information John A. Dagata Precision
Engineering Division Manufacturing Engineering
Laboratory National Institute of Standards
Technology 100 Bureau Drive MS 8212 Gaithersburg
MD 20899-8212 301-975-3597 tel. [phone]
fax john.dagata_at_nist.gov