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Standards and Specifications The Seven Wonders of Design Innovation

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Title: Standards and Specifications The Seven Wonders of Design Innovation


1
Standards and SpecificationsThe Seven Wonders of
Design Innovation
  • INTRODUCTION TO IPC STANDARDIZATION

2
Minimum Standards Tool Kit
3
Membership Development
  • PCB Manufacturers 382
  • EMS Companies 374
  • Suppliers 636
  • OEMs 753
  • Government/Others _198__
  • Total 2,343 Companies
  • IPC Designers Council 1,100 Individuals

4
Major IPC Program Areas
  • Management Programs
  • Industry Programs
  • Technical Programs
  • Education, Training Certification
  • Market Research/Statistical Programs
  • Public Policy Advocacy

5
Technical Programs
  • Standards Specifications
  • Technical Committees
  • Activities with Other Organizations
  • International Activities
  • Current Major Initiatives

6
Technical Programs
  • Standards Specifications
  • Standards, specifications and guidelines
    developed for PCB design, manufacture and
    assembly
  • ANSI-Accredited Standards Developing Organization
    (SDO)
  • Industry technology roadmaps
  • Software Code Standards for Interoperability

7
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8
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9
Technical Programs
  • Technical Committees
  • 21 General Committees
  • 160 Subcommittees and Task Groups
  • Consist of industry peers
  • Started writing standards in 1959 (46 years ago)
  • Responsible for round robin test programs
  • Managed by Technical Activities Executive
    Committee (TAEC)

10
Technical Programs
  • Activities with Other Organizations
  • Membership and Active Participation
  • National Electronics Manufacturing Initiative
    (NEMI) now iNEMI
  • American National Standards Institute (ANSI)
  • Underwriters Laboratories (UL)

11
Technical Programs
  • Activities with Other Organizations
  • Joint Standards Activity
  • Japan Printed Circuit Association (JPCA)
  • Wiring and Harness Manufacturers Association
    (WHMA)
  • Electronic Industries Alliance (EIA)
  • Joint Electron Device Engineering Council (JEDEC)
  • Jisso International Council (JIC)

12
Technical Programs
  • International Activities
  • Liaison D Status to IEC TC91
  • U.S. Technical Advisor (TA) IEC TC91 on SMT
  • Chairmanship of IEC TC91 on SMT
  • Secretary, US TAG on IEC TC93 on EDA
  • US TAG of ISO Task group on Solder materials
  • IPC standards internationally recognized

13
Technical Programs
  • World Electronic Circuits Council
  • China Printed Circuit Association (CPCA)
  • European Federation of Interconnection and
    Packaging (EFIP)
  • Hong Kong Printed Circuits Association (HKPCA)
  • Indian Printed Circuit Association (IPCA)
  • Japan Printed Circuits Association (JPCA)
  • Taiwan Printed Circuits Association (TPCA)
  • Korea Printed Circuits Association

14
Technical Programs
  • Current Major Initiatives
  • Optoelectronics
  • Lead-Free Halogen Free issues
  • Embedded components
  • Wire Harness workmanship
  • Electronics enclosures
  • 2004/2005 International Technology Roadmap
  • Material Declaration
  • Enterprise Communication Standards

15
004/2005
2004/2005
2002 - 2003
2004-2005
16
IPC Membership Location
  • A Global Membership
  • 78 North America
  • 11 Europe
  • 9 Asia
  • 2 Rest of World
  • Members in 47 Countries

17
How Does the Standards Process Work?
  • Task groups develop drafts of new standards and
    resolve comments at IPC meetings
  • Participants represent their company
  • Four stages to get comments from industry
  • Project Submission - TAEC approves form
  • Working Draft - gets project started
  • Proposal -solicits comments from industry
  • Interim Final - resolves comments for
    balloting

18
Standard Development Cycle
Industry Needs
Working Drafts
Project Approval
Expert review
Proposal
Final Ballot
Distribution
19
Terms and Definitions
  • Terminology is the key to good communication
  • IPC-T-50 initial release in 1965
  • Next revision is H scheduled for 2007
  • Use of the Treutler Classification Code
  • Builds on the standardization process
  • Contains over 2000 terms
  • Has international recognition
  • IEC 60194 identical except spelling

20
Classification Code
  • 1-Administration
  • 2-Engineering and Design for elect. pkg
  • 3-Components for electronic packaging
  • 4-Materials for electronic packaging
  • 5-Interconnect board fabrication processes
  • 6-Types/performance for Interconnections
  • 7-Assembly processes
  • 8-Types/performance for assemblies
  • 9-Quality/reliability for boards/assembly

21
Second Digit Family 6 ID
  • 60-General terms
  • 61-Rigid printed boards (organic)
  • 62-Flexible printed boards (organic)
  • 63-Flex-rigid printed boards (organic)
  • 64-Discrete wiring boards (organic)
  • 65-Inorganic printed boards (ceramic etc.)
  • 66-Molded structures (three dimensional)
  • 67-Hybrid/Multichip module structures
  • 68-(Reserved for future expansion)
  • 69-Other interconnecting structure terms

22
CC Description Examples
22. PRINTED BOARD AND PRINTED BOARD ASSEMBLY
DESIGN Contains terms related to printed board
and printed board assembly. Includes, but is not
limited to computer aided design (CAD) equipment
and software algorithms, such items as design
rule checks, direct input from CAE work stations,
gate assignment or gate swapping, fixed grid
snap-in, force field component manipulation, heat
sensitivity analysis, multi-directional conductor
routing etc.
77. REWORK, REPAIR AND MODIFICATION Contains
terms related to the techniques, tools, materials
and equipment used to remove, replace, or add
components to an interconnecting structure, or to
correct/change a circuit feature in the structure
itself, and terms related to restoring the
assembly to its proper function.
23
IPC-T-50 Published
  • Embedded Component 30.0436
  • A discrete or active component that is
    fabricated as an integral part of a printed
    board. (See Figure E-1.)

24
IPC-T-50 Published
  • Discrete Component 30.0392
  • A separate part of a printed board assembly that
    performs a circuit function, e.g., a resistor, a
    capacitor, a transistor,etc.
  • Active Device 30.0016
  • An electronic component whose basic character
    changes while operating on an applied signal.
    (This includes diodes, transistors, thyristors,
    and integrated circuits that are used for the
    rectification, amplification, switching, etc., of
    analog or digital circuits in either monolithic
    or hybrid form.)
  • Passive Component (Element) 30.1468
  • A discrete electronic device whose basic
    character does not change while it processes an
    applied signal. (This includes components such as
    resistors, capacitors, and inductors.)

25
Terms and Definitions
26
Terminology
  • Blank 41.1339
  • An unprocessed or partially processed piece of
    base material or metal- clad base material, that
    has been cut from a sheet or panel, that has the
    rough dimensions of a printed board. (See also
    Panel.)
  • Panel 41.1463
  • A rectangular sheet of base material or
    metal-clad material of predetermined size that is
    used for the processing of one or more printed
    boards and, when required, one or more test
    coupons. (See also Blank.)
  • Fabrication Panel
  • A rectangular sheet of base material or
    metal-clad material of predetermined size that is
    used by a printed board manufacturer for the
    processing of one or more printed boards and,
    when required, one or more test coupons. (See
    also Blank.)
  • Board 60.0118
  • see Printed Board, and Multilayer Printed
    Board.
  • Printed Board (PB) 60.1485
  • The general term for completely processed
    printed circuit and printed wiring
    configurations. (This includes single-sided,
    double-sided and multilayer boards with rigid,
    flexible, and rigid-flex base materials.)

27
Terminology
  • Multilayer Printed Board 60.1227
  • The general term for a printed board that
    consist of rigid or flexible insulation materials
    and three or more alternate printed wiring and/or
    printed circuit layers that have been bonded
    together and electrically interconnected.
  • Finished Board
  • see Printed Board
  • Finished Panel
  • A rectangular sheet of base material or
    metal-clad material of predetermined size that is
    used for the processing of one or more printed
    board designs and, when required, one or more
    test coupons which is extracted from the
    fabrication panel to deliver to the customer or
    to the next level of fabrication. (see Assembly
    Pallet)
  • Assembly 80.1327
  • A number of parts, subassemblies or combinations
    thereof joined together. (Note This term can be
    used in conjunction with other terms listed
    herein, e.g., Printed Board Assembly)
  • Printed Board Assembly 80.0911
  • The generic term for an assembly that uses a
    printed board for component mounting and
    interconnecting purposes.
  • Array 22.0049
  • A group of elements or circuits arranged in rows
    and columns on a base material.

28
Terminology
  • Printed Board Assembly Array
  • A group of assemblies, all of the same design,
    arranged in rows and columns on a panel.
  • Assembly Pallet
  • The generic term for the assembly that uses a
    finished panel, as delivered from the board
    fabricator, of the same or different designs, for
    element and circuit component mounting and
    attachment to the board interconnections layers.
    The board arrangement on the pallet may be random
    or in the form of an array the pallet may also
    include coupons for testing.

29
Hierarchy of IPC Design Standards(2220 Series)
IPC-2220
IPC-2221
GENERIC
IPC-2222
IPC-2223
IPC-2224
IPC-2225
IPC-2226
RIGID
FLEX
PCMCIA
MCM-L
HDI
30
Hierarchy of Printed Board Performance
Standards(6010 Series)
IPC-6010
IPC-6011
GENERIC
IPC-6012
IPC-6013
IPC-6014
IPC-6015
IPC-6016
RIGID
FLEX
PCMCIA
MCM-L
HDI
31
Applicable IPC Standards
  • -SM-782 Land Pattern Considerations
  • -7095 BGA Process Implementation
  • -2315 HDI Microvia Design Guide
  • -SM-785 SMT Reliability Testing
  • -D-279 Design for SMT Reliability
  • J-STD-001 Soldering Requirements
  • -A-610 Assembly Acceptability
  • -6010 Printed Board Series
  • J-STD-004/005 Solder Flux/Paste

32
Scope Example (land patterns)
  • This standard provides information on land
    pattern geometries used for surface attachment
    of electronic components.
  • The intent of the information presented is to
    provide the appropriate size, shape and tolerance
    of surface mount land patterns to insure
    sufficient area for the appropriate solder fillet
    or solder volume.
  • Also to allow for inspection, testing, and
    rework of those solder joints.

33
Scope (continued)
  • Land pattern geometry may be different based on
    the type of soldering used to attach the
    electronic part, however land patterns are
    defined in such a manner that they are
    transparent to the process.
  • Standard configurations are for manual designs
    for computer-aided design.
  • Parts are mounted on one or both sides,
    subjected to wave, reflow, or other type of
    soldering

34
Scope (continued)
  • Although patterns are dimensionally defined
    and since they are a part of the printed board
    circuitry geometry, they are subject to the
    producibility levels and tolerances associated
    with plating, etching, assembly or other
    conditions.
  • The producibility aspects also pertain to the
    use of solder mask and the registration required
    between the solder mask and the conductor
    patterns.

35
Performance Classes
  • Three performance classes have been
    established to reflect progressive increases in
    sophistication, functional performance
    requirements and testing/ inspection frequency.
  • There may be an overlap of equipment categories
    in different classes.
  • The user is responsible to specify, in the
    contract or purchase order, the product
    performance class.

36
Class 1 - General Electronic Products
  • Includes consumer products, some computer and
    computer peripherals suitable for applications
    where cosmetic imperfections are not important
    and the major requirement is function of the
    completed printed board.

37
Class 2 - Dedicated Service Electronic Products
  • Includes communications equipment, sophisticated
    business machines, instruments where high
    performance and extended life is required and for
    which uninterrupted service is desired but not
    critical. Certain cosmetic imperfections are
    allowed.

38
Class 3 - High Reliability Electronic Products
  • Includes the equipment and products where
    continued performance or performance on demand is
    critical. Equipment downtime cannot be tolerated
    and must function when required such as in life
    support items or flight control systems.
    Applications where high levels of assurance are
    required and service is essential.

39
Interpretation
  • Shall, the emphatic form of the verb, is used
    throughout this specification whenever a
    requirement is intended to express a provision
    that is binding. Deviation from a shall
    requirement may be considered if sufficient data
    is supplied to justify the exception.
  • The words should and may are used whenever it
    is necessary to express non-mandatory provisions.
  • Will is used to express a declaration of
    purpose. To assist the reader, the word shall
    is presented in bold characters.

40
Complexity Levels
  • Land pattern determination methods
  • Exact details based on component specifications,
    board manufacturing and component placement
    accuracy. The land patterns are restricted to a
    specific component, and have an identifying land
    pattern number
  • Equations used for new components or to alter the
    given information to achieve a more robust
    solder connection, when used in particular
    situations

41
Level A Maximum
  • For low-density product applications, the
    'maximum' land pattern condition have been
    developed to accommodate wave or flow solder of
    leadless chip devices and leaded gull- wing
    devices.
  • The geometry furnished for these devices, as
    well as inward and J-formed lead contact device
    families, may provide a wider process window for
    reflow solder processes as well.

42
Level B Median
  • Products with a moderate level of component
    density should consider adapting the 'median'
    land patterns.
  • The median land patterns furnished for all
    device families will provide a robust solder
    attachment condition for reflow solder processes.
  • The condition should suitable for wave or reflow
    soldering of leadless chip and leaded gull-wing
    type devices.

43
Level C Minimum
  • High component density typical of portable and
    hand-held product applications may consider the
    'minimum' land pattern geometry variation.
  • Selection of the minimum land pattern geometry
    may not be suitable for all product use
    categories.

44
Combination of Issues
  • Performance classes 1, 2, and 3 are combined
    with that of complexity and density levels A, B,
    and C in defining electronic assembly conditions.
  • As an example, combining the description as
    Levels 1A or 3B or 2C, would indicate the
    different combinations of performance and
    component density to understand fabrication and
    assembly requirements for manufacturing and end
    use environment.

45
Test Requirements
  • Prior to starting a design, a testability
    review meeting should be held with fabrication,
    assembly, and testing.
  • Testability concerns, such as circuit
    visibility, density, operation, circuit
    controllability, partitioning, and special test
    requirements and specifications are discussed as
    a part of the test strategy

46
Test Requirements
  • During the design testability review meeting,
    tooling concepts are established, and
    determinations are made as to the most effective
    tool cost versus board layout concept conditions.
  • During the layout process, any circuit board
    changes that impact the test program, or the test
    tooling, should be reported to determine the best
    compromise.

47
Board Test Requirements
  • The testing concept should develop approaches
    that can check the board for problems, and also
    detect fault locations wherever possible.
  • The test concept and requirements should
    economically facilitate the detection, isolation,
    and correction of faults of the design
    verification, manufacturing, and field support of
    the printed board assembly life cycle.

48
Assembly Testability
  • The printed board assembly testability
    philosophy also needs to be compatible with the
    overall integration, testing and maintenance
    plans. This includes
  • The factory testers to be used
  • How integration and test is planned
  • When conformal coated is applied
  • Depot field test equipment capability
  • Personnel skill level

49
Need for Automation
  • Standards needed for design and assembly
  • New concepts in Business process optimization for
    competitiveness
  • A need for lower operating costs in business and
    Information Transfer (IT).
  • Tight business alignment with IT is essential
  • Development of internal and external Service
    Oriented Architecture is needed in order to
    manage the new culture change.
  • Shorten product development cycles
  • Increase product flexibility
  • Solutions require continuous monitoring of
    industry progress infrastructure growth

50
IPC to IEC Deployment
  • IPC-SM-782 provided by US to IEC
  • Countries agree to standardize
  • Japan found that one land pattern is insufficient
    to design Sony Minicam assemblies
  • Discussions review principles of mathematical
    model tighten requirements
  • Three geometries proposed for future
  • IEC starts work on IEC-61188-5-1 thru -8
  • IPC supersedes SM-782A with IPC-7351
  • Computer model tested with PCB Libraries

51
IPC-7351 Land Pattern Variations
Density Level A Maximum (Most) Land Protrusion -
for low component density applications and
products exposed to high shock or vibration. The
solder pattern is the most robust and can be
easily reworked if necessary. Density Level B
Median (Nominal) Land Protrusion - for products
with a moderate level of component density and
providing a more robust solder attachment. Density
Level C Minimum (Least) Land Protrusion - for
miniature devices where the land pattern has the
least amount of solder pattern to achieve the
highest component packing density.
52
IPC-7351 Land Pattern Variations for Rectangular
Two Terminal Devices
Density Level A Very Robust Solder Joint
Density Level B General Purpose Solder Joint
Density Level C Minimal Solder Joint for High
Density Applications
53
IPC-7351 Land Pattern Variations for Flat Ribbon
L and Gull Wing Leads
Density Level A Very Robust Solder Joint
Density Level B General Purpose Solder Joint
Density Level C Minimal Solder Joint for High
Density Applications
54
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55
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56
Ribbon Leads greater than 0.625
57
Ribbon Leads less than 0.625
58
J LeadedParts
59
RectangularSquare endTerminations
60
Metal Electrical Face
61
Bottom Only Terminations
62
Leadless Chip Carriers
63
Inward L shapedLeads
64
Flat Lug Leads
65
Quad Flat No Lead
66
Small Outline No Lead
67
Design Considerations
  • Land pattern concepts
  • Component selection
  • Mounting substrate design
  • Assembly methods
  • Method of test
  • Phototool generation
  • Meeting solder joint requirements
  • Stencil fixture requirements
  • Providing access for inspection
  • Access for rework and repair

68
Manufacturing Allowance
  • Manufacturing allowance must be considered in
    the design process
  • The courtyard represents the starting point of
    the minimum area needed for the component and the
    land pattern
  • Manufacturing, assembly and testing
    representatives should assist in determining the
    additional room needed to accommodate placement,
    testing, modification and repair

69
IPC-7351 Land Pattern Courtyard Determination
70
IPC-7351 Land Pattern Naming Convention
  • The numbering convention used in IPC-SM-782A was
    very basic
  • Fixed number range assigned to a specific
    component family (prone to exhaustion)
  • No intelligence embedded within them
  • A new land pattern naming convention was
    designed for IPC-7351 to convey a number of
    attributes
  • Component family prefix
  • Component pin pitch
  • Component body dimensions
  • Component Pin Quantity
  • Land Pattern Geometry

71
IPC-7351 Land Pattern Naming Convention Example
  • Using an 0.80 mm pitch Quad Flat Package (QFP),
    the IPC-7351 Land Pattern Naming Convention is as
    follows
  • QFP80PLead Span L1 Nominal X Lead Span L2
    Nominal Pin Qty
  • where the (plus sign) stands for in addition
    to (no space between the prefix and the body
    size),
  • the X (capital letter X) is used instead of the
    word by to separate two numbers such as height
    X width,
  • the (dash) is used to separate the pin
    quantity,
  • and the suffix letters L, M and N signify
    when the land protrusion is at their minimum
    (least), maximum (most) or median (nominal)
    geometry variation.

72
IPC-7351 Land Pattern Naming Convention Example
(contd)
  • QFP80P1720 X 2320-80N
  • Therefore, the above land pattern name conveys
    the following information
  • The component family prefix of QFP
  • The component pin pitch of 0.80 mm
  • The component lead span nominal X 17.20 mm for
    1720
  • The component lead span nominal Y 23.20 mm for
    2320
  • The total component pin quantity of 80 pins
  • Density Level B (Nominal) land pattern geometry

73
IPC-7351 Zero Component Rotations
  • IPC-7351 provides zero component rotations that
    are defined in terms of the standard CAD
    component library with respect to a given PCB
    design
  • Acknowledges that a single land pattern may be
    used for the same component part from different
    suppliers, all of whom may provide different
    orientations for tape or reel
  • Eliminates scenarios where a PCB designer loses
    the ability to reference a single land pattern
    when the zero component rotation is according to
    the method the component is delivered to the
    assembly machine

74
IPC-7351 Zero Component Rotations
75
IPC-7351 Land Pattern Software Suite
76
Part Selection
77
Nominal Library Search
78
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79
Component Descriptions
80
Land Patterns
81
Land Patterns and Courtyards
82
Density Level B
Density Level A
Density Level C
83
Land Patterns and Courtyards
Density Level A
Density Level B
Density Level C
84
IPC-7351 Land Pattern Viewer
  • Shareware program included with IPC-7351 standard
    and available at www.ipc.org under PCB Tools and
    Caculators
  • Portability doesnt require a Web browser
  • Enhanced searching capabilities
  • 11 relationship for components/graphics
  • Easily updated through free download of .p
    library files and program revisions

85
Building on the Standards
  • IPC website and listservs will provide feedback
    point for new land pattern generation
  • Developing CAD interfaces
  • Incorporating the Concepts into OffSpring (the
    child of GenCAM and ODB) IPC-2581 (IEC 61182-2)
  • Beta testing to start end of 2005
  • Many CAD CAM companies committed

86
IPC-2581 Beta Testing
  • Data extraction from CAD
  • CAM step and repeat plus process tolerance
    inclusion
  • Design file review (Pad Stacks) versus layered
    data
  • Assembly information tied to CAD libraries
  • Provide updated viewer to industry
  • Provide Gerber to 2581 converter

87
Function Mode
88
Logistic Header
Indicates file owner as well as Approved Vendors
89
History Record
Configuration Management Section
90
Bill of Materials
One to many BOMs including one for Board Material
91
Approve Vendor List
One master list referenced to BOM item
enterprise
92
The Heart and Stamina
93
The Information Vessels
94
Step Description
Mandatory Requirements
The step functions define the details of the
electronic assembly. This includes the parts,
conductors, net list, and DFX analysis.
CAD
Library
The individual features
95
Home for Land Patterns
96
Detail Descriptions
LayerDesc includes BOARD BOARDPANEL ASSEMBLY
ASSEMBLYARRAY COUPON DOCUMENTATION TOOLING
MISCELLANEOUS
97
NIST Viewer
98
Gerber Conversion Evaluation
NIST Viewer
Original File
Next is conversion of Gerber Macros in read me
file
99
IPC-25XX Certification
  • Develop concept for matrix
  • Examine D-350 and GenCAM test plans
  • Keep it simple
  • Build on self declaration principles
  • Establish legal documents for details
  • Ask NIST software engineering for help with
    portal development
  • Examine using 3rd party consultants

100
Conclusions
  • The standard is Alive and Well
  • The cooperative efforts are winning
  • New parts require continuous monitoring
  • The IPC/PCB Libraries arrangement is a major
    benefit to the design community
  • The IPC list servers are a way to keep in touch
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