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CMEMS Fabricated in LTCC

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Raw materials delivered as a flexible sheet called 'Green Tape' LTCC Advantages. Process ... Ionization Tube Segment. Initial Conductor Ring. Drift Voltage ... – PowerPoint PPT presentation

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Title: CMEMS Fabricated in LTCC


1
C-MEMS Fabricated in LTCC
  • Presented By Don Plumlee

February 14, 2003
2
Overview
  • MEMS
  • Overview of LTCC
  • Materials
  • Typical Uses
  • LTCC Fabrication Process
  • Route Layer Patterns
  • Fill Vias/Screen Print
  • Laminate the Stack
  • Co-Fire
  • Inspect
  • Ion Mobility Spectrometer Design/Development
  • IMS Schematic
  • IMS Model and Segments
  • Future Goals

3
MicroElectroMechanical Systems (MEMS)
LabCD-DOS developed by Gamera Bioscience in
Boston http//www.biomems.net/ResearchDevelopment/
microfluidics.htm
Micro-machine fabricated by Sandia
Labs http//mems.sandia.gov/scripts/index.asp
4
Low Temperature Co-Fired Ceramics (LTCC)
  • LTCC is a Glass/Alumina mixture that sinters 900C Low Temperature
  • The Ceramic substrate and embedded elements are
    fired simultaneously Co-Fired
  • Material in the Green state is composed of
    Glass, Ceramic and Organic binder
  • Raw materials delivered as a flexible sheet
    called Green Tape

5
LTCC Advantages
  • Process
  • Parallel processing (High Yield/Quality)
  • Single sintering step for all materials (Co-fire)
  • Inexpensive
  • Quick Time to Market
  • Electrical
  • Integrated Passive Components (R, L, C)
  • High circuit density (3D Structure)
  • Dielectric Stability at wide range of
    frequencies.

6
More LTCC Advantages
  • Thermal
  • High ambient temperature resistance
  • Better thermal conductivity than PCBs
  • Close match to semiconductor Thermal Coefficient
    of Expansion.
  • Mechanical
  • Machineable (Drill, Cut, Punch) in Green State.
  • High Mechanical Strength w/ Multi-layer
    Structure.
  • Hermetically-sealed Package

7
LTCC Fabrication Process
From Thales Microsonics LTCC Design Guide
8
Typical LTCC Applications
  • Chip Packaging
  • Integrated Circuits
  • Antenna Arrays
  • Waveguides
  • Bluetooth Microwave Devices
  • C-MEMS

9
C-MEMS Fabrication Process
  • Rough Cut Blank Sheets
  • Route/Drill Layer Patterns
  • Fill Vias
  • Screen Print Conductors and Resistors
  • Laminate the Stack of Layers
  • Co-Fire the device
  • Inspect

10
1. Rough Cut Blanks
  • Each layer is rough cut from a roll of Green
    Tape.
  • Layers are cut into 100mm x 100mm squares.
  • Process performed using an EXACTO knife.

Cutting Layers
11
2. Route/Drill Layer Patterns
  • Registration Holes, Vias and Cavities are drilled
    in each layer using CNC Milling Machine
  • 3D Solid Models are created in Solid Works.
  • The routing pattern for each layer is extracted
    as a 2D file and converted to a milling pattern
    using GerbTool and ISOCAM software.

Bungard CNC Milling Machine
12
3. Fill Vias
  • Vias are filled with DuPont 6141 Conductor Paste.
  • Currently done manually using a plastic stencil
    and brush.

Via Filling
13
4. Print Conductors/Resistors
  • Circuits are printed on each layer with DuPont
    6145 Conductor Paste.
  • An AUTOROLL M25 screen printer is used to print
    the pattern.
  • Screens are developed by transferring the
    conductor pattern from the 3D model section using
    photo-imaging.
  • Screens are aligned to substrate visually using
    registration holes.

Screen Printing
14
5. Laminate the Stack
  • The sheets are collated and stacked in a
    Lamination Jig.
  • The stack is pressed for 10 minutes at 70C and
    3000psi.
  • A PHI SPWR220 press is used for lamination (40
    ton capacity).

Lamination Press
15
6. Co-Fire the Device
  • The laminated stack is Co-fired in a laboratory
    oven with a Eurotherm controller.
  • _at_ 350 C, binders burned off.
  • _at_ 850 C, sintering occurs

Furnace Profile
Laboratory Furnace
16
7. Inspect and Test
  • Samples are examined under an Olympus SZ40
    microscope for defects.
  • Functional Testing will be performed on each
    device as required.

17
C-MEMS Projects
  • Current
  • Capacitive Pressure Sensor
  • Ion Mobility Spectrometer (IMS)
  • Electro-Chemical Cell
  • Future
  • Micro-Combustor
  • Micro-Turbine
  • Micro-Fluidic Systems (Lab on a Credit Card)
  • P3 device in LTCC (Washington State Univ.)

18
EPA Sensor Project
  • Sponsored by the EPA
  • Collaboration between Civil, Electrical,
    Mechanical Engineering and Chemistry (BSU and
    WSU)
  • A sensor is inserted into the soil using a
    Direct-Push style ground penetrometer.
  • The sensor analyzes groundwater chemical
    concentrations periodically.
  • Data is broadcast and collected from an array of
    sensors in real-time.
  • Result Accurate Time/Space knowledge of chemical
    migration in groundwater

19
Sensor Requirements
  • Detect chemical concentrations in groundwater
  • Sensitivity
  • Accuracy
  • Operate in a down-hole environment for multiple
    years
  • Reliability
  • Chemical Resistivity
  • Small Diameter

20
IMS Schematic X-section
21
IMS Assembly Components
  • Aperture/Collector
  • Drift Tube
  • Tyndall Gate
  • Ionization Tube

Drift Gas Flow
Ion Flow
22
IMS Model Assembly
23
Aperture/Collector Segment
24
Drift Tube Segment
25
Tyndall Gate Segment
26
Ionization Tube Segment
27
Future Goals
  • IMS
  • Complete Fabrication of a device
  • Test IMS at WSU Analytical Laboratory
  • Optimize design
  • Finish Thesis
  • Optimize fabrication process with new techniques
  • Continue to pursue additional C-MEMS devices and
    applications using the LTCC process.
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