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LargeScale FullWave Simulation

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Problems with a-priori assumptions about current-return ... The Jester. RCF. Algorithm for creating regular meshes. Wire recognition algorithm was developed ... – PowerPoint PPT presentation

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Title: LargeScale FullWave Simulation


1
Large-Scale Full-Wave Simulation
  • Sharad Kapur and David Long
  • Integrand Software, Inc.

2
Areas
3
Current Inaccurate methods
  • In IC-world R,L,C and substrate extracted
    separately
  • Cobbled together
  • Can be inaccurate
  • Wire over high-resistivity substrate
  • Strong frequency dependence
  • Effective ground plane moves lower at high
    frequencies
  • Problems with a-priori assumptions about
    current-return paths for inductance
  • Real problem is fully coupled

4
EMX
  • Full-wave field solvers can be made practical
  • Replace patchwork of point tools
  • High accuracy for large RF chip-size problems
  • Handle all electromagnetic effects in a unified
    manner
  • Efficient and very accurate
  • GDSII -gt S-Params/Spice like representation

5
Fundamental problem
  • Efficiency
  • Structures are discretized into panels and
    unknowns to be solved for are things like
    charge/current
  • Accurate simulations are computationally
    expensive
  • Traditional full-wave EM simulation tools can
    take hours

6
Solving the linear system efficiently
  • Conventional methods O(N3) time
  • In 80s-90s slew of techniques for solving these
    systems
  • Iterative methods reduce time to O(N2)
  • Fast Matrix-Vector methods O(N)
  • Fast Multipole Methods, SVD methods, P-FFT
    methods
  • Fundamentally changed computational
    electromagnetics
  • Reached point of diminishing returns

7
IC specific fast solutions
  • Nebula capacitance using FMM (DAC 2000)
  • had sufficient speed to do the electrostatic
    (capacitance) problem for block sized problems
  • Homogenization of far-away geometry
  • Cannot be applied to full-wave problem
  • IES3 full-wave solution using SVDs (ICCAD 96)
  • with a completely new direction of attack
  • Several new ideas in EMX implementation
  • Will talk about two of them

8
Idea 1 Layout is regular
  • Wires are paths of constant width
  • Distance between adjacent routing is constant
  • Routing is at 45 or 90 degrees
  • Components, spiral inductors, capacitors, are
    symmetric
  • Normal notion of regularity, repeated instances
    of subcircuits
  • Layout space is actually a very small subset of
    all possible routing
  • Can you take advantage of this?

9
Conventional approach
  • In all previous approaches, mesh generation and
    field solution viewed as orthogonal sub problems
  • Mesh generation
  • Typically unstructured Delauny triangulation
  • Field solution
  • Uses a fast solver method
  • Independent of the underlying mesh
  • Cannot take advantage of layout regularity

10
  • Unstructured Delauny mesh
  • Pairs of interactions are dissimilar, because of
    the shapes and the distances between the
    triangles

11
  • Layout has a lot of structure
  • This structure can be imposed on the mesh
  • Identical interactions are repeated all over
  • Few unstructured left over regions are a small
    part of the mesh

12
Routing of a 16 bit bus line from a 10GHz chip
13
Quadrature CMOS VCO (Gierkink, Frye, courtesy
Agere)
14
(No Transcript)
15
Algorithm for creating regular meshes
  • Wire recognition algorithmwas developed
  • Sweep through the layout identifying wires
  • Grey regions areidentified wires
  • Once the wires are identified
  • A mesh is created from a small set of canonical
    shapes

The Jester RCF
16
Algorithm for creating regular meshes
  • Wire recognition algorithm was developed
  • Sweep through the layout identifying wires
  • Grey regions areidentified wires
  • Once the wires are identified
  • A mesh is created froma small set of canonical
    shapes

17
Algorithm for creating regular meshes
  • Wire recognition algorithm was developed
  • Sweep through the layout identifying wires
  • Grey regions areidentified wires
  • Once the wires are identified
  • A mesh is created froma small set of canonical
    shapes

18
Exploiting the regularity
  • Embedded in the FMM
  • Direct interactions represented by sparse matrix
  • Lot of structure in the sparse matrix with
    identical entries
  • Substantially more compact representation
  • Reduction in time for matrix construction
    (integral time)
  • Reduction in storage

19
Idea 2 Approximating the vector formulation
  • Vector potential term isdominant cost
  • With RWG basis functions
  • 3 roof tops for each triangle
  • 4 roof tops for each rectangle
  • Between two shapes need to compute 9-16
    interactions
  • 1 for scalar interaction

20
Approximating the Vector potential
  • To avoid ill-conditioning basis functions are
    decomposed into curl free and divergence free
    bases (loops and patches)
  • Current flow through a triangle due to loop is a
    constant!
  • Can be exactly represented by a scalar integral
    over source
  • Approximation for other vector contributions

21
Approximating the vector potential
  • In the limit of fine mesh approximation is exact
  • Intuition The current flow smoothly varies
    across shapes and very small amount of charge is
    deposited as current leaves a shape
  • Approximation is valid for practical problems and
    frequencies

22
Examples
23
10s
35s
360s
24
Comparsion to IES3
20x-40x saving in memory 20x-30x saving in
time Better accuracy than IES3
25
  • PBP001 blue
  • PBP002 black
  • Sim - red
  • Inductance
  • Q
  • Resistance
  • Impedance

L15
26
Integrated Filter Design
  • Integrated filter design
  • Courtesy of STATS
  • Circuit is a band pass filter with R,L,C and
    interconnect
  • MIM caps

27
Integrated Filter Design
  • Comparison of EMX simulation to measurement
  • Structure designed and measured by Bob Frye

28
Conclusion
  • Developed a new full-wave simulation tool
  • Takes advantage of layout regularity
  • New formulation for vector potential
  • 50x faster than previous approaches
  • Used for model generation and RF block level
    simulation, packaging, etc.
  • Potential application in many other areas
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