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News from CMS Process Quality Control

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new aluminium thickness (marginal) lower value on the C_ac. jump in the ... Thicker Aluminium. 39 Teststructures from PQC Florence. Perugia 12 (prod.week 34/02) ... – PowerPoint PPT presentation

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Title: News from CMS Process Quality Control


1
News from CMS Process Quality Control
  • Thomas Bergauer
  • HEPHY Vienna

CMS TK Week, 29.1.2003, CERN
2
Centers
  • Three Process Qualification Centers

Florence Anna Macchiolo Carlo Civinini Mirko
Brianzi
Strasbourg Jean-Charles Fontaine Jean-Marie
Helleboid Jean-Laurent Agram
Vienna Thomas Bergauer Margit Oberegger
Characterization by QTC
Process stability on test structures with 9
different measurements
3
Setup Configuration
Keithely 7002
Probestation
Switching box (4 multiplexers 10 x 1 1
switch. Matrix 4 x 5
49 probes 32 ch
Computer (Labview)
4
Overview
  • CVMOS at different temperatures
  • new aluminium thickness
  • (marginal) lower value on the C_ac
  • jump in the rho_alu value
  • Mask Problem W7b
  • Inter-calibration
  • DB interaction

5
CVmos at different temperatures
  • Just a test (Vienna coolingbox was available)
  • CVmos at 5 different temperatures
  • CVmos chosen because it is the simplest
    measurement
  • No temperature dependence of Vfb

6
Thicker Aluminium
  • 39 Teststructures from PQC Florence
  • Perugia 12 (prod.week 34/02)
  • Perugia 13 (03/02)
  • Perugia 14 (06/02 and 23/02)
  • Pisa 59 (08/02)
  • Pisa 60 (24/02)

Influence to rho_Alu
Before week 20/02
after
  • Average data
  • before Week 20/02
  • 26,09mOhms/sq.
  • After week 20/02
  • 14,34mOhms/sq.
  • Also slightly lower C_ac value
  • 17,01pF (before week 20/02) -gt
  • 16,65pF (after)

7
Mask Problem W7B
  • Misalignment of 3 structures at the standard half
    moon
  • Not able to contact with probecard in one cycle
  • W7B 1440 pcs.

Cac R (Al, p, poly) Ivgcd Cint
IVbaby Rint CVdiode CVMOS IV diel
8
Mask Problem W7B
  • 3 structures on the standard half moon affected
  • Sensor mask is OK
  • Options
  • new probecard design OR
  • new wafer mask design

GCD
C_int
9
Inter-calibration
  • Circulation of 5 Teststructures
  • Vienna -gt Strasbourg
  • Strasbourg -gt Florence
  • Florence -gt Vienna

-gt Florence -gt Vienna -gt Strasbourg (Exchange of
TS during this Tracker Week)
  • Results (up to now)
  • Good agreement in all measurements
  • Higher Leakage current of Vienna Probecard
    causes lower R_int and higher IV_dielectric and
    GCD problems (fit)
  • small differences in capacitances values caused
    by stray capacitances. (lt1pF)

10
Software
  • New Software allows re-read of local files
  • Up to now Stand-alone program
  • Re-analyze
  • Re-write XML file

Acquisition
Analysis
DB Interface
Main
Local files
Analysis
DB Interface
new
  • Future
  • Fully integrated into acquisition software

Acquisition
Analysis
DB Interface
Local files
11
Database
  • 322 teststructures successfully loaded into db
  • 61 faulty
  • (status 28.1.03)
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