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Sliding Mechanism in Copper Grain
Boudaries Effect of vacancy
Peter Ballo
Department of Physics Faculty of Electrical
Engineering and Information Technology Slovak
University of Technology, Ilkovicova 3,812 19
Bratislava Slovak Republic e-mail
ballo_at_elf.stuba.sk
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GB
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Relaxed geometry of the 160-atom supercell
for the S5 tilt grain boundary in copper
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Evolution of the atomic structure of the pure
grain boundary during the sliding
process using SA simulation.
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The variation of the relative grain boundary
energy during sliding as a function of the
sliding distance
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Vacancy formation energy as a function of the
layer number from the interface.
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Relaxed geometry of the 160-atom supercell
for the S5 tilt grain boundary in copper
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Charge density distribution for GB in aluminum
(a) and copper (b) computed by LDA approximation
right panel The left panel shows the grain
boundary atomic structure.
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Thats all folks