Prezentace aplikace PowerPoint

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Proposal for a New COST Action
Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain (HISOLD) OC-2006-
1-0599
Proposer Ales Kroupa, Institute of Physics of
Materials, Academy of Sciences of the Czech
Republic, Zizkova 22, 616 62 Brno, Czech
Republic,
Domain Committee Materials, Physical and
Nanoscience
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
OUTLINE
? what ?
? why ?
? how ?
? who ?
? and the benefits ?
Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? what ?

• Solders with Tm ? 230?C used in the electronics
  industry for the advanced packaging technologies

Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? what ?

• power circuits - very high levels of conductivity
  required

• automotive industry under bonnet applications -
  high current and low voltage, high temperatures
  within the engine area

• step soldering approach ? soldering of various
  levels of the package with different solders of
  different melting points,
• the upper limit - around 350C (the polymer
  materials used in the substrate).

• ! New Pb-free high temperature solders should
  replace the current alloys for a broad range of
  melting temperatures
• ! Reliability !

Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? why ?

• high-Pb containing alloys, where the lead levels
  can be in the region above 85 by weight
• Lead is toxic !
• no drop-in alternative in the field of
  lead-free materials
• Exempt from the new RoHS legislation
• further pressure to exclude dangerous materials
• New program envisages further EU legislation in
  this area
• preparation by the scientific and industrial
  community is important (FP6-ELFNET project)
• Wide attention given to this topic in Japan and
  USA (and in China)
• Major research programme addressing the issue of
  high-temperature Pb-free soldering has been
  initiated in Japan in 2006 by main Japanese car
  manufactures.

Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? how ?

• Truly multidisciplinary and multiscale approach
• On a meso-scale
• The establishment of materials property databases
  for Pb-free alloy systems suitable for
  high-temperature solder applications. The aim is
  to compile a set of databases (e.g. through
  application of thermodynamics and kinetics
  studies) containing compilations of information
  on
• phase diagrams, thermodynamic properties,
• materials properties (structural, physical,
  electrical, mechanical )
• process related properties of the solder and
  joint materials.

Database of thermodynamic properties prediction
of phase diagrams, liquidus projection,
Currently existing databases
COST 531 database 11 elements, consistent,
regularly updated
ADAMIS database (Japan) 8 elements, development
continues for high-temp. application
NIST database (USA) Development currently
discontinued
Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? how ?
Truly multidisciplinary and multilevel approach

• On a macro-scale
• The creation of a phenomenological description
  and models for the prediction of corrosion
  behaviour, deformation processes, failure modes
  etc. occurring in the soldered structure during
  fabrication and service at high temperatures.
• Development of processing-structure-property
  relations, an understanding of thermo-mechanical
  fatigue, scale and constraining effects of the
  thermo-mechanical response, the durability of
  interfaces and intermetallics and to identify
  optimum process conditions.

• On a micro- (nano-) scale
• Reactive phase formation study.
• Formation of intermetallic compounds at
  solder/substrate interfaces
• The development of texture of the reaction
  products in concentration gradients and the
  development of defect structures in the vicinity
  of the reaction interface.
• the study of the role of competitive nucleation
  and growth of intermediate phases on the
  interface of solder/substrate system.

Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? how ?
Lead free high-temperature solders Ag-Bi-,
Zn-Sn-, Zn-Al-(Mg,Ge,Ga,Bi,Sn), Sb-Sn-
Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? who ?

• European researchers from universities, research
  institutions, and industrial research centres
• About 50 scientists from the 17 countries
  expressed their interest to participate in the
  Action
• Austria, Belgium, Bulgaria, Czech Republic,
  Finland, France, Germany, Italy, Poland,
  Portugal, Serbia, Slovakia, Slovenia, Sweden,
  Switzerland, The Netherlands, United Kingdom.
  e.g. Prof.
  Jean Claude Gachon, Prof. J.C. Tedenac, France
  Prof. Dr. Bernd Michel, Prof. H.-J. Seifert,
  Prof. Dr. Jürgen Villain, Germany Prof.
  Gabriella Borzone, Prof. Riccardo Ferro, Italy
  Prof. B. Sundman, Sweden Prof. Herbert Ipser,
  Prof. Adolf Mikula, Austria Prof. John Botsis,
  Dr. Jolanta Janczak-Rusch, Switzerland Dr.
  Natalia Sobczak, Poland Dr. Alan Dinsdale,
  United Kingdom
• Young researchers will be involved practically in
  all main activities.
• This will be accomplished by Short-Term
  Scientific Mission,
• Summer and /or Winter schools on specific
  subjects.
• Network of selected workplaces, suitable for
  training young scientists (e.g. for
  modelling of phase diagrams, experimental
  measurements of selected materials properties
  etc.)
• The proposed Action reflects a wide European
  dimension, including partners from non-EU
  (Ukraine) and certainly aims at being gender
  balance. In the present Consortium almost 25 of
  the experts are women!

Institute of Physics of Materials, AS CR, Brno,
Czech Republic
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Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
? and the benefits ?

• At the end of the COST Action, a wide set of data
  will be available for different solder alloys.
• Number of environmentally friendly lead-free
  solder systems for high-temperature applications
  that exhibit properties suitable for industrial
  use and which can be taken into further
  consideration as replacements for the existing
  high-lead solders.
• The present Action will also provide the
  opportunity for Academic Institutions to
  coordinate their research efforts on a European
  level with industry - SME and large companies are
  involved either directly (Cookson Electronic,
  Next Experience B.V., Mat-Tech, B.V.) or through
  cooperating partners (PHILIPS, etc.)
• It will contribute to the strong position of the
  Universities and Research Institutions involved
  in the field of materials science. This will make
  these academic institutions more attractive for
  industrial (commercial) partners oriented towards
  sustainable technologies and maintain the
  education standard of European students at a high
  level

Institute of Physics of Materials, AS CR, Brno,
Czech Republic
11
Advanced Solder Materials for High Temperature
Application their nature, design, process and
control in a multiscale domain - HISOLD
OC-2006-1-0599
Thank you for your attention !