IPC DESIGNERS COUNCIL

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IPCDESIGNERS COUNCIL
How can we help you and your local Chapter be
successful?
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Agenda

• IPC History Overview
• Designers Council History
• Designer Training and Certification
• Chapter Activities
• Summit, Symposiums and Conferences
• Future Plans

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IPC HISTORY

• 1957 - FOUNDED BY SIX INDEPENDENT
• BOARD FABRICATORS
• 1958 - USERS/SUPPLIERS MADE MEMBERS
• 1966 - MEMBERSHIP OFFERED TO
• COMPANIES OUTSIDE THE AMERICAS
• 1977 - IPC NAME CHANGED TO REFLECT
• ELECTRONIC PACKAGING AND
• PROGRAMMING
• 1986 - COOPERATIVE LIAISON WITH ANSI
• 1988 - COMMITTEE RESTRUCTURING
• 1991 - IPC DESIGNERS COUNCIL FOUNDED

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IPC Present Status

• REGULAR MEMBERS
• TECHNICAL LIAISON MEMBERS
• GOVERNMENT MEMBERS
• TOTAL IPC Members 2,500
• TOTAL Designers Council Members 956

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Beginning of Designers Council

• Proposed and validated during
• IPC-D-275 workshops in 1991
• Over 900 individuals exposed to ideas during 14
  workshops
• Part of IPCs Long Range Mission statement - 1990
• Formation meeting held in Atlanta - January, 1992

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Designers Council Structure
IPC BOD
DESIGNERS COUNCIL EDUCATION COMMITTEE
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DESIGNERS COUNCIL CHARTER SCOPE

• TO ENCOURAGE, FACILITATE, COORDINATE AND
  PROMOTE THE ORDERLY INTERCHANGE AND INTEGRATION
  OF DESIGN CONCEPTS CONCERNING PRINTED BOARD,
  PRINTED BOARD ASSEMBLY, AND RELATED TECHNOLOGIES
  THROUGH COMMUNICATION, SEMINARS, WORKSHOPS,
  LOCAL, NATIONAL AND INTERNATIONAL CHAPTER
  PROGRAMMING AND OTHER MEANS.

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OBJECTIVES

• PROMOTE AND DISSEMINATE INFORMATION REGARDING
  CURRENT ACTIVITIES AND NEW DEVELOPMENTS IN DESIGN
  TECHNOLOGY.
• ENCOURAGE AND DEVELOP COORDINATED INPUT AND
  RESPONSE TO EXISTING AND PROPOSED DESIGN-RELATED
  STANDARDS AND PUBLICATIONS.

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OBJECTIVES - CONTD

• ACHIEVE MAXIMUM INDUSTRY AWARENESS OF DESIGN
  STANDARDIZATION ISSUES IN PRINTED BOARD, PRINTED
  BOARD ASSEMBLY AND RELATED DESIGN TECHNOLOGIES.
• ENCOURAGE AND COORDINATE THE COMPILATION OF
  DESIGN INFORMATION INCLUDING EQUIPMENT, EQUIPMENT
  CAPABILITY (TOOLS AND TECHNOLOGIES) AND RELATED
  INFORMATION.

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OBJECTIVES - CONTD

• INCREASE INDUSTRY AWARENESS OF THE ROLE THAT THE
  PRINTED BOARD DESIGNERS PLAY IN THE PRODUCT
  DEVELOPMENT CYCLE.
• ESTABLISH A FORMAL EDUCATION STRUCTURE AND
  CERTIFICATION PROGRAM TO ENSURE DESIGNER
  COMPETENCY AND CONSISTENT DESIGN STANDARDS.

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OBJECTIVES - CONTD

• STIMULATE COMMUNICATION AMONG AND BETWEEN PRINTED
  CIRCUIT BOARD DESIGNERS AND OTHERS IN RELATED
  ENGINEERING DISCIPLINES.

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Designers Council Networking

• Local Programming Chapter Based
• National Conferences Summit and the Designer
  Learning Symposiums
• Designer Education Programs
• IPC Standards and Services
• Designer Email Forum Interchange

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Internal Support Functions

• Database Management
• Invoicing
• Website
• Conferences and Symposiums
• Designer Education Development and Implementation
• Web Forum Monitoring
• Membership Promotion

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IPC Designers Council Training and Certification

• A program that uses industry design standards to
  develop a training syllabus that informs
  designers on the manufacturing issues of Printed
  Boards and electronic assemblies. (DFM and DFA).

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Program Development

• Developed by the IPC Designers Council
  Educational Committee
• Achieve maximum awareness of the DFM and DFA
  issues
• Encourage the coordination of design
  standardization issues
• Increase designer profile elevation process
• Stimulate communication between and among
  designers
• Initiate a set of training modules to cover basic
  and focused subjects
• Core Module, Advanced Module, Hi-Speed, HDI, etc.
• Training materials - Study Guide, Industry
  Standards, CD-ROM
• Certification requires passing exam (104 multiple
  choice questions)

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Program Status

• Two day training review followed by the two hour
  exam.
• Almost 3000 Designers have been certified (CID)
• Over 500 Designers have achieved their CID
• Trainings centers located in the US, Europe,
  (Scotland Netherlands, Germany) and Australia
  (Melbourne, Sydney)
• Over ten officially approved trainers
• Data base continuously evaluates scores and
  answers
• Focus modules being developed for 2007

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The Designers Certification Program has been
devised and produced by the Education Committee
of the IPC Designers Council.
Its purpose is to give designers, and other PCB
professionals, the opportunity to gain a world
wide recognised qualification based on good
practice that is required to design, manufacture
and test PCBs.
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Description format Based on the leading IPC
standards for PCB design, IPC Designer
Certification reinforces the knowledge gained by
professionals over their many years of experience
and good working practices. Designers purchase
the Designer Certification Kit that includes
self-study materials and enrolment in a two-day
IPC Designer Certification Preparation workshop.
All Designer Certification testing is done at the
workshop location shortly after it concludes.
Individuals who do not feel prepared to take the
test immediately after the training may choose to
keep their exam voucher and take the test at a
later date. The workshop training provides an
in-depth view of the principles contained in the
examination and is strongly recommended for
anyone interested in obtaining the certification.
Study Guide contents - click here ----
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Status of Training Modules

• Basic Module
• Live in 1999, minor changes 2005
• Advanced One Module
• Live in 2002, minor changes 2005
• High Speed, High Frequency
• Objectives complete, live in 2005
• Electro Magnetic Interference (EMI)
• Objectives complete, live in 2005

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Electronic Module Objectives
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Module Concept Comparison

• Original Segmentation
• Layout
• Electrical
• Materials
• Components
• Assembly Requirements
• Board Fabrication
• Board Physical
• Documentation
• Inspection/Testing
• Reliability

• Proposed Segmentation
• Basics of (HiSp)/(EMI)
• Electrical Requirements
• Board characteristics
• Layout Principles
• Components and Assy
• Performance Parameters
• Analysis and Verification
• Documentation

To layout Principles
Included where needed
To Board
To Performance and Analysis
Proposed Segmentation is in order of lectures
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EMI Design Module Training

• DAY 1 (DAY AND DATE)
• 800 AM REGISTRATION AND PRESESSION COFFEE
  BREAK
• 830 AM INTRODUCTION TO DESIGNER CERTIFICATION
• BASICS OF EMI
• 1.1 EMI-Definition Requirements
• EMI-Sources Spectra
• Interference Paths Effects
• Product Requirements Emission
  Susceptibility
• Overview Tests Limiting Values
• 1.2 RF/EMI- Currents
• Common- Differential Mode
• Formation of Common Mode Currents
• Detection/Measurement of CM Currents
• Samples of CM Currents on PCB Cables
• 1.3 Wave shape and Frequency ( HS-Module)
• Sine Wave Description
• Digital Pulses and Harmonics

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EMI Design Module Training

• ELECTRICAL REQUIREMENTS
• 2.1 Basic Radiation Sources in Electronic
  Systems
• Magnetic Dipole - Samples Calculations
• Electric Dipole - Samples Calculations
• Resonances on PCB
• Dipole as Receiver Antenna
• Frequency Radiation Spectrum of Digital
  Signals
• 2.2 Coupling Mechanism between Circuits
  (gt Franzis-EMV)
• Description of TEM-Lines
• Capacitive Coupling - Counter Measures
• Galvanic-Inductive Coupling - Counter Measures
  (gt FED 8.2.6.1)
• Wave Coupling - Counter Measures
• 2.3 Power System Design and Decoupling
  (FED- 3.9.1.0 and 3.9.1.2)
• Capacitor Selection and Decoupling (gt FED
  6.2.2.1) (also 5.1) Transient Suppression
• Use of Planes
• Embedded Capacitance
• 2.4 RF- versus DC-Ground (see also 3.2)
• Return Path Variation

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EMI Design Module Training

• BOARD CHARACTERISTICS
• 3.1 Printed Circuit Boards in Principle (gt
  Martin O'Hara "PCBSTD.doc" )
• PCB Terminology
• Construction of a PCB
• PCB Design Parameters
• Multilayer Build (gt Martin O'Hara
  "PCBHS.doc" Chap. 7.2 7.2.1)
• 3.2 PCB Layout for EMC Segmentation (gt Martin
  O'Hara "PCBSTD.doc" )
• Decouple Local Supplies and IC's
• Grounding Techniques
• Order of Layout
• Other Tracking Issues
• 3.3 Double-Sided Boards vs. Multilayer (to
  be checked against 2.3)
• Power/GND supply (FED 8.2.3.2 3.9.2 ?)
• Signal Return-Path
• EMI by Reflection and Crosstalk
• Controlled Impedance Effects (reflection
  control)
• 3.4 Impedance Controlled Boards (see
  HS-Module 3.2 shortened)
• Impedance Definition

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EMI Design Module Training

• LAYOUT PRINCIPLES
• 4.1 Single- and Double-sided Boards (gt
  Franzis' Book Chap.4/ FED 8.1.5 8.1.6.1)
• Disturbance Currents and Paths
• Layout of Signal- and Power nets
• C-Blocking/Decoupling
• Radiation from Power Signal nets
• Grounding to Periphery
• 4.2 EMI Avoidance Strategy with Multilayer
• I/O Segmentation Circuit Isolation
• GND Plane Shielding
• Layout Priority Order
• Inductance Issues
• 4.3 IC and Passive Placement/ Circuit
  Segmentation
• Connector and Filter Placement
• Analog vs. Digital Layout
• High/Low Speed Zones
• Circuit Group Shields/Circuit Balance
• 4.4 Contacting of Filters Ferrites
  (Periphery)

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EMI Design Module Training

• DAY 2 (DAY AND DATE)
• 800 AM PRESESSION COFFEE BREAK
• 830 AM RECAP OF FIRST DAY
• COMPONENTS AND ASSEMBLY
• 5.1 Passive Components ( gt Martin O'Hara
  "Passives.doc")
• Packaging
• Resistors
• Capacitors
• Inductors
• Transformers
• 5.2 Active Components ( gt Martin O'Hara
  "ICs.doc")
• Logic Families Principles
• Packaging Influence (BGA Layout Concepts?)
• Digital Devices
• Analog Devices
• 5.3 Connectors Cabling
• Pin Assignment
• EMI-Connectors

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EMI Design Module Training

• PERFORMANCE PARAMETERS
• 6.1 Drive Voltage Characteristics (proposal
  2E1 DC-Group)
• Voltage Differences
• Capacitive Charge Effects
• Power Distribution
• Decoupling Character
• 6.2 System vs. Board Ground (proposal 2E5
  DC-Group)
• Difference Explanation
• Grounding Principles
• Shield Effects
• Improvement Methods
• 6.3 Transient Suppression
• ESD
• EFT/Burst
• Surge/Lightning
• Voltage Surges/Drops
• 6.4 Costs, Availability, Lead time
• Multilayer vs. 2 sided Boards

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EMI Design Module Training

• ANALYSIS AND VERIFICATION
• 7.1 EMI Evaluation with SW-Tools (i.e. Expert
  System)
• Screen Room Characterization
• Transmission Signal Saturation
• Power Supplements for Leakage Testing
• Interpretation Consequences
• 7.2 EMI Demands/Requirements - Tests (gt
  Rainer)
• EMI/EMC - Standards
• Test Structure Emission Susceptibility
• Émission Tests (i.e. EN 55011 etc.)
• Susceptibility Tests (IEC 1000-4-x)
• 7.3 EMI-Measurements (gt Rainer)
• Test Equipment (Overview)
• Emission Test Setups
• Susceptibility Test Setups
• Conformity Declaration
• 7.4 Assembly Analysis Verification (
  HS-Module)
• Arrangement of Components Influence

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EMI Design Module Training

• DOCUMENTATION
• 8.1 General Documentation Practices
• Fabrication Master Specification Techniques
• Assembly Shielding Definition Requirements
• Grounding Description and Verification
• EMC Approvals and Labeling
• 8.2 EMI Restricting Materials Tolerances
• Description of Material Properties
• Specification and Source Control Drawings
• Application Sequence Parameters
• Preparation and Test Method Specifications
• 8.3 Multilayer EMI / EMC Construction
• Definition of Plane Location
• Describing Purpose of Hole Guard Bands
• Random Conductor Flooding Parameters
• Specific EMI Prevention Stack-up Description
• 8.4 Board Topology Issues
• Component Assembly Shielding Requirements

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Psychometric Analysis

• Topic Percent Beta X Y X Y
  Finals
• Sections QA? QA Need
  Unique/Dupe
• Basics 10 30 (20/10) 8/4 20
• Electrical 15 45 (30/15) 12/6
  30
• Boards 10 30 (20/10) 8/4 20
• Layout 15 45 (30/15) 12/6 30
  
• Assembly 10 30 (20/10) 8/4 20
• Perform. 15 45 (30/15) 12/6 30
• Analysis 15 45 (30/15)
  12/6 30
• Docum. 10 30 (20/10) 8/4 20
• Totals 100 300(200/100) (80/40)
  200

160 40 200
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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Beta and Live Q A Segmentation
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New Structure Status Summary

• Thirty two objectives
• Two forms of tests X and Y
• Three hundred questions in the Beta
• Two hundred questions needed for exams
• X form 80 unique questions 40 identical
• Y form 80 unique questions 40 identical
• Applicants need to be CID minimum
• Can add initials to status on Business Card
• CID/H, CID/E, or CID/HE
• CID/H, CID/E or CID/HE

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CERTIFICATION TESTING

• IPC ADMINISTERED
• - IN CONJUNCTION WITH TWO-DAY
• PREPARATION WORKSHOP
• - WORKSHOPS SCHEDULED IN ADVANCE
• IMMEDIATE FEEDBACK
• - SCORED AT TEST SITE
• - AREA SPECIFIC DISCUSSION
• - PASS/FAIL RESULTS
• - CATEGORY ANALYSIS REPORT

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Education Committee

• Volunteer Group
• - Independent Designers
• - Board Manufacturers
• - OEM Representatives
• - Consultants
• - Representatives from Education Community

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TRAINING CENTERS

• PREMIER - UK
• SCOTTISH ADVANCED MANUFACTURING CENTRE (SAMC)
• COLLIN COUNTY COMMUNITY COLLEGE
• FERRARI TECHNICAL SERVICES
• EPTAC
• PALOMAR COLLEGE
• PIEK NETHERLANDS
• ATTEC AUSTRALIA
• SMCBA AUSTRALIA
• SKAANNING QUALITY AND CERTIFICATION
• FED GERMANY

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Chapter Activity

• Effective Leadership
• Interesting meetings
• Establish a Program Committee
• Have a way for Local Networking
• Invite Popular Speakers
• Workshop Study Groups
• Fund Raising Events

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Chapter Structure and Planning

• Talk to past Officers/Presidents
• Pull a Chapter together
• Keep focused
• Create the bylaws
• Keep action oriented
• Anticipate some friction
• Involve the group

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Constructive Planning

• Goals and strategies
• Dont do it alone
• Make the most out of meetings
• Expect long-term effort
• Money is important

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Introduction to Fundraising

• Think outside the work place
• Use the communities around you.
• Choose the right fundraisers
• Make the basic decisions
• Plan the event
• Provide the extras
• Promote effectively

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Fundraising Ideas
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LOCAL CHAPTERS

• ATLANTA
• AUSTIN HEART OF TEXAS
• CASCADE (WA)
• CHESAPEAKE
• COLORADO
• GATEWAY (MO)
• GREATER BOSTON
• GREATER OHIO
• GREATER PHOENIX
• HOUSTON
• LONG ISLAND, NY
• LOS ANGELES, CA
• MIDWEST (MINNEAPOLIS, MN)

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LOCAL CHAPTERS - CONTD

• NORTH TEXAS (DALLAS)
• NORTHEAST OHIO
• NORTHERN ILLINOIS
• ORANGE COUNTY (CA)
• PACIFIC NORTHWEST (OR)
• RESEARCH TRIANGLE PARK (NC)
• SAN DIEGO
• SILICON VALLEY (CA)
• SMOKY MOUNTAIN (TN)
• SOUTHEAST MICHIGAN
• SOUTHERN NEW ENGLAND (CT)
• SPACE COAST (FL)
• SUSQUEHANNA (NY)

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INTERNATIONAL CHAPTERS

• AUSTRALIA
• GERMANY (FED)
• CANADA
• - MONTREAL
• - OTTAWA
• - TORONTO
• UNITED KINGDOM
• IRELAND (in process)
• INDIA (IPCA)

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DOMESTIC UNIVERSITY PARTNERS

• PALOMAR COMMUNITY COLLEGE
• COLLIN COUNTY COMMUNITY COLLEGE
• LAKE WASHINGTON TECHNICAL COLLEGE
• NORTH SEATTLE COMMUNITY COLLEGE

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Participation in Standards

• Assign a chapter guru to the design tool kit.
• Highlight chapter member interests
• Incorporate a library function at meetings
• Do book (Standard) reports
• Make each event a value add

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SUMMIT, SYMPOSIUMS AND CONFERENCES

• Designers Summit February 17-22, 2007 in Los
  Angeles, CA
• Designers Day
• Designers Certification
• Education
• Networking
• Exhibition
• Designer Learning Symposiums
• Regional, Throughout the Year
• Education
• Certification
• Networking

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Path Forward for IPC Designers Council Chapters

• Monthly Local Chapter
• Networking
• Quarterly Teleconferences

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Designers Council Future Activities in 2007

• Designers Summit February 17-22
• Designers Day Monday, February 19
• Certification Workshops Sunday, Feb. 18 and
  Thursday, Feb. 22
• Technical Conference Tuesday, Feb. 20
• Face to Face Designer Council Leadership
  Breakfast Tuesday, Feb. 20
• Standards Development Meetings
• Free Forums
• Exhibitions
• Its Your Party featuring The Designers Den
  Wednesday, Feb. 21

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Designers Council Future Activities in 2007

• Designers Day February 19th
• Learn the latest in high speed design, the lead
  free initiative, EMI and much more.
• Hear from experts about ways to prepare for the
  future.
• Get the latest news on upcoming IPC Designers
  Council programs and plans.
• Network with your peers.
• Attend the Designers Day Dinner.

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Designers Council Future Activities in 2007

• Designers Learning Symposiums
• May 22 Bannockburn, IL
• August 15 Toronto, Canada
• More to be announced
• Release of Focus Modules for the Designer
  Certification Program
• High Speed
• EMI
• Updates to Basic and Advanced Designer
  Certification Programs