Objective 2: Strengthen IPC's Position as the Industry's Worldwide StandardsSetting Organization - PowerPoint PPT Presentation

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Objective 2: Strengthen IPC's Position as the Industry's Worldwide StandardsSetting Organization

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Wong's Kong King. International Ltd. Chair. Mark Buechner. Chair. Gary Long Intel. Chair ... Chair - Lionel Fullwood - Wong's Kong King Int'l Ltd. ... – PowerPoint PPT presentation

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Title: Objective 2: Strengthen IPC's Position as the Industry's Worldwide StandardsSetting Organization


1
Objective 2 Strengthen IPC's Position as the
Industry's Worldwide Standards-Setting
Organization
  • Strategy 1 Increase penetration of IPC
    standards on a global basis.
  • Strategy 2 Evaluate Standards Development
    Process with goal of reducing Standard
    Development time
  • Strategy 3 Make a Greater Emphasis to Publish
    Standards/Documents on Leading-Edge Technologies
  • Strategy 4 Continue emphasis on increased
    participation in standards committees.
  • Objective 1 Global Recognition
  • Objective 3 Expand IPCs Reach
  • Objective 4 IPC's Global Data Collection

2
Committee Participation
  • What we are doing
  • Posters now standards forum
  • First timers meetings
  • Trade press
  • Recognition program

3
IPC Standards Development Forums
  • These Forums Provide
  • Updates on all subcommittee and task group
    efforts
  • Copies of draft documents for review and comment
  • A means to promote new participation

4
IPC Standards Development Forums
  • BACKGROUND
  • Established as a full day forum at Expo 2001
  • Presentations made by each General Committee
  • Address subcommittee and task group make-up
  • Review published documents
  • Review status of draft standards
  • Encourage attendance and participation at
    meetings
  • Forum CDs made available for all attendees
  • Repeated at Expo 2002 and 2003

5
What is the D-30 Rigid PWB Committee?
  • This IPC forum is focused on Rigid Interconnect
    Technology to dissimulate technical information
    for the preparation of Design Guidelines and
    Performance Standards through specific committees
    and task groups

6
D-31 Rigid Printed Board Design Subcommittee
  • Scope establishes the generic requirements
    for the design of organic printed boards and
    other forms of component mounting or
    interconnecting structures. The organic materials
    may be homogeneous, reinforced, or used in
    combination with inorganic materials the
    interconnections may be single, double, or
    multilayer
  • D-31B IPC-2221 Task Group
  • Responsible for the development and update of
    IPC-2221 Generic Standard on Printed Board Design
    and IPC-2222, Sectional Design Standard for Rigid
    Organic Printed Boards
  • Chair - Lionel Fullwood - Wongs Kong King Intl
    Ltd.

7
2221 Task Group Responsibility
  • This task group is responsible for the
    maintenance of IPC-2221/2222
  • The task group also serves as an oversight body
    to ensure commonality among the sectional design
    standards within the IPC-2220 Design Series

IPC-2221 General PCB
IPC-2222 Rigid
IPC-2223 Flex
IPC-2225 MCM-L
IPC-2226 HDI March 2003
IPC-2224 PC Cards
IPC-2227 Embedded Future Doc.
8
HOW THE DOCUMENTS WORK TOGETHER
DESIGN SPEC.S
ACCEPTANCE SPEC.S
IPC-6011
IPC-6xxx
IPC-6013
IPC-6012
IPC-6016
9
Document Synergy Example
  • Changes have to flow seamless between documents
    e.g. an update to foil thickness charts triggers
    the 2221 Task Group to develop master
    requirements for flow down into other sub
    documents

Changes made to IPC-2221..
require respective updates to IPC-601x
documents...
and ultimately PCB Visual Acceptance such as
IPC-A-600
or the other way around from IPC-601x to
IPC-2221.
   
10
To Be Published - IPC-2221A, Generic Standard on
Printed Board Design
  • IPC-2221A, Generic Standard on Printed Board
    Design
  • Incorporates latest design information compiled
    by industry and members of the IPC Designers
    Council covering
  • Dimensioning and tolerancing
  • Tooling Holes
  • Hole Tolerances
  • Blind, buried and Thermal Vias
  • Annular Ring and Conductor Thickness Minimums
  • Updated test coupon designs for PTHs and flex
    circuits
  • Update and expanded board material Dk ranges
  • All applicable material from IPC-2221 Amendment 1
  • Released to the Industry in April 2003

11
To Be Published - IPC-2221A, Generic Standard on
Printed Board Design
New A/B Plated-Hole Evaluation Specimen
12
Tune In This Week.or, No Rest for The Weary
  • The D-31b task group will meet this Wednesday,
    March 26 from 800 am 1000 am in Room Seaview
    A
  • We will begin review of designated test coupons
    existing in multiple IPC artwork packages to
    match new design and performance requirements in
    IPC-2220 and IPC-6010 series documents
  • Our ultimate goal will be the update of the
    IPC-A-47 artwork package

13
IPC Standards Development Forums
  • Where are we now?
  • Forum Attendance Declined Significantly in 2003
  • Logistically Difficult to Implement at APEX/EXPO
  • Would require multiple days for all committees
  • Difficult to schedule in advance of tech meetings

14
IPC Standards Development Forums
  • Where are we now?
  • IPC staff will continue creation of Forum CD
  • Will require annual updates from chairs
  • Forum CDs will be available at IPC Bookstore
  • Presentations posted on Committee Home Page
  • Remains a strong avenue for committee growth
  • Can the on-site forum be resurrected in the
    future?
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