Particle-In-Cell%20Monte%20Carlo%20simulations%20of%20a%20radiation%20driven%20plasma - PowerPoint PPT Presentation

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Particle-In-Cell%20Monte%20Carlo%20simulations%20of%20a%20radiation%20driven%20plasma

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Outline. PIC-Monte Carlo method, EUV generated plasma, Simulation Results, Summary/Outlook. ... Leap-frog scheme. Interpolate. charges to grid. Solve Poisson ... – PowerPoint PPT presentation

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Title: Particle-In-Cell%20Monte%20Carlo%20simulations%20of%20a%20radiation%20driven%20plasma


1
Particle-In-Cell Monte Carlo simulations of a
radiation driven plasma
  • Marc van der Velden, Wouter Brok, Vadim Banine,
  • Joost van der Mullen, Gerrit Kroesen.
  • COST Model Inventory Workshop, April 2005

2
Kinetic Plasma Model
  • Fluid model requires equilibrium assumptions for
  • velocity distributions,
  • Kinetic model preferable when
  • ? gt L or ? gt T
  • plasma sheath near electrode Ignition
    phase of lamp
  • of low pressure lamp

3
Outline
  • PIC-Monte Carlo method,
  • EUV generated plasma,
  • Simulation Results,
  • Summary/Outlook.

4
Particle-In-Cell
1D3V model
5
Monte Carlo Collisions
  • Charged particles collide with background gas,
  • Collision event that instantaneously changes
  • the velocity, in both magnitude and direction,

6
Null-collision method
  • Problem Velocity dependent collision frequency
    ?c N ?(v) v
  • Solution Introduce extra dummy process ? ?c
    maxN ?(v) v
  • In case of collision Draw random number to
    determine process.
  • Processes
  • elastic electron scattering
  • e- Ar ? e- Ar
  • collisional excitation
  • e- Ar ? e- Ar
  • electron-impact ionization
  • e- Ar ? 2e- Ar
  • elastic ion scattering
  • Ar Ar ? Ar Ar
  • charge exchange collisions
  • Ar Ar ? Ar Ar

7
Collision angle
  • Collisions treated in center-of-mass-frame
  • Hard-sphere collisions Forward scattering

8
Next generation lithography
  • Diffraction limited Smaller wavelength is
    smaller features!
  • EUV-radiation 13,5 nm wavelength,

9
Radiation driven plasma
  • EUV radiation from plasma source,
  • Argon background gas p 0.01 1 Pa,

10
Photo-electric effect
  • Photons absorbed in mirror cause
  • collision cascade and secondary
  • electron emission
  • Case 1) no photo-effect
  • Case 2) hot photo-electrons
  • Inelastic reflection Ee h? - W
  • Case 3) cold photo-electrons
  • Electron scattering inside mirror
  • distribution of electron energies S(E).
  • Above certain energy S(E)
  • independent of photon energy.

11
Numerical Setup
Multi-layer mirror
Wall
  • 1-D equidistant grid,
  • 300 grid points ?x lt ?D.
  • ? 105 super particles,
  • one super particle represents
  • 109 real particles.
  • Time steps of 1 ps ?t (2 / ?e),
  • ?t lt (?x / ltvgt).
  • Boundary Conditions
  • mirror and wall are grounded.

12
Results(1) plasma density
  • 100 ns EUV pulse,
  • Sheath build-up,
  • Low-density,
  • ionization degree ? 10-5.

13
Results(1) plasma density
  • 100 ns EUV pulse,
  • Sheath build-up,
  • Low-density,
  • ionization degree ? 10-5.

Hot ph-e-
No photo-effect
Cold ph-e-
14
Results(2) electron energy
  • Electron energy decreases
  • 1) Most-energetic electrons
  • reach walls first,
  • 2) Electron-impact
  • ionization,
  • 3) Excitation.

Hot photo-electrons
No photo-electrons
Cold photo-electrons
15
Results(3) potential
  • Initially negative potential
  • at mirror due to photo-electrons,
  • Plasma potential max 80 V.
  • Photo-effect has effect on potential

Hot photo-electrons
No photo-electrons
Cold photo-electrons
16
Results(4) ion impact
  • Ions accelerated
  • by sheath potential drop,
  • Ions reach wall
  • after EUV pulse,

17
Results(6) Including Ar2
  • EUV-photons energetic enough for
  • double photo-ionization of argon.
  • Sputtering dominated by Ar2.

18
Summary
  • With PIC-MCC it is possible to simulate a plasma
    far from
  • equilibrium.
  • Photo-effect has influence on sputter rate.
  • Sputtering will be modest as kinetic energy of
    most ions will be
  • below sputtering threshold.

19
Outlook
  • Experimental verification
  • Energy sensitive mass-spectrometry,
  • Absolute Line Intensity measurements,
  • Sputter yield and sputter rate measurements.
  • Thompson scattering (?)
  • Energy resolved Secondary electron yield
    measurements.
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