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Integrating DfM into electro mechanical design environments

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Will be used for Bluetooth radio boards, schematics and PCB designs ... Electronic assembly interconnect and packaging design is now described in AP210. STEP AP210 ... – PowerPoint PPT presentation

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Title: Integrating DfM into electro mechanical design environments


1
Integrating DfM into electro- mechanical design
environments
  • Paul Wright,Berkeley Wireless Research Center,
    and
  • Berkeley Manufacturing Institute, 2001

2
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3
Beyond Prototypes!! Design for Manufacturing
Concerns for Pico Radio Testbed
  • Must add draft angle and fillets to part. This
    will add complexity to the model and slightly
    increase the size of the part. Part will be
    slightly conical instead of perfectly cylindrical
    to allow part removal from the injection mold.
  • Currently two sliders are required to form the
    serial port access hole and the power switch
    hole. Both holes need to be designed out.
  • We will need to use larger screw bosses to
    account for draft angle - PCB cut-outs
    (hopefully) have been enlarged to account for
    this.
  • Add a feature to screw the PCB directly to the
    casing??
  • Case lid should be stiffer.
  • Casing design is small enough to be shot on our
    in-house injection press.
  • EDM will be required to make this mold. We must
    located an external vendor for this.

4
Our MCAD tools
  • AutoCAD, Solidworks
  • SDRCs IDEAS, OpenCascade

5
Our ECAD tools
  • Cadences ORCAD
  • Will be used for Bluetooth radio boards,
    schematics and PCB designs
  • (Old BWRC CAD tools were Zuken Redac for Layout,
    Routing, Manufacturing and Viewlogic for the
    schematics)
  • Checking that these new tools can export and
    import new standards from the ISO

6
BWRC
7
STEP
  • The Standard for the Exchange of Product model
    (STEP) Provides a common method of defining
    product data
  • Application Protocols (APs) define the content,
    scope and information requirements of a
    designated application area

8
STEP protocols AP203 and AP210
  • All mechanical CAD systems export and import STEP
    files in the AP203 protocol
  • Electronic assembly interconnect and packaging
    design is now described in AP210

9
STEP AP210
  • April 1999
  • ISO (International Organization for
    Standardization) accepted STEP Application
    Protocol as International Standard
  • Electronic Assemblies, Interconnection and
    Packaging
  • Printed Wiring Assemblies (PWA)

10
AP210 Content
  • Permits the exchange and sharing of
    computer-interpretable product requirements data
    and product definition data with customers,
    suppliers, business partners or others in a
    mutually understood methodology

11
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12
Conclusion Where we are now at BWRC
  • First PicoNode completed and tested in Summer
    2000 (Fused Deposition Model)
  • Injection molding rules have now been implemented
    for larger batch of nodes
  • Mold making and injections being organized now
    for completion in late Spring
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