Signal Integrity for High Speed Design Technical Course

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Signal Integrity for High Speed Design
Technical Course

• mohantygc_at_gmail.com

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What does it take to fill these jobs featured in
popular job sites?

• SIGNAL INTEGRITY ENGINEER Simulation and
  modeling of the complete interconnect system
  experience of high speed digital and/or RF
  simulation tools and test equipment. A working
  knowledge of Ansoft and/or Agilent/HP measurement
  equipment.
• POWER INTEGRITY / DELIVERY ENGINEER Develop
  electrical guidelines for chipset package designs
  based upon interactions with Silicon design,
  Platform design, Technology development and
  Manufacturing organizations. Responsibilities
  include but not be limited to - Designing and
  performing analog simulations for high-density
  electronic package and system-level interconnects
  for PC-based platforms - Performing transmission
  line modeling analysis for packaging parasitic
  extraction, pwr/gnd plane modeling, and power
  delivery network design - Performing Signal
  Integrity and Power Delivery Network analysis
  using FD and TD analysis techniques - Developing
  Power Delivery and Signal Integrity guidelines
  for package design - Performing model
  correlation with lab measurements
• PACKAGE ELECTRICAL ENGINEER
• - Lead platform electrical designs and its
  associated processor and chipset packages
• - Interfacing with die circuits, package layout,
  and board design engineers.
• - Develop predictive models for package and board
  electrical analysis, and verify design
  robustness.
• PACKAGE DESIGN ENGINEER Define packaging project
  objectives, scope, deliverables, performance
  requirements/indicators, resources, and
  implementation requirements to establish agreed
  upon and focused goals, and complete projects on
  time and within budget. Determine product
  fragility, critical parameter's, dimensional
  criteria and other requirements and environmental
  conditions through interaction with Product Line
  Teams, Production Operators, Account Managers,
  Marketing, Customers. Assess package design
  specifications by identifying critical to
  function parameters, and estimating the
  process/manufacturing minimum capabilities.
  Knowledge of packaging materials, processes, and
  design limitations. Optimize package design
  concepts through technical design reviews with
  core engineering and supplier/manufacturer
  groups. Troubleshoot poor, or unacceptable
  packaging performance using dimensional analysis,
  data analysis, general physics, and simulation as
  problem solving tools to meet qualification
  criteria and satisfy product launch strategies.

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Skill set Required for the jobs shown on the
previous slide

• Transmission Lines Theory, Types, Signal
  propagation (Equations of Motion)
• Concept of Electrical Length and Physical Length
• Switching Logic Families
• Microstrip and Stripline Properties and Design
  Equations
• Multiconductor Transmission Lines and Crosstalk
• Common Mode and Differential Mode Signal
  Propagation
• Non-ideal / Real World effects in Signal
  Propagation
• Frequency Domain Concepts in Transmission Lines
• Skin Effects and Applications
• Concept of Return Paths
• Functions of Ground Planes in Package and PCBs
• Time domain versus Frequency Domain Analysis
• Power Bus Design
• Measurements on high speed circuits
• Device Modeling and Packaging
• System Design Concepts
• Thorough Overview of SPICE

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Course Details

• Venue Bhubaneswar (Exact Place to be Decided)
• Timeline December 2006 or January 2007
• 5 days, 5 hours on each day gt Half Semester
  Equivalent
• Price Rs 3000 /- per person
• Incentives
• 25 discount for successfully recommending
  another candidate if the candidate actually joins
  the course
• Rs 1000 /- discount for successfully recommending
  2 candidates if both the recommended candidates
  join the course
• 50 discount for successfully recommending 5
  candidates if all the 5 recommended candidates
  join the course
• Fee Waiver Rs 3000 /- Cash back offer for
  successfully recommending 10 candidates if all
  the 10 recommended candidates join the course
• Wall projected or Whiteboard assisted display
• Hands-on with Pertinent Design Examples using
  SPICE
• Complete Course Materials available at Rs 1800 /-

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Instructor Qualifications

• 7 years Work Experience in India, USA, Malaysia,
  Singapore
• Wide horizon of academic and work experience with
  Power Integrity, Signal Integrity, and Package
  Electrical Design for Desktops, Mobile Products,
  Servers, and Communication Products
• Worked for Tata, US Army, UMR, Intel, Agere
• Have contributed in projects recognized as
  amongst Top 20 Inventions in Year 2002
• Technically contributed and mentored in myriad
  cultural settings

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Introduction to Signal Integrity

• What is Signal Integrity?
• The art and science that pertains to ensuring
  that signals are launched with sufficient
  fidelity, and are received to ensure proper
  timing and no faulty switching
• What is the need to learn Signal Integrity?
• Signal Integrity in real-world applications is
  compromised by artifacts of the circuit layout on
  PCB, the packaging used, and is impacted by the
  circuit logic family, and other aspects of
  high-speed digital design. These real-world
  effects can lead to severely distorted voltage
  and current waveforms, and result in faulty
  switching and logic errors. This course discusses
  necessary skills to ensure signal quality for
  designs using standard design practices, computer
  simulations, and measurements.

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Who might be interested in this course

• Electrical Engineers, Electronics Engineers,
  Instrumentation Engineers
• Anyone interested in a career in High Speed
  Signal Integrity, Power Integrity, Package
  Design, Board Design, and Electromagnetic
  Compatibility in VLSI Design

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Course Objectives

• After the end of this course students will be
  able to
• Understand the basic concept of electronic
  packaging
• Understand package and board design stackup
  principles as well as actual designs
• Understand signal and power routing in package
  and board designs
• Understand frequency dependency of Signal
  Integrity
• Understand the meaning of electrical concepts in
  time and frequency domain
• Provide package and board design guidelines to
  actual customers / employers
• Calculate signal delays across signal paths
• Estimate and calculate the effects of signal and
  power nets on other signal and power nets in the
  design
• Draw simple electrical circuit models for
  physical features in package and board design
• Decide on optimum lengths of traces, signal
  levels, signaling strategies
• Understand the use of Oscilloscopes and Vector
  Network Analyzers in Signal Integrity Measurements

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The EndPlease contact Silicon Mohanty for
course registration guidelines