PVNET

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HMI CIEMAT ECN GENEC-CEA IMEC JRC
Ispra Siemens Teksolar Uni Hull Uni
Ljubljana Uni Utrecht Würth Solar Uni Warsaw ZSW

• PVNET
• European RTD Roadmap for PV

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Vision

• Objectives
• Development of a coherent, accepted PV strategy
• Giving a basis for a consistent PV support
  (RTD, market, education)
• on both a European and national level
• A competitive Europe and a sustainable society
• In order to
• Make more efficient use of (public) money
• Maintain the needed high growth rates (25 ?
  2010)
• Achieve the predicted cost reductions

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Vision

• Role of RD community
• Perspective of PV
• Technological challenges

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Role of RD community
Technology Policy Client
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Perspective of PV Implementation
EPIA Industry Roadmap
2010 EC White Paper 3 GWp gt 27 annual
growth System Cost 2,5 /Wp
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Perspective of PV System Cost
Photex FP5 (IEA) Learning Curve Project
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Approach

• Roadmap One Destination
• Different routes/actors
• RTD Roadmap
• Open discussion platform
• PVNET partners initiating discussions
• - workshops
• - discussion papers
• Close cooperation with other initiatives
• EPIA, PV-EC-NET, a-Si-NET, IPs,
  NoEs
• Input from all interested parties
• - Website www.pv-net.net

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Structure of the RTD Roadmap

• 10 Chapters
• 0 Introduction
• 1 Wafer technologies (x-Si, III-V
  (concentrators))
• 2 Thin films (a/mc-Si, CIS, CdTe)
• 3 Novel devices (DSC, polymers, )
• 4 Common technological issues
• 5 BOS (grid connection, storage and mounting)
• 6 Standardization and harmonisation
• 7 Market implementation
• 8 Socio-economic issues
• 9 Cross Fertilization

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Structure of the RTD Roadmap

• Materials
• 1 State-of-the-art
• - Science (Materials)
• - Technology (Production)
• - Commercial status (2000,2010,2020)
• Volume of module production, cost (break down)
• 2 Bottle-necks
• Short term lt 2005 (Production)
  technology
• Medium term 2005-2010 ?
  
• Long term gt 2010 (Materials) science
• 3 RD Priorities Short to long term

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Wafer technologies x-Si

• Status
• 2000 x-Si gt 90 Increasing share! multi-X gt
• 2010 x-Si 80-90
• 2020 x-Si 50 (cast Si, sheets, film-Si)
• Cost reduction slower than expected
• x-Si is not taken over by thin-films soon !
• New investments mainly x-Si
• Lower risk lines can be bought
• Synergy with Si-based electronics industry
• Cast Si wafers ? Si Sheets ? Film Si (merge
  with thin films)

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Wafer technologies x-Si

• Cost Break Down

Silicon cost dominant Silicon feedstock
Crystal growth Wafering
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Wafer technologies x-Si

• Bottle-necks
• Silicon is the main cost factor
• Efficient use of (lower grade) Si
• Thin wafers
• Si sheets
• Film Si
• Higher efficiency
• Production is batch-like
• High-throughput inline production processes
• Feedstock is mainly a strategic business issue

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Wafer technologies x-Si

• Priorities
• Issue Ready Priority
• Solar Silicon Feedstock 2005 1
• Process (dep. on crystallisation) 2007 1
• High-throughput sheets 2006 1
• Thin wafers (slicing, processing) 2005 2
• Yield, rear passivation, BSR
• New module design 2008 2
• Alternative encapsulants
• Back-contacted cells
• Materials science 2015 2
• (defects, in-process material improvement)
• New routes that offer lower costs (Solsilc)

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Wafer technologies x-Si

• Priorities
• Issue Ready Priority
• Production technology 2007 2
• Low-cost surface passivation 2007 3
• including heterojunctions
• Low-cost bulk passivation 2006 3
• High-efficiency multi x-Si (20) 2008 3
• New designs, light management, passivation
• Ag-less metallisation schemes 2015 3
• High-throughput processing 2010 3-4 LT
  (200 m2/h)
• 50 m2- 200 m2 /hour (1-5 wafers/sec)
• In-line characterisation 2004 5
• Recycling of modules and BOS 2010 5

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Wafer technologies III-V (concentration)

• Status
• III/V Impressive Efficiencies gt 30 eg
  Ge/GaAs/InGaP
• Very high Substrate Cost
• gt now space, concentrators route to 3rd
  generation
• Priorities
• Issue Ready Priority
• Low-cost substrate (e.g. lift-off) 2010 1
• New structures ? gt 40 2020 1 LT !
• High-througput deposition 2015 2
• Low-cost Concentrators 2007 3
• TPV 2010 3
• Chalcopyrite on metal for concentrators 2007
  3

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Amorphous and thin film silicon

• Status
• 2000 Most important thin-film
• Chronar low-cost 5 eff. (batch 1
  chamber)
• United Solar expensive 7 eff.
  (roll-to-roll)
• Kaneka expensive 9 eff. (batch multi
  chamber)
• 2010 mc-Si/a-Si 12-15
• 2020 film-Si 15?
• Synergy with glass industry (architectural glass
  (ZnO))
• Large-scale production technology

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Amorphous and thin film silicon

• Bottle-necks
• Many issues are in common with other thin-film
  options
• poor image from the first, a-Si prototypes
• still a relatively low efficiency, (few
  exemptions)
• expected lifetime
• cost of production equipment
• process control

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Amorphous and thin film silicon

• Priorities

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Compound semiconductors

• Status
• 2000 CIS and CdTe in pilot production phase
• Scaling-up is not trivial
• 2010 5 share ? CIS 12-14 eff.
• CdTe 12 eff.
• 2020 20 share ? CIS 20 eff.
• CdTe 14 eff.
• CdTe Cd perspective
• CIS In, Ga availability
• Synergy with glass industry (architectural glass
  (ZnO))
• Large-scale production technology

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Compound semiconductors

• Bottle-necks
• Many issues are in common with a-Si
• Health Safety of some materials as well as
  availability
• cost of production equipment
• process control
• expected lifetime
• image

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Compound semiconductors

• Priorities CIS

Interfaces and point defects LT 1st
priority
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Compound semiconductors

• Priorities CdTe

Back contact ST
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Novel devices

• Status
• 2000 DSC (Gratzel) plans for pilot production
• Polymer, organic molecular cells Lab phase
  2010 DSC 1 share ? Liquid version ?
• Others lab phase
• 2020 DSC 5 share ?
• Others (pilot) production
• Cost Break down
• DSC glass/TCO, dye, TiO2 (purity)
• Others no data !! materials (purity, complexity
  ?)

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Novel devices

• Bottle-necks
• DSC Stability (Temp)
• Efficiency
• Polymers Low efficiency yet (3)
• Poor stability
• - Little understanding of the relation
  between
• structure and properties and how to improve

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Novel devices

• Priorities
• Issue Ready Priority
• Collection of generated carriers 2007 1
• (Lifetime, charge separation,
• mobility, distance)
• Microstructure (processing, stability) 2010
  1
• Low-cost materials and processing 2015 1
• non-vacuum (eg printing)
• Stability (oxidation) 2015 1
• Suitable materials 2015 2
• bandgap engineering
• Understanding of interfaces 2020 2

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Common Technological Issues

Manufacturing High
Efficiency Concepts Equipment
Material Research Quality Control
Substrates and TCOs
Encapsulation System Technology
Life Cycle Engineering Building
Integration Standards, Certification
Market
Penetration
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BOS grid connection, storage and mounting

• Status

IEA PVPS Task 1
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BOS grid connection, storage and mounting

• Status

Standardisation
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BOS grid connection, storage and mounting

• PV to light the world
• PV as a building element
• PV for a better grid
• Bottle-necks
• Mounting Standardisation (ease of mounting)
• Inverter Reliability (lifetime)
• Standardisation
• Flexibility (system lay-out)
• Storage Lifetime
• Health Safety of materials
• Cost

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BOS grid connection, storage and mounting

• Priorities
• Issue Ready Priority
• Reliable low-cost inverters 2007 1
• Plug-and-play mounting 2007 1
• Module integrated electronics
• Batteries low-cost non-toxic 2010 1
• Module-integrated
• Grid-connected (UPS, grid quality)
• Standardisation of grid connection
• plugs, islanding, grid quality
• economics

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Conclusion

• The RD Roadmap is based on
• vision of all stakeholders (R, I,G,M)
• the potential of science and technology to
  realise it (R,I)
• It is a living document gt PV Catapult
• ??
• The value is in the discussion not the paper

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Amorphous and thin film silicon

• Bottle-necks