Chapter 1 Introduction: Electronic products, technologies and packaging

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Chapter 1 IntroductionElectronic products,
technologies and packaging

• The course material was developed in INSIGTH II,
  a project sponsored by the Leonardo da Vinci
  program of the European Union

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Chapter 1 Introduction

• NB!! Norwegian text on this page
• Forelesere Per Øhlckers, Helge Kristiansen,
  Frode Strisland og Morten Gulliksen
• Laboratorieveiledere Stein Lyng Nielsen
• På kursets hjemmeside http//www.fys.uio.no/studi
  er/kurs/fys317 finnes
• Oppdatert timeplan NB! Vær forberedt på endringer
  underveis!
• Forelesnings-lysark (ppt filer og pdf filer)
• Veiledning til prosjektoppgaver(r)
  http//www.fys.uio.no/slyng/FYS3260_4260.pdf
• Tidligere eksamensoppgaver
• Diverse annen informasjon (elektronisk utgave av
  læreboken, etc)
• Pensumliste. (Læreboken prosjektoppgaver
  forelesnings-lysark tentativt noen web-sider)
  Se neste slide for detaljert liste. NB! Spesielt
  innholder lysark for Kapitel 9 Micro Structure
  Technology and Micromachined Devices ekstra
  pensum.
• Muntlig i forelesninger Dels pensum, dels
  utfyllende
• Prosjektoppgaven er obligatoriske
• Bedrifts-ekskursjonene anbefales sterkt! Ikke
  obligatorisk.
• Drilling i tidligere eksamensoppgaver avgjørende
  for å forstå hvilke krav som stilles til eksamen.
  Fortsatt en del pugg forlanges, selv om faglig
  forståelse og oversikt er det viktigste.

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Chapter 1 Introduction

• NB!! Norwegian text on this page
• Detaljert Pensumliste
• Hele læreboken
• Kunne vært oppdatert, men basis innhold fortsatt
  bra. Få først inn oversikten og forståelsen for
  de enkelte teknologier, deretter mer pugg på
  detaljer.
• Prosjektoppgaver
• Konstruksjon, sammenstilling og testing av et
  overflatemontasje kretskort
• Selvstudium med Multitrain e-læringsverktøy
  (Tentativt)
• Forelesnings-lysark.
• NB! Spesielt innholder lysark for Kapitel 9
  Micro Structure Technology and Micromachined
  Devices ekstra pensum som ikke er med i boka,
  f.eks. viktig stoff om Silisium Mikromaskinering.
• Ekstra web-sider og artikler, for å få med senere
  års teknologiutvikling
• Her vil det bli lagt inn linker eller nedlastbare
  filer etterhvert
• Muntlig i forelesningene Dels pensum, dels
  utfyllende

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Un of Oslo FYS3260/4260 Information

• Lecturers Per Øhlckers, Helge Kristiansen, Frode
  Strisland and Morten Gulliksen
• Textbook Leif Halbo and Per Ohlckers
  Electronic Components, Packaging and Production
  Textbook, ISBN 82-992193-2-9, 330 pages,
  University of Oslo, December 1995.
• Laboratory instructor Stein Lyng Nielsen
• Course homepage http//www.fys.uio.no/studier/kur
  s/fys317 contains
• Updated scheduling
• Lecture notes (mostly ppt files or pdf files)
• Instructions for the mandatory laboratory
  project(s)
• Earlier exam tests with guides
• Miscellaneous information, like electronic
  version of the textbook, etc.
• Obligatory reading and work
• The complete textbook lecturing notes the
  laboratory project(s) tentatively some
  web-pages and articles to update on recent
  developments

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Definition ofELECTRONIC PACKAGING AND
INTERCONNECTION TECHNOLOGY

• "The realization of the physical, electronic
  system, starting with block-/circuit diagram
• Involves choice of technology for implementation,
  choice of materials, detailed design in chosen
  technology, analysis of electrical and thermal
  properties, reliability.
• This definition is one among many, and may shift
  as the field is further developed.

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Multidisciplinarity of Electronic Packaging and
Interconnection Technology

• Requires combination of many disciplines
• Electronics
• Materials properties and materials compatibility
• Mechanics
• Chemistry
• Metallurgy
• Production technology
• Reliability, etc.
• Product development should involve experts from
  the various fields, and the interdependence of
  the fields may be the most important to make a
  good product.

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TYPES OF ELECTRONICS AND DEMANDS ON THEM -
EXAMPLES

• Satellite electronics
• Production volume one unit, 20 years life
  required, no repair, very low weight and power,
  very high development cost acceptable
• Life saving medical electronics
• Similar reliability/power demand, may be in harsh
  environment (body fluids), medium production
  volume.

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Examples, cont

• Telephone main switchboard
• 10 year life, benign environment, very high
  complexity, low and high production volume, high
  price pressure
• Military electronics
• Very high reliability demands, in very rough
  environments. High development cost (and
  production cost) acceptable

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Examples, cont

• Computers
• High performance and reliability required. Very
  short product life, high production volume for
  some, small volume for some products
• Consumer products (watches, calculators...)
• Extreme price pressure, very short product life,
  low weight, power, very big market. No repair.

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Development Phases

• Market research
• Gives product idea

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DEVELOPMENT PHASES, continued

• Pre-study
• Gives product suggestion
• Defining overall specifications
• Gives definition of product, simulation/lab model
  of critical parts
• Prototype A
• Main principles analyzed, important parts
  implemented, technology chosen

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DEVELOPMENT PHASES, continued

• Prototype B
• Detailed design, correct form and components.
  Ready for industrialization.
• Industrialization
• Prototype adapted to producability in available
  production equipment. New production line built
  if needed, pilot series made.
• Marketing started, service planned
• Full scale production
• Product sale, maintenance, service

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LEVELS OF INTERCONNECTION

• Fig 1.2 Levels of interconnections in large
  electronic systems

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End of presentation of Chapter 1
IntroductionElectronic products, technologies
and packaging

• Important issues
• Definitions
• Multidisciplinarity
• Different types of applications with different
  requirements
• Hierarchy for Levels of Interconnections
• Questions and discussions?