Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC) and Trends - Research Beam

1
Flip Chip Market by Packaging Technology (3D IC,
2.5D IC, 2D IC), Bumping Technology (Copper
Pillar, Solder Bumping, Tin-lead eutectic solder,
Lead-free solder, Gold Bumping), Industry
(Electronics, Industrial, Automotive Transport)
- Global Opportunity Analysis and Industry
Forecast, 2014 - 2022
TELEPHONE [phone]E-MAIL
sales_at_researchbeam.com
2
Report Overview
Flip chip, also known as controlled collapse chip
connection (C4), consist of conductive bumps
deposited on the chip pads on the top side of the
wafer and then semiconductor devices are mounted
by flipping the chip. It is an advanced
semiconductor interconnecting device extensively
used in different electronic products such as
smartphones, PCs, and medical devices among
others due to its advantages such as lower cost,
increased packaging density, improved performance
and reduced size thickness of the chip.
Further, flip chip has enabled the dramatic
improvement of portable electronics and electric
vehicles by providing better means for electrical
interconnections. Flip chip market is mainly
driven by the emerging internet of things a
network of physical devices, vehicles, buildings,
and other items that include embedded
electronics, software, sensors, actuators, and
network connectivity. In addition, its
technological superiority over the traditional
wire bond electrical connection makes it the
exceptional alternative. However, the technology
is still in mutation. The rate of flip chip is
propelled by bumping cost and assembly process
cost. Get More Heregtgtgt http//www.researchbeam.co
m/flip-chip-market
RESEARCH
No of Pages 250

3
Report Overview
The market is segmented on the basis of flip chip
packaging technology, bumping technology,
industry vertical, and geography. Based on
bumping technology, the market comprises copper
pillar, solder bumping, gold bumping and others
including aluminum conductive polymer bumping.
The copper pillar segment dominates the market as
it is a next generation flip chip interconnect
which offers advantages in many designs while
meeting current and future electronic device
requirements. It is an excellent interconnect
choice for applications such as transceivers,
embedded processors, and application
processors. POTENTIAL BENEFITS FOR
STAKEHOLDERS This report provides an in-depth
analysis of the world flip chip market along with
current trends and future estimations to identify
lucrative investment opportunities. This report
identifies the key drivers, opportunities, and
restraints that shape the market along with their
impact analysis. Porters Five Forces analysis
highlights the potency of buyers and suppliers
participating in this market to facilitate better
business decisions for stakeholders and
strengthen their supplier and buyer
networks. Market estimation of geographical
regions is based on the current market scenario
and future trends.
RESEARCH
No of Pages 250

4
Table of Content
CHAPTER 1 Introduction 1.1 Report
DescriptionCHAPTER 2 EXECUTIVE SUMMARY 2.1 CXO
Perspective CHAPTER 3 MARKET OVERVIEW 3.1 Market
Definition and Scope CHAPTER 4 WORLD FLIP CHIP
MARKET, BY PACKAGING TECHNOLOGY 4.1
Overview CHAPTER 5 WORLD FLIP CHIP MARKET, BY
INDUSTRY 5.1 Overview5.2 Electronics CHAPTER 6
WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY 6.1
Overview6.2 Copper pillar CHAPTER 7 WORLD FLIP
CHIP MARKET BY GEOGRAPHY CHAPTER 8 COMPANY
PROFILES 8.1 International Business Machines
Corporation (IBM) Enquire Heregtgtgt 
http//www.researchbeam.com/flip-chip-market/enqui
re-about-report
RESEARCH
No of Pages 250

5
RESEARCH
No of Pages 250