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NANO-ELECTRO-MECHANICAL SYSTEM(NEMS)

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CONTENTS Introduction Benefits of Nano-machines Fabrication of NEMS device Advantages Applications Summary INTRODUCTION Nano-Electro-Mechanical system (NEMS) is the ... – PowerPoint PPT presentation

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Title: NANO-ELECTRO-MECHANICAL SYSTEM(NEMS)


1
NANO-ELECTRO-MECHANICAL SYSTEM(NEMS)
2
contents
  • Introduction
  • Benefits of Nano-machines
  • Fabrication of NEMS device
  • Advantages
  • Applications
  • Summary

3
  • INTRODUCTION
  • Nano-Electro-Mechanical system (NEMS) is the
    integration of mechanical elements, sensors,
    actuators and electronics on a common
    silicon substrate.
  • The Nano mechanical components are fabricated
    using compatible micromachining process.
  • NEMS is the enabling technology allowing the
    development of smart products.

4
  • Nano electro mechanical devices promise to
    revolutionize measurements of extremely small
    displacement and extremely weak forces,
    particularly at the molecular level.
  • NEMS devices can be so small that hundreds of
    them can be fit in the same space as one single
    micro device that performs same function.

5
  • In Nems devices the sensors gather the
    information from surrounding environment through
    measuring mechanical, chemical, biological,
    chemical and optical phenomenon.
  • The electronics then process the information
    derived form the sensors.
  • Through some decision making capability direct
    the actuators to respond by moving, regulating
    and filtering.

6
  • BENEFITS OF NANO MACHINES
  • Nano-Mechanical devices promise to revolutionize
    measurements of extremely small displacements
    and forces.
  • Can built with the masses approaching a few
    attograms(10-18g) and with the cross section of
    10nm.
  • A second important attribute Nano machines is
    that they dissipate less energy.

7
  • NEMS are extremely sensitive for the external
    damping mechanisms which is crucial for building
    sensors.
  • The Geometry of a NEMS device can be tailored so
    that the vibrating elements reacts only to
    external forces in a specific direction.
  • NEMS are ultra low power devices.
  • Fundamental power scale is defined by the thermal
    energy divided by the response time

8
  • fabrication of nems device
  • There are three Basic building blocks in NEMS
    technology.
  • Deposition processes.
  • Lithography.
  • Etching processes.

9
  • Deposition Process
  • One of the basic building blocks in NEMS
    processing is the ability to deposit thin films
    of materials.
  • Thin films of thickness of about few nm to about
    100 nm.
  • Chemical methods used in NEMS deposition
    process.
  • Chemical vapour deposition.
  • Epitaxy.

10
  • Chemical vapour deposition
  • Fig. 1 Typical hot-wall LPCVD
    reactor

11
  • Epitaxy
  • Fig 2 Typical cold-wall vapour phase
  • epitaxial
    reactor

12
  • Lithography
  • Lithography in the NEMS context is typically the
    transfer of a pattern to a photosensitive
    material by selective exposure to a radiation
    source such as light.
  • A photosensitive material is a material that
    experiences a change in its physical properties
    when exposed to a radiation source.

13
  • Pattern Transfer
  • Fig 3 Transfer of a pattern to a
    photosensitive material

14
  • Figure 4a) Pattern definition in positive
    resist, b) Pattern definition in negative resist.

15
  • Alignment
  • Inorder to make useful devices the patterns for
    different lithography steps that belongs to a
    single structure must be aligned to one another.
  • The first pattern includes a set of alignment
    marks.
  • The first pattern alignment marks used as the
    reference when positining subsequent patterns.

16
  • Exposure
  • This parameter is required in order to achive
    accurate pattern transfer from the Mask to the
    photo sensitive layer.
  • Different Photo resist exhibit different
    sensitivity to different wavelengths

17
  • Etching
  • It is necessary to etch the thin films previously
    deposited or the substrate itself.
  • There are 2 class of etching process.
  • Wet etching.
  • Dry etching.

18
  • Wet etching
  • This is the simplest etching technology.
  • There are complications since usually Mask is
    desired to selectively etch the material.
  • It requires a container with a liquid solution
    that dissolve the material used.
  • Some single crystall material, such as silicon,
    exhibits anistropic etching in certain chemicals.

19
  • ADVANTAGES
  • Cost effectiveness.
  • System integration.
  • High Precision.
  • Small size.

20
  • APPLICATIONS OF NEMS
  • Accelerometer
  • NEMS accelerometers are quickly replacing
    conventional accelerometers for crash air-bag
    deployment systems in automobiles.
  • Figure 6 Accelerometer(air bags)

21
  • Nano nozzles
  • Another wide deployment of NEMS is their use as
    nano nozzles that direct the ink in inkjet
    printers.
  • They are also used to create miniature robots
    (nano-robots) as well as nano-tweezers.
  • NEMS have been rigorously tested in harsh
    environments for defense and aerospace where they
    are used as navigational gyroscopes.

22
  • NEMS in Wireless
  • A 3G smart phone will require the functionality
    of as many as five radios for TDMA, CDMA, 3G,
    Bluetooth and GSM operation. A huge increase in
    component count is required to accomplish this
    demand.

23
  • Thermal actuator
  • Thermal actuator is one of the most important
    NEMS devices, which is able to deliver a large
    force with large displacement.

24
  • SUMMARY
  • Nano-systems have the enabling capability and
    potential similar to those of nano-processors .
  • Since NEMS is a nascent and synergistic
    technology, many new applications will emerge,
    expanding the markets beyond that which is
    currently identified or known.

25
  • NEMS is forecasted to have growth similar to its
    parent IC technology.
  • For a great many applications, NEMS is sure to be
    the technology of the future.

26
  • THANK YOU
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