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Digital Integrated Circuits A Design Perspective

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CMOS Process Photo-Lithographic Process Patterning of SiO2 CMOS Process at a Glance CMOS ... Silicon base material (b) After ... After deposition of SiO 2 insulator, ... – PowerPoint PPT presentation

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Title: Digital Integrated Circuits A Design Perspective


1
Digital Integrated Circuits A Design Perspective
Jan M. Rabaey Anantha Chandrakasan Borivoje
Nikolic
Manufacturing Process
July 30, 2002
2
CMOS Process
3
Photo-Lithographic Process
optical
mask
oxidation
photoresist coating
photoresist
removal (ashing)
stepper exposure
Typical operations in a single
photolithographic cycle (from Fullman).
photoresist
development
acid etch
process
spin, rinse, dry
step
4
Patterning of SiO2
Chemical or plasma
etch
Si-substrate
Hardened resist
SiO
2
(a) Silicon base material
Si-substrate
Photoresist
SiO
2
(d) After development and etching of resist,
chemical or plasma etch of SiO
2
Si-substrate
Hardened resist
(b) After oxidation and deposition
SiO
of negative photoresist
2
Si-substrate
UV-light
Patterned
(e) After etching
optical mask
Exposed resist
SiO
2
Si-substrate
Si-substrate
(f) Final result after removal of resist
(c) Stepper exposure
5
CMOS Process at a Glance
6
CMOS Process Walk-Through
7
CMOS Process Walk-Through
8
CMOS Process Walk-Through
9
CMOS Process Walk-Through
10
Advanced Metallization
11
Design Rules
12
3D Perspective
Polysilicon
Aluminum
13
Design Rules
  • Interface between designer and process engineer
  • Guidelines for constructing process masks
  • Unit dimension Minimum line width
  • scalable design rules lambda parameter
  • absolute dimensions (micron rules)

14
CMOS Process Layers
15
Layers in 0.25 mm CMOS process
16
Intra-Layer Design Rules
4
Metal2
3
17
Vias and Contacts
18
CMOS Inverter Layout
19
Sticks Diagram
  • Dimensionless layout entities
  • Only topology is important
  • Final layout generated by compaction program

20
Packaging
21
Packaging Requirements
  • Electrical Low parasitics
  • Mechanical Reliable and robust
  • Thermal Efficient heat removal
  • Economical Cheap

22
Bonding Techniques
23
Tape-Automated Bonding (TAB)
24
Flip-Chip Bonding
25
Package-to-Board Interconnect
26
Package Types
27
Package Parameters
28
Multi-Chip Modules
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