Flip Chip and Wafer Level Packaging Technology at Hong Kong University of Science and Technology ???????????????????? - PowerPoint PPT Presentation

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Flip Chip and Wafer Level Packaging Technology at Hong Kong University of Science and Technology ????????????????????

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Title: Flip Chip and Wafer Level Packaging Technology at Hong Kong University of Science and Technology ????????????????????


1
Flip Chip and Wafer Level Packaging Technology
atHong Kong University of Science and
Technology????????????????????
2
Why Flip Chip?
  • Better manufacturing yield than wirebond for high
    pin-count chips.
  • ?????????,?????????
  • Faster manufacturing through-put than wirebond
    for high pin-count chips.
  • ?????????,??????????
  • More reliability than wirebonded chips.
  • ?????????????
  • Better electrical characteristics (less
    inductance) for high-speed chips. A must for RF,
    optoelectronics, high-speed digital (gt500MHz).
  • ??????,??????????

3
More on Why Flip Chip?
  • Desirable for high-performance Ball Grid Array
    (BGA) package.
  • ?????????????????
  • Desirable for Chip Size Package (CSP).
  • ??????????????
  • The Flipchip bonded wafer market is predicted to
    grow 37 annually while the overall IC units will
    only grow 8.
  • ????????????37,???IC???8?
  • The Flipchip bonded wafer is expected to increase
    from 3.4 million (2000) to 26.2 million (2005)
    wafers.
  • ??????????????(2000?)???????????(2005?)?

4
Forecast on IC Unit IC????(2000-2005)
Compound Annual Growth Rate 8.3
Units (Billion)
Year
Source Electronic Trend Publications Inc, 2001
5
DQ Forecast Bare Die Usage(1999-2004)
(Units in Million)
Source Dataquest, April 2001
6
Forecast on Bumped Wafers Usage????????
(2000-2005)
(Units in Million)
Source Dataquest, April 2001
7
Technology Leaders are Sold on Flip
Chip??????????????
  • Intel has migrated completely to flip chip bonded
    BGA for the Pentium 4 product family due to high
    clock speed and high pin-count (gt4000).
  • ????????(gt4000)??,Intel????4???????????????BGA???
  • The most advanced opto-electronics components
    from NTT uses flip-chip technology exclusively.
  • ??NTT???????????????? ?
  • IBM has used flip-chip gt30 years.
  • ???????IBM?????30?

8
Low Risk and Established Infrastructure????????
  • Well established industrial infrastructure.
  • ?????????
  • Production equipment similar to chip and printer
    circuit board industries.
  • ?????????????????
  • Compatible to Surface Mount Technology (SMT).
  • ?????????
  • Produce smaller and lighter electronic module
    than wirebonded chips.
  • ??????????????

9
Flip Chip and Wafer Level PackagingTechnology in
HKUST????????????????????
  • Electroplating solder bumping (Mainstream Flip
    Chip Technology)
  • ??????(?????????)
  • Electroless UBM and stencil printing bumping
    (Lower cost Flip Chip Technology w/o
    photolithography and vacuum processing)
  • ????????(UBM)?????????(???????? - ????????????)
  • Wafer-Level Input/output Redistribution.
  • ?????/???????

10
Commercial Applications????
  • For Integrated Circuit Wafer Foundry
  • ?????????
  • Wafer bumping advanced integrated circuit chips
    for high-speed, high input/output counts, and for
    chips going into advanced packages such as Ball
    Grid Array (BGA) and Chip Size Package (CSP).
  • ?????????????/?????????????,?????????,??????????
    ????.
  • Redistribution of perimeter I/O (designed for
    wirebonding) to array I/O for advanced packaging.
  • ????????????(?????/??????).
  • For Packaging and Assembly Foundry
  • IC??????
  • Assembly of Advanced packages such as Ball Grid
    Array (BGA) and Chip Size Package (CSP).
  • ???????,??????????????.
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