Title: Flip Chip and Wafer Level Packaging Technology at Hong Kong University of Science and Technology ????????????????????
1Flip Chip and Wafer Level Packaging Technology
atHong Kong University of Science and
Technology????????????????????
2Why Flip Chip?
- Better manufacturing yield than wirebond for high
pin-count chips. - ?????????,?????????
- Faster manufacturing through-put than wirebond
for high pin-count chips. - ?????????,??????????
- More reliability than wirebonded chips.
- ?????????????
- Better electrical characteristics (less
inductance) for high-speed chips. A must for RF,
optoelectronics, high-speed digital (gt500MHz). - ??????,??????????
3More on Why Flip Chip?
- Desirable for high-performance Ball Grid Array
(BGA) package. - ?????????????????
- Desirable for Chip Size Package (CSP).
- ??????????????
- The Flipchip bonded wafer market is predicted to
grow 37 annually while the overall IC units will
only grow 8. - ????????????37,???IC???8?
- The Flipchip bonded wafer is expected to increase
from 3.4 million (2000) to 26.2 million (2005)
wafers. - ??????????????(2000?)???????????(2005?)?
4Forecast on IC Unit IC????(2000-2005)
Compound Annual Growth Rate 8.3
Units (Billion)
Year
Source Electronic Trend Publications Inc, 2001
5DQ Forecast Bare Die Usage(1999-2004)
(Units in Million)
Source Dataquest, April 2001
6Forecast on Bumped Wafers Usage????????
(2000-2005)
(Units in Million)
Source Dataquest, April 2001
7Technology Leaders are Sold on Flip
Chip??????????????
- Intel has migrated completely to flip chip bonded
BGA for the Pentium 4 product family due to high
clock speed and high pin-count (gt4000). - ????????(gt4000)??,Intel????4???????????????BGA???
- The most advanced opto-electronics components
from NTT uses flip-chip technology exclusively. - ??NTT???????????????? ?
- IBM has used flip-chip gt30 years.
- ???????IBM?????30?
8Low Risk and Established Infrastructure????????
- Well established industrial infrastructure.
- ?????????
- Production equipment similar to chip and printer
circuit board industries. - ?????????????????
- Compatible to Surface Mount Technology (SMT).
- ?????????
- Produce smaller and lighter electronic module
than wirebonded chips. - ??????????????
9Flip Chip and Wafer Level PackagingTechnology in
HKUST????????????????????
- Electroplating solder bumping (Mainstream Flip
Chip Technology) - ??????(?????????)
- Electroless UBM and stencil printing bumping
(Lower cost Flip Chip Technology w/o
photolithography and vacuum processing) - ????????(UBM)?????????(???????? - ????????????)
- Wafer-Level Input/output Redistribution.
- ?????/???????
10Commercial Applications????
- For Integrated Circuit Wafer Foundry
- ?????????
- Wafer bumping advanced integrated circuit chips
for high-speed, high input/output counts, and for
chips going into advanced packages such as Ball
Grid Array (BGA) and Chip Size Package (CSP). - ?????????????/?????????????,?????????,??????????
????. - Redistribution of perimeter I/O (designed for
wirebonding) to array I/O for advanced packaging. - ????????????(?????/??????).
- For Packaging and Assembly Foundry
- IC??????
- Assembly of Advanced packages such as Ball Grid
Array (BGA) and Chip Size Package (CSP). - ???????,??????????????.