Flatness Inspection

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The Next Generation in Surface
Measurement and Analysis
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Agenda January 23, 2009

• Introductions
• RIM PS400 current utilization
• RIM PS400 future DOE requirements
• Studio Software Overview
• Studio Software Highlights (Demo)
• DIC Module Overview
• Rim prior DIC test services review
• Q A
• Next Steps

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TherMoiré AXP Specifications

• Up to 400 mm x 400 mm maximum sample size
• Acquisition of 1.4 million data points in less
  than 2 seconds
• Thermal ramp rates up to 2.0 C per second
• Enhanced temperature uniformity convective
  heating and cooling
• High resolution measurement of small form factor
  samples up to 17 mm X 13 mm
• XYZ axis strain and CTE calculation
• Increased lab productivity via advanced power
  cooling
• Support for Reliability testing from minus 55 C
  to 150 C and reflow simulation to 280 C
• Multiple part testing for increased throughput

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Studio 4.0 Software

• Core Modules installed on the TherMoiré AXP
  include
• Studio Manager - seamlessly launches and switches
  between modules
• Profile Generator - click to create and modify
  thermal profiles with machine control
• Surface Measurement - simplified data acquisition
  and machine actuation
• Surface Analysis - process data and make
  decisions using 2D and 3D graphical results
• Report Generator - create custom-formatted
  reports for presenting data and results in
  multiple application formats

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Studio 4.0 Software

• Studio 4.0 Software Modules
• Studio Manager (Core)
• Profile Generator (Core)
• Surface Measurement (Core)
• Surface Analysis (Core)
• Report Generator (Core)
• Shadow Moiré Surface Measurement (Core)
• Micro Fringe Projection (MP10) Surface
  Measurement (Add-on)
• Digital Image Correlation (DIC) Surface
  Measurement (Add-on)
• Convective Module (Add-on)
• CoolBoost Module (Add-on)

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Studio Manager and Surface Analysis Accessible
when using any Studio Module
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Surface Analysis

• Freedom to Analyze and Compare 2D and 3D data
  sets
• Control multiple graphs on-screen at once
• Automated Output-of-Edge, Diagonal, 2D and 3D
  Displacement plots
• Mask areas and burn masks permanently into phase
  images
• Calculate one displacement data set relative to
  another
• Export data for further analysis into
  computational applications such as ANSYS and
  MATLAB
• Multiple Chord Plot Analyses
• Draw chord lines across phase images at any angle
• Plot multiple displacement lines on a single
  graph
• Create and save/load multiple chord sets

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Surface Analysis Burn masks into phase image
measurement data
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Surface Analysis User-defined chords for 2D plot
generation
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Surface Analysis

• Advanced 3D Rendering
• View up to 1.4 million displacement data points
  on each graph
• 4X the detail of previous graphical renderings
  previously hidden surface features are now
  visible
• Zoom, rotate, crop and export 3D displacement
  graphs in multiple formats
• Powerful Batch Processing
• Apply masks, filters, chords, rotation and other
  operations to hundreds of phase data sets
• Multiple output and export options for graphical
  and analytical analyses

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Surface Analysis 3rd Order Polynomial Fit of
Data
Original phase image
Data Subtraction Result
3rd Order Polynomial Fit
LSF Data Rotation
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Surface Analysis - batch processing interface
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Micro Fringe Projection (MP10) Module
Specifications

• One 1.4MP Firewire Camera
• Accuracy ? 3.0 of measured value or ? 2.5um,
  whichever is greater
• Repeatability ? 2.5um
• Data acquisition time of less than 3 seconds
• Field of View 17 mm x 13 mm
• Maximum Sample Size 400 mm x 400 mm
• Minimum Sample Size 0.5 mm x 0.5 mm
• Grating Pitch 168um

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Micro Fringe Projection (MP10) Module installed
in the TherMoiré AXP
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Micro Fringe Projections(MP10) 4 x 4 mm PCB BGA
site displacement graph
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Digital Image Correlation Overview
Image 1
Image 0
Sample
Camera 0
Camera 1
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Digital Image Correlation Specifications

• 2 x 1.4MP Firewire Cameras 2 x 23mm fixed zoom
  lenses
• Data acquisition time of less than 1 second
• In-Plane Resolution 0.5 - 1.0 µm (100
  microstrain)
• Out-of-Plane Resolution 1.0 - 2.0 µm
• Temperature Range 26C to 300C
• Field of Views 45 mm x 34 mm, 66 mm x 48 mm, 88
  mm x 66 mm

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DIC Module installed in the TherMoiré AXP
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Digital Image Correlation Results 30 mm BGA
strain measurement at 250 C relative to RT
X Strain
Y Strain
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Digital Image Correlation Results (BGA Z axis
displacement examples)
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Convective Module Specifications

• Optional 200 mm X 200 mm CM200 module fits
  inside the AXP
• Heats and cools from -55 C to 300 C
• Automatically controlled by Studio Surface
  Measurement
• Adjustable heating, cooling and airflow rates
• Heating rates gt 1.25 C per second

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Convective Module enclosure installed in the AXP
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TherMoiré AXP